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1. 发明申请

US20180327918A1 Electrode material 审中-公开
公开(公告)号：US20180327918A1
公开(公告)日：2018-11-15
申请号：US15777523
申请日：2016-11-02
申请人： INL - International lberian Nanotechnology Laboratory
发明人： Xiaoguang WANG , Lifeng LIU
IPC分类号： C25B11/04 , C25B1/04 , C25B11/03 , C25D3/12 , C25D5/48 , C25D5/54 , C25D7/00 , C23C14/00
CPC分类号： C25B11/0405 , C23C14/0021 , C25B1/04 , C25B11/035 , C25B11/0415 , C25B11/0447 , C25D3/12 , C25D5/48 , C25D5/54 , C25D7/00 , Y02E60/366
摘要： A system which includes two electrodes for use as cathode and anode, respectively, can perform water electrolysis. Each of the two electrodes includes a self-supporting electrode material containing a porous core material and a coating material. The porous core material includes carbon, and the coating material contains a transition metal phosphide. The two electrodes include identical electrode material, and each of the electrodes contains a connector to connect to a power source.

2. 发明申请

US20180065146A1 3D GLASS CANDLE LAMP AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20180065146A1
公开(公告)日：2018-03-08
申请号：US15284353
申请日：2016-10-03
申请人： DONGGUAN ESTIN HOME PRODUCTS CO. LTD
发明人： Shibo LIU
IPC分类号： B05D3/06 , F21S6/00 , F21S9/02 , F21S10/04 , F21V23/04 , F21V23/00 , F21V3/04 , C25D3/04 , C25D5/54 , C25D21/04 , C25D3/46 , B05D1/02 , B05D7/00
CPC分类号： B05D3/06 , B05D1/02 , B05D5/06 , B05D7/54 , B05D2203/35 , B05D2254/06 , B05D2350/65 , B44C1/228 , B44F1/00 , C25D3/04 , C25D3/46 , C25D5/54 , C25D21/04 , F21S6/001 , F21S9/02 , F21S10/04 , F21V3/061 , F21V23/003 , F21V23/0435 , F21W2121/00 , F21Y2115/10
摘要： The present invention relates to a production technique of a 3D glass candle lamp. Transparent glass is processed, the interior of the glass is formed by a laser method, and by conducting electroplating and color plating on the inner surface and the outer surface of the glass correspondingly, under the condition that a light source of the glass lamp is available, light is reflected by the inner electroplated layer and the outer electroplated layer, and thus clearly-layered 3D patterns are formed at the positions of laser patterns; in addition, the colors of the patterns can change along with plating colors and the color of the light source, and the scene illumination effect is additionally achieved.

3. 发明申请

US20180006290A1 RETICULATED ELECTRODE STRUCTURE AND METHOD OF MAKING THE SAME 审中-公开
公开(公告)号：US20180006290A1
公开(公告)日：2018-01-04
申请号：US15197561
申请日：2016-06-29
申请人： Alvin Snaper , Jonathan Jan
发明人： Alvin Snaper , Jonathan Jan
IPC分类号： H01M4/04 , C25D5/54 , C25D5/50 , C23C18/31 , C25D3/46 , C25D3/44 , C25D3/38 , C25D3/22 , C25D5/20 , C25D3/48 , H01M4/02
CPC分类号： H01M4/0404 , C23C18/31 , C25D3/22 , C25D3/38 , C25D3/44 , C25D3/46 , C25D3/48 , C25D5/20 , C25D5/50 , C25D5/54 , H01M4/04 , H01M4/0452 , H01M4/0471 , H01M4/663 , H01M4/667 , H01M4/80 , H01M2004/021
摘要： A method of forming an electrode in an electrochemical battery comprises: coating a reticulated substrate with a conductive material; curing the reticulated substrate coated with the conductive material; and electroplating the reticulated substrate coated with the conductive material with a desired metal material.

