专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5309632A Process for producing printed wiring board 失效
标题翻译：印刷线路板生产工艺
公开(公告)号：US5309632A
公开(公告)日：1994-05-10
申请号：US970925
申请日：1992-11-02
申请人： Hiroshi Takahashi , Shin Takanezawa , Masao Kanno , Yorio Iwasaki , Toshirou Okamura , Akishi Nakaso , Kiyoshi Hasegawa
发明人： Hiroshi Takahashi , Shin Takanezawa , Masao Kanno , Yorio Iwasaki , Toshirou Okamura , Akishi Nakaso , Kiyoshi Hasegawa
IPC分类号： H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42 , H01K3/10
CPC分类号： H05K3/181 , H05K3/184 , H05K3/426 , H05K1/0373 , H05K2201/0236 , H05K2201/0344 , H05K2203/0709 , H05K2203/1407 , H05K2203/1415 , H05K3/387 , Y10T29/49155 , Y10T29/49165
摘要： A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.
摘要翻译：一种印刷电路板的制造方法，其特征在于，通过无电解电镀形成镍层，通过无电镀形成在其上的铜层，或者通过化学镀在镍层之前形成铜底涂层，可以制造出耐电解质优异的印刷电路板腐蚀，适合高密度安装。

2. 发明授权

US4216246A Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards 失效
标题翻译：提高绝缘基板与无电镀金属镀层之间的附着力的方法以及制造添加剂印刷电路板的方法
公开(公告)号：US4216246A
公开(公告)日：1980-08-05
申请号：US905398
申请日：1978-05-12
申请人： Yorio Iwasaki , Toshiro Okamura , Akishi Nakaso , Nobuo Uozu , Hiroshi Takahashi
发明人： Yorio Iwasaki , Toshiro Okamura , Akishi Nakaso , Nobuo Uozu , Hiroshi Takahashi
IPC分类号： C23C18/16 , C23C18/20 , H05K3/18 , H05K3/38 , B05D3/06
CPC分类号： H05K3/387 , C23C18/1605 , C23C18/1608 , C23C18/1612 , C23C18/2086 , H05K2201/0133 , H05K2201/0212 , H05K2203/0773 , H05K3/181
摘要： A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.
摘要翻译：通过形成包含（A）橡胶材料的新型粘合剂层和（B）按照式20所定义的比例存在的热固性树脂，改善基材表面和无电镀在其上的金属沉积物之间的粘附性的方法

3. 发明授权

US5689879A Metal foil for printed wiring board and production thereof 失效
标题翻译：印刷电路板用金属箔及其制造
公开(公告)号：US5689879A
公开(公告)日：1997-11-25
申请号：US357734
申请日：1994-12-16
申请人： Naoyuki Urasaki , Kouichi Tsuyama , Kiyoshi Hasegawa , Shuichi Hatakeyama , Akinari Kida , Akishi Nakaso , Hiroshi Nomura
发明人： Naoyuki Urasaki , Kouichi Tsuyama , Kiyoshi Hasegawa , Shuichi Hatakeyama , Akinari Kida , Akishi Nakaso , Hiroshi Nomura
IPC分类号： H05K3/02 , H05K3/06 , H05K3/38
CPC分类号： H05K3/025 , H05K3/062 , H05K2203/0152 , H05K2203/0307 , H05K2203/0376 , H05K2203/0384 , H05K2203/0723 , H05K2203/0726 , H05K3/383 , Y10S428/935 , Y10T29/49155 , Y10T428/12438 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.
摘要翻译：一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层，第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

