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1. 发明授权

US06632344B1 Conductive oxide coating process 失效
标题翻译：导电氧化物涂层工艺
公开(公告)号：US06632344B1
公开(公告)日：2003-10-14
申请号：US09535302
申请日：2000-03-24
申请人： Robert L. Goldberg , Michael Gulla
发明人： Robert L. Goldberg , Michael Gulla
IPC分类号： C25D554
CPC分类号： C25D5/54 , C25D5/02 , C25D5/56 , H05K3/0055 , H05K3/424
摘要： The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.
摘要翻译：本发明涉及一种用于在印刷电路板衬底内电镀非导电表面（例如通孔壁）的方法。该方法包括在衬底上形成导电氧化物涂层，优选通过将所述衬底浸入水性氧化脱粘剂溶液中足以形成含有导电介电氧化残余物的涂层的时间，然后在不存在形成在残留物涂层上的额外的导电涂层或去除涂层，通过将具有涂层的基底浸入电镀溶液中将金属电镀到所述表面上。

2. 发明授权

US5262041A Additive plating process 失效
标题翻译：添加电镀工艺
公开(公告)号：US5262041A
公开(公告)日：1993-11-16
申请号：US989377
申请日：1992-12-11
申请人： Michael Gulla
发明人： Michael Gulla
IPC分类号： C25D5/02 , H05K3/10 , H05K3/18 , H05K3/42
CPC分类号： H05K3/188 , C25D5/022 , H05K3/108 , H05K2201/0323 , H05K2201/0329 , H05K3/424 , H05K3/426 , Y10S428/901 , Y10T428/24917
摘要： A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.
摘要翻译：一种用于在非导电衬底上电镀的方法，包括以下步骤：在所述衬底上施加表面电阻不超过100兆欧姆的非金属导电涂层的薄膜，在所述导电涂层上施加不导电涂层，所述非导电涂层具有成像凹槽，并将金属电镀到所述凹槽中。该方法对印刷电路板的制造特别有用。

3. 发明授权

US5213917A Plasma processing with metal mask integration 失效
标题翻译：等离子处理与金属掩模集成
公开(公告)号：US5213917A
公开(公告)日：1993-05-25
申请号：US648890
申请日：1991-01-31
申请人： Michael Gulla , Prasit Sricharoenchaikit
发明人： Michael Gulla , Prasit Sricharoenchaikit
IPC分类号： G03F7/26 , G03F7/40 , H05K3/18
CPC分类号： G03F7/265 , G03F7/40 , H05K3/185
摘要： This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaining photoresist coating unprotected by the metal mask.
摘要翻译：本发明描述了使用包括在光致抗蚀剂涂层上形成金属掩模的微光刻工艺来改变细线图像图案中的衬底的方法，以在其干燥显影期间保护光致抗蚀剂涂层。本发明还描述了形成金属掩模的方法。简要说明，本发明的方法包括以下步骤：用光致抗蚀剂涂层涂覆基材，将所形成的光致抗蚀剂涂层暴露于期望的光化辐射图形，用化学镀催化剂催化光刻胶涂层的整个表面，光致抗蚀剂层至少足以去除图案图案中的不需要的催化剂层的深度，在期望的（剩余的）催化剂层上形成金属图案，并干燥显影未被金属掩模保护的剩余的光致抗蚀剂涂层。

4. 发明授权

US4810333A Electroplating process 失效
标题翻译：电镀工艺
公开(公告)号：US4810333A
公开(公告)日：1989-03-07
申请号：US132175
申请日：1987-12-14
申请人： Michael Gulla , Donald F. Foust , George K. Philipose
发明人： Michael Gulla , Donald F. Foust , George K. Philipose
IPC分类号： C25D5/56 , C25D5/54 , C25D7/00 , H05K3/18 , H05K3/42 , C25D5/02
CPC分类号： C25D5/54 , H05K3/188 , H05K3/424 , H05K2203/0716 , H05K3/427 , Y10S205/92
摘要： A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

5. 发明授权

US4551409A Photoresist composition of cocondensed naphthol and phenol with formaldehyde in admixture with positive o-quinone diazide or negative azide 失效
标题翻译：共聚萘酚和苯酚与甲醛与正邻醌二叠氮化物或负叠氮化物混合的光致抗蚀剂组合物
公开(公告)号：US4551409A
公开(公告)日：1985-11-05
申请号：US549286
申请日：1983-11-07
申请人： Michael Gulla , Paul Taylor , Michael J. Oddi
发明人： Michael Gulla , Paul Taylor , Michael J. Oddi
IPC分类号： C08G8/04 , C08L61/06 , G03F7/023 , G03C1/60 , G03C1/71 , G03F7/26
CPC分类号： G03F7/0236 , C08G8/04 , C08L61/06
摘要： A photoresist composition comprising a sensitizer in a binder that is a naphthol polymer alone or mixed with another compatible resin such as a novolak resin or a polyvinyl phenol. The use of the naphthol resin as a portion of the binder increases the heat distortion temperature of the photoresist composition.
摘要翻译：一种光致抗蚀剂组合物，其包含单独的萘酚聚合物的粘合剂中的敏化剂或与酚醛清漆树脂或聚乙烯基苯酚等其它相容性树脂混合的光敏性组合物。使用萘酚树脂作为粘合剂的一部分增加了光致抗蚀剂组合物的热变形温度。