4. 发明申请

US20170231328A1 CARBORUNDUM WEAR-RESISTANT SHOE SPIKE AND PREPARATION METHOD THEREOF 审中-公开
公开(公告)号：US20170231328A1
公开(公告)日：2017-08-17
申请号：US14907136
申请日：2015-08-31
申请人： DONGGUAN SHING HING METAL MANUFACTURING CO., LTD.
发明人： Jinxiong TANG , Qianhong PENG
IPC分类号： A43C15/00 , C25D21/08 , C25D5/14 , C25D15/00 , A43B5/00 , C25D3/12
CPC分类号： A43C15/00 , A43B5/00 , A43C15/16 , C25D3/12 , C25D5/14 , C25D5/48 , C25D5/54 , C25D11/38 , C25D15/00 , C25D21/08
摘要： The present invention belongs to the technical field of shoe spikes, and more particularly relates to a carborundum wear-resistant shoe spike. The carborundum wear-resistant shoe spike comprises a shoe spike main body and a nickel coating attached to the surface of the shoe spike main body; the surface of the shoe spike main body is also provided with a carborundum layer, and the nickel coating is disposed between the shoe spike main body and the carborundum layer. Compared with the prior art, the present invention lies in that the outer surface of the nickel coating is provided with the carborundum layer, and since the carborundum layer has the characteristics of good toughness, high hardness, good wear resistance and the like, the wear resistance property of the shoe spike can be greatly improved, and the service life of sports shoes using the shoe spike is prolonged.

5. 发明申请

US20170223828A1 SYSTEM AND METHOD OF FORMING ELECTRICAL INTERCONNECTS 审中-公开
公开(公告)号：US20170223828A1
公开(公告)日：2017-08-03
申请号：US15014096
申请日：2016-02-03
申请人： THE BOEING COMPANY
发明人： Minas H. Tanielian
IPC分类号： H05K1/09 , H05K3/16 , C25D5/54 , H05K3/18 , C23C14/34 , H05K1/02 , H05K3/14
CPC分类号： H05K1/09 , C23C14/18 , C23C28/322 , C23C28/34 , C23C28/42 , C25D5/54 , H01B1/04 , H01B1/24 , H05K1/097 , H05K2201/0245 , H05K2201/0323 , H05K2201/0338 , H05K2201/0379
摘要： A method of forming a high-conductivity electrical interconnect on a substrate may include forming a graphene film with a plurality of graphene members, depositing a metal over the graphene film, and providing a metallic overlay that connects the plurality of graphene members together through the depositing operation to form a covered graphene film.

6. 发明申请

US20170179464A1 METHOD FOR PASSIVE METAL ACTIVATION AND USES THEREOF 审中-公开
公开(公告)号：US20170179464A1
公开(公告)日：2017-06-22
申请号：US15300359
申请日：2015-03-31
申请人： Technion Research & Development Foundation Limited
发明人： Yair EIN-ELI , Danny GELMAN , Boris SHVARTSEV , Alexander KRAYTSBERG
IPC分类号： H01M4/04 , H01M10/054 , C25D3/66 , H01M4/36 , H01M4/134 , H01M4/46 , H01M4/62
CPC分类号： H01M4/044 , B23K35/3605 , B23K35/383 , C25D3/665 , C25D5/34 , C25D5/54 , H01M4/134 , H01M4/1395 , H01M4/366 , H01M4/463 , H01M4/502 , H01M4/628 , H01M4/661 , H01M10/054 , H01M10/0569 , H01M12/08 , H01M2004/027 , H01M2300/0045 , Y02E60/128
摘要： Disclosed is a method for activating a surface of metals, such as self-passivated metals, and of metal-oxide dissolution, effected using a fluoroanion-containing composition. Also disclosed is an electrochemical cell utilizing an aluminum-containing anode material and a fluoroanion-containing electrolyte, characterized by high efficiency, low corrosion, and optionally mechanical or electrochemical rechargeability. Also disclosed is a process for fusing (welding, soldering etc.) a self-passivated metal at relatively low temperature and ambient atmosphere, and a method for electrodepositing a metal on a self-passivated metal using metal-oxide source.