4. 发明授权

US5403672A Metal foil for printed wiring board and production thereof 失效
标题翻译：印刷电路板用金属箔及其制造
公开(公告)号：US5403672A
公开(公告)日：1995-04-04
申请号：US59658
申请日：1993-05-12
申请人： Naoyuki Urasaki , Kouichi Tsuyama , Kiyoshi Hasegawa , Shuichi Hatakeyama , Akinari Kida , Akishi Nakaso , Hiroshi Nomura
发明人： Naoyuki Urasaki , Kouichi Tsuyama , Kiyoshi Hasegawa , Shuichi Hatakeyama , Akinari Kida , Akishi Nakaso , Hiroshi Nomura
IPC分类号： H05K3/02 , H05K3/06 , H05K3/38 , B32B15/20 , B32B3/30
CPC分类号： H05K3/025 , H05K3/062 , H05K2203/0152 , H05K2203/0307 , H05K2203/0376 , H05K2203/0384 , H05K2203/0723 , H05K2203/0726 , H05K3/383 , Y10S428/935 , Y10T29/49155 , Y10T428/12438 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.
摘要翻译：一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层，第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

5. 发明申请

US20080010819A1 CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：连接板和多层接线板，用于半导体封装的基板和使用连接板的半导体封装及其制造方法
公开(公告)号：US20080010819A1
公开(公告)日：2008-01-17
申请号：US11775294
申请日：2007-07-10
申请人： Hidehiro NAKAMURA , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
发明人： Hidehiro NAKAMURA , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
IPC分类号： H05K3/30
CPC分类号： H05K3/4617 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/0097 , H05K3/06 , H05K3/244 , H05K3/4038 , H05K3/4623 , H05K3/4632 , H05K3/4647 , H05K2201/0141 , H05K2201/0195 , H05K2201/0355 , H05K2201/0361 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/0384 , H05K2203/0733 , H05K2203/1536 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
摘要翻译：本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体，连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

6. 发明授权

US06207266B1 Electromagnetically shielding bonding film 失效
标题翻译：电磁屏蔽接合膜
公开(公告)号：US06207266B1
公开(公告)日：2001-03-27
申请号：US08975649
申请日：1997-11-21
申请人： Hisashige Kanbara , Akishi Nakaso , Minoru Tosaka
发明人： Hisashige Kanbara , Akishi Nakaso , Minoru Tosaka
IPC分类号： H05K900
CPC分类号： H05K9/0096 , H01J29/868 , Y10T428/25 , Y10T428/256
摘要： Provided is bonding film in the form of web which has a high electromagnetic shielding effect for electromagnetic radiation from the front surface of a display device, and other favorable properties such as an infrared blocking property, a transparency, a invisibility and a favorable bonding property. The bonding film typically includes base film, a geometrically patterned electroconductive layer placed over the base film so as to achieve an aperture ratio of 80% of more, and a bonding layer for attaching the assembly to an object. The film may be applied to the surface of a transparent sheet member for the convenience of handling, and such an assembly has a symmetric structure so that the warping of the assembly may be minimized. The bonding film may be interposed between a pair transparent base sheets, or the bonding film may be applied over two sides a transparent base sheet. The assembly may further include an infrared blocking layer and an anti-glare layer.
摘要翻译：提供了对从显示装置的前表面进行电磁辐射具有高电磁屏蔽效果的卷材形式的接合膜以及诸如红外线阻挡性，透明性，不可见性和良好的粘合性等的其它有利特性。接合膜通常包括基膜，放置在基膜上的几何图案化的导电层，以达到80％以上的孔径比，以及用于将组件附接到物体的粘合层。为了便于操作，膜可以施加到透明片材的表面，并且这种组件具有对称结构，使得组件的翘曲可以最小化。接合膜可以插入在一对透明基片之间，或者接合膜可以在两侧涂覆有透明基片。组件还可以包括红外阻挡层和防眩层。