6. 发明授权

US4130454A Etchant and process of etching with the same 失效
标题翻译：蚀刻和蚀刻过程相同
公开(公告)号：US4130454A
公开(公告)日：1978-12-19
申请号：US822002
申请日：1977-09-30
申请人： Oleh B. Dutkewych , Charles A. Gaputis , Michael Gulla , Leonard R. Levy
发明人： Oleh B. Dutkewych , Charles A. Gaputis , Michael Gulla , Leonard R. Levy
IPC分类号： H05K3/06 , C23F1/16 , C23F1/18 , C23F1/02
CPC分类号： C23F1/16 , C23F1/18
摘要： This invention is directed to an etchant and to a process for its use. The etchant comprises a synergistic combination of hydrogen peroxide and molybdenum as oxidants in acidic solution. The combination of oxidants provides for sustained etching at an exalted rate. The etchant is useful for etching metals, especially copper and its alloys, and is particularly useful in the manufacture of printed circuit boards.
摘要翻译：本发明涉及一种蚀刻剂及其使用方法。蚀刻剂包括作为氧化剂在酸性溶液中的过氧化氢和钼的协同组合。氧化剂的组合提供以高达率的持续蚀刻。蚀刻剂对于蚀刻金属，特别是铜及其合金是有用的，并且在印刷电路板的制造中特别有用。

7. 发明授权

US4085066A Catalyst composition and method of preparation 失效
标题翻译：催化剂组成及制备方法
公开(公告)号：US4085066A
公开(公告)日：1978-04-18
申请号：US741378
申请日：1976-11-12
申请人： Michael Gulla
发明人： Michael Gulla
IPC分类号： B01J27/135 , B01J23/48 , B01J23/62 , C23C18/28 , B01J27/08 , B01J27/10
CPC分类号： C23C18/28
摘要： This invention relates to dry colloidal catalyst compositions of catalytic metals and to methods for formation of said dry compositions. The dry catalysts, upon dispersion in an aqueous acid solution of pH below 1, are used to render surfaces receptive to the deposition of an electroless metal. The liquid catalyst compositions, from which the dry compositions are formed, are those acidic compositions of U.S. Pat. No. 3,011,920.
摘要翻译：本发明涉及催化金属的干胶体催化剂组合物和形成所述干组合物的方法。干燥催化剂在pH低于1的酸性水溶液中分散时，用于使表面接受无电金属沉积。形成干组合物的液体催化剂组合物是美国专利No. 第3,011,920号。

8. 发明授权

US3947143A Printed circuit drill 失效
标题翻译：打印电路钻
公开(公告)号：US3947143A
公开(公告)日：1976-03-30
申请号：US488275
申请日：1974-07-15
申请人： Michael Gulla
发明人： Michael Gulla
IPC分类号： B23B31/00 , B23B51/02
CPC分类号： B23B51/02 , B23B31/005 , B23B2231/026 , B23B2251/14 , B23B2260/072 , Y10T408/907 , Y10T408/9097
摘要： A twist drill comprising a bit containing spirally arranged grooves and lands of substantially equal width, with a shank at one end and a pointed tip at the other, the leading edges of the grooves being inclined to the axis of the bit and constituting cutting edges and the lands rearwardly of the cutting edges being relieved, characterized in that there are auxiliary rectilinearly arranged axially spaced cutting edges parallel to the axis of the bit formed by straight line channels spaced peripherally about the axis of the bit but of lesser depth than the spirally arranged grooves.

9. 发明授权

US5389496A Processes and compositions for electroless metallization 失效
标题翻译：无电镀金属化的工艺和组成
公开(公告)号：US5389496A
公开(公告)日：1995-02-14
申请号：US62706
申请日：1993-05-17
申请人： Jeffrey M. Calvert , Walter J. Dressick , Gary S. Calabrese , Michael Gulla
发明人： Jeffrey M. Calvert , Walter J. Dressick , Gary S. Calabrese , Michael Gulla
IPC分类号： B05D1/18 , C09D4/00 , C12N5/00 , C23C18/16 , C23C18/20 , C23C18/28 , C40B60/14 , G03F7/004 , G06N3/00 , G06N99/00 , H01L21/288 , H05K3/18 , G03C5/00
CPC分类号： G06N99/007 , B05D1/185 , B82Y10/00 , B82Y30/00 , B82Y40/00 , B82Y5/00 , C09D4/00 , C12N5/0068 , C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/1893 , C23C18/2086 , C23C18/28 , C23C18/30 , C23C18/31 , G03F7/004 , G06N3/002 , H01L21/288 , H01L21/2885 , H05K3/185 , B01J2219/00432 , B01J2219/00603 , B01J2219/00605 , B01J2219/00612 , B01J2219/00617 , B01J2219/00626 , B01J2219/00637 , B01J2219/00659 , B01J2219/00711 , C12N2535/10 , C40B60/14 , Y10T428/24917 , Y10T428/31536
摘要： Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.
摘要翻译：无电镀金属化的方法和组成。在一个方面，本发明的特征在于使用能够与无电金属化催化剂连接的化学基团，包括使用化学结合到基底上的连接基团。在优选的方面，本发明提供了一种用于选择性金属化而不使用常规光致抗蚀剂图案化顺序的装置，使得能够以直接且方便的方式制造高分辨率金属图案。

10. 发明授权

US5053318A Plasma processing with metal mask integration 失效
标题翻译：具有金属掩模积分的等离子体处理
公开(公告)号：US5053318A
公开(公告)日：1991-10-01
申请号：US353770
申请日：1989-05-18
申请人： Michael Gulla , Prasit Sricharoenchaikit
发明人： Michael Gulla , Prasit Sricharoenchaikit
IPC分类号： G03F1/08 , C23C18/20 , C23C18/30 , C23F1/00 , C23F4/00 , G03F7/26 , G03F7/40 , H01L21/027 , H05K3/18
CPC分类号： H05K3/185 , G03F7/265 , G03F7/40
摘要： This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaining photoresist coating unprotected by the metal mask.

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