7. 发明申请

US20170103932A1 SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULATED STACKED-SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20170103932A1
公开(公告)日：2017-04-13
申请号：US15126172
申请日：2015-03-12
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Katsuya TAKEMURA , Kyoko SOGA , Satoshi ASAI , Kazunori KONDO , Michihiro SUGO , Hideto KATO
IPC分类号： H01L23/12 , C23C14/34 , C23C14/58 , C25D3/60 , C25D7/12 , C25D5/02 , C25D5/54 , C25D5/48 , B23K1/00 , H01L21/02 , B29C70/88 , B29C70/78 , H01L23/498 , H01L23/31 , H01L25/065 , H01L21/48 , H01L21/56 , C23C14/04
CPC分类号： H01L23/12 , B23K1/0016 , B29C70/78 , B29C70/882 , B29K2063/00 , B29K2083/00 , B29K2105/20 , B29K2995/0005 , B29L2031/3493 , C23C14/042 , C23C14/34 , C23C14/58 , C25D3/60 , C25D5/022 , C25D5/48 , C25D5/505 , C25D5/54 , C25D7/00 , C25D7/123 , H01L21/02282 , H01L21/4857 , H01L21/563 , H01L21/568 , H01L23/3107 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/82 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73267 , H01L2224/82005 , H01L2224/92244 , H01L2225/06513 , H01L2225/06541 , H01L2225/1035 , H01L2225/1058 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , H01L2224/19 , H01L2224/83005
摘要： A semiconductor apparatus includes a semiconductor device, on-semiconductor-device metal pad and metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second layer. The metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second layer, penetrates the second layer from its upper surface, and is electrically connected to the through electrode at an lower surface of the second layer, and an under-semiconductor-device metal interconnect is between the first layer and the semiconductor device, and the under-semiconductor-device metal interconnect is electrically connected to the metal interconnect at the lower surface of the second layer.

8. 发明申请

US20160358747A1 CONDUCTIVE FILM AND METHOD OF MAKING SAME 有权
标题翻译：导电膜及其制造方法
公开(公告)号：US20160358747A1
公开(公告)日：2016-12-08
申请号：US15111866
申请日：2015-01-16
申请人： THE UNIVERSITY OF AKRON
发明人： Yu Zhu , Tianda He
IPC分类号： H01J37/32 , C23C18/31 , C23C16/44 , C23C14/18 , C25D5/54 , C23C14/58 , C25D3/38 , C25D5/50 , C25D5/48 , C23F1/00 , C23C14/20
CPC分类号： H01J37/32009 , C23C14/185 , C23C14/205 , C23C14/5806 , C23C14/5826 , C23C14/584 , C23C14/5873 , C23C16/44 , C23C18/31 , C23F1/00 , C23F1/02 , C25D3/38 , C25D5/48 , C25D5/50 , C25D5/54 , G02F1/13439 , G03F7/00 , G03F7/0002 , G03F7/42 , G03F7/427 , G06F3/041 , G06F3/045 , G06F2203/04102 , G06F2203/04103 , H01J2237/334 , H01L21/32134 , H01L21/32139 , H01L51/0023 , H01L51/442
摘要： A method for making a conductive film includes the steps of: depositing a conductive metal film on a substrate to form a metal-coated substrate; depositing a fiber pattern on the conductive metal film of the metal-coated substrate to form a masked substrate, the fiber pattern defining protected metal and exposed metal of the conductive metal film; removing the exposed metal from the conductive metal film of the masked substrate to form a protected conductive film; and removing the fiber pattern from the protected conductive film to expose the protected metal and provide a metal pattern on the substrate. An annealing step con be employed after depositing the fiber pattern to increase the surface area of contact between the fiber pattern and the conductive metal film.
摘要翻译：制造导电膜的方法包括以下步骤：在基底上沉积导电金属膜以形成金属涂覆的基底; 在金属涂覆的基板的导电金属膜上沉积纤维图案以形成掩模的基板，该纤维图案限定了被保护的金属和导电金属膜的暴露的金属; 从被掩模基板的导电金属膜上去除暴露的金属，形成受保护的导电膜; 以及从保护的导电膜去除纤维图案以暴露受保护的金属并在基底上提供金属图案。在沉积纤维图案之后，采用退火步骤以增加纤维图案和导电金属膜之间的接触表面积。