7. 发明授权

US06197149B1 Production of insulating varnishes and multilayer printed circuit boards using these varnishes 失效
标题翻译：使用这些清漆生产绝缘清漆和多层印刷电路板
公开(公告)号：US06197149B1
公开(公告)日：2001-03-06
申请号：US09057522
申请日：1998-04-09
申请人： Kazuhito Kobayashi , Yasushi Kumashiro , Atsushi Takahashi , Koji Morita , Takahiro Tanabe , Kazunori Yamamoto , Akishi Nakaso , Shigeharu Arike , Kazuhisa Otsuka , Naoyuki Urasaki , Daisuke Fujimoto , Nozomu Takano
发明人： Kazuhito Kobayashi , Yasushi Kumashiro , Atsushi Takahashi , Koji Morita , Takahiro Tanabe , Kazunori Yamamoto , Akishi Nakaso , Shigeharu Arike , Kazuhisa Otsuka , Naoyuki Urasaki , Daisuke Fujimoto , Nozomu Takano
IPC分类号： C09J500
CPC分类号： H05K3/4655 , C09D5/00 , H05K1/0373 , H05K3/4652 , H05K2201/0209 , H05K2201/0239 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , Y10T428/24994 , Y10T428/249944 , Y10T428/249946 , Y10T428/249952
摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.
摘要翻译：一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。

8. 发明授权

US5690837A Process for producing multilayer printed circuit board 失效
标题翻译：多层印刷电路板生产工艺
公开(公告)号：US5690837A
公开(公告)日：1997-11-25
申请号：US576488
申请日：1995-12-21
申请人： Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
发明人： Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
IPC分类号： H05K3/00 , H05K3/02 , H05K3/38 , H05K3/46 , B44C1/22 , C23F1/00
CPC分类号： H05K3/4652 , H05K3/0055 , H05K2201/0209 , H05K2203/063 , H05K2203/0773 , H05K2203/0789 , H05K2203/0793 , H05K2203/0796 , H05K3/025 , H05K3/381
摘要： In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.
摘要翻译：在制造多层印刷电路板的方法中，该多层印刷电路板包括至少包含铜箔和绝缘半固化粘合剂层的复合膜材料中的通孔钻孔，将所得薄膜材料层叠在内层电路基板上，电连接具有外层铜箔的内层电路当流入孔中的粘合剂树脂被粗糙化时，或者当使用形成在载体上的具有小于12μm厚的铜箔的复合膜材料或特殊的缓冲材料进一步层压在内层电路基板和膜材料的层压体上，提高了电连接的可靠性，并且通过简单的步骤可以提高电路密度。

9. 发明授权

US5254156A Aqueous solution for activation accelerating treatment 失效
标题翻译：活化加速处理水溶液
公开(公告)号：US5254156A
公开(公告)日：1993-10-19
申请号：US978405
申请日：1992-11-18
申请人： Akishi Nakaso , Kaoru Oginuma , Takeshi Shimazaki , Akio Takahashi
发明人： Akishi Nakaso , Kaoru Oginuma , Takeshi Shimazaki , Akio Takahashi
IPC分类号： C23C18/28 , H05K3/38 , H05K3/42 , C23C18/18
CPC分类号： H05K3/422 , C23C18/28 , H05K2203/122 , H05K3/383 , H05K3/427
摘要： An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive strength between a copper foil and an electrolessly plated copper.
摘要翻译：包含硫酸，氯化铜，如果需要的话，有机酸的水溶液作为用于化学镀的活化促进处理是有效的，用于改善通孔中的无电镀和改善铜箔和无电镀铜之间的粘合强度。

10. 发明申请

US20090274581A1 MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20090274581A1
公开(公告)日：2009-11-05
申请号：US12501056
申请日：2009-07-10
申请人： Hiroshi Kawazoe , Akishi Nakaso , Shigeharu Arike
发明人： Hiroshi Kawazoe , Akishi Nakaso , Shigeharu Arike
IPC分类号： B01L3/00
CPC分类号： B01L3/502707 , B01J19/0093 , B01J2219/00783 , B01J2219/00788 , B01J2219/00822 , B01J2219/00833 , B01J2219/0086 , B01J2219/00869 , B01L2200/12 , B01L2300/0816 , B01L2300/0838 , B01L2300/0874 , B01L2300/0887 , B01L2400/0481 , B01L2400/0655 , B81B2201/051 , B81C1/00119 , B81C2201/019 , B81C2203/032 , Y10T156/10
摘要： A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式