9. 发明申请

US20160345430A1 TRANSPARENT CONDUCTIVE FILMS WITH EMBEDDED METAL GRIDS 审中-公开
标题翻译：透明导电薄膜与嵌入金属网格
公开(公告)号：US20160345430A1
公开(公告)日：2016-11-24
申请号：US15097919
申请日：2016-04-13
申请人： Versitech Limited
发明人： Arshad Khan , Wendi Li
IPC分类号： H05K1/02 , C25D5/48 , H05K1/03 , C25D7/00 , H05K3/18 , H05K3/46 , C25D5/02 , C25D5/54
CPC分类号： C25D5/54 , C25D1/04 , C25D1/08 , C25D5/022 , C25D5/48 , G06F2203/04103 , G06F2203/04112
摘要： A transparent conductive film with a metal mesh embedded in a substrate and a method of fabrication thereof is provided. The metal mesh has a cap that is pressed and embedded in a substrate or a deformable material on a substrate, providing superior mechanical stability by mechanical interlocking. The embedding mechanism also provides superior chemical and environmental stability. A fabrication method is provided and includes a vacuum-free and low-cost process for large-volume manufacturing of the transparent conductive film with tunable performance.
摘要翻译：提供一种嵌入基板中的金属网状物的透明导电膜及其制造方法。金属网具有被压制并嵌入基板中的可变形材料的盖子，通过机械联锁提供优良的机械稳定性。嵌入机制还提供优异的化学和环境稳定性。提供了制造方法，并且包括用于大容量制造具有可调性能的透明导电膜的无真空和低成本的方法。

10. 发明申请

US20160341686A1 SIZE DEPENDENCE OF NANOPARTICLE-PROTEIN INTERACTION AND HIGH SENSITIVITY POTENTIOMETRIC SENSOR EXPLOITING SUCH INTERACTIONS 审中-公开
标题翻译：纳米尺度蛋白质相互作用的大小依赖性和高灵敏度电位传感器开发这种相互作用
公开(公告)号：US20160341686A1
公开(公告)日：2016-11-24
申请号：US15156648
申请日：2016-05-17
申请人： Kalle LEVON , Yanyan Wang
发明人： Kalle LEVON , Yanyan Wang
IPC分类号： G01N27/327 , C25D15/00 , C12Q1/00
CPC分类号： C12Q1/006 , B82Y30/00 , C12Q1/003 , C25D3/48 , C25D5/18 , C25D5/54 , G01N27/3278 , G01N2333/904
摘要： Fabrication of a high sensitivity potentiometric biosensor is described. The present inventors have developed and characterized a novel amplification platform using a gold nanoparticle (GNPs) electrodeposition method. The synthesized GNP sizes were found to be dependent of HAuCl4 concentration, media acid, scan cycles and scan rate. A systematic investigation into the adsorption of different sizes of proteins from aqueous electrolyte solution onto the electrodeposited GNPs surface by the potentiometric method was performed. Results suggest that the size of different proteins affect how they bond to different sizes of GNPs. This GNPs-based biosensor can retain the native-like structure of proteins, and successfully detect proteins at a high sensitivity level. The resulting glucose and immune biosensors also exhibit low detection limit and wide linear range. This improvement to potentiometric devices enables them to serve as highly sensitive detectors for biomolecules and provides a model that can be used to predict protein bonding on nanoparticles.
摘要翻译：描述了高灵敏度电位生物传感器的制造。本发明人已经开发并表征了一种使用金纳米颗粒（GNP）电沉积方法的新型扩增平台。发现合成的GNP大小取决于HAuCl4浓度，培养基酸，扫描周期和扫描速率。进行了通过电位法对电沉积的GNP表面吸附不同大小蛋白质的电解质溶液的系统研究。结果表明，不同蛋白质的大小影响它们如何结合不同大小的GNP。这种基于GNP的生物传感器可以保留蛋白质的天然样结构，并成功地检测高灵敏度水平的蛋白质。所得到的葡萄糖和免疫生物传感器也具有低的检测限和宽的线性范围。这种对电位器件的改进使其能够用作生物分子的高灵敏度检测器，并提供可用于预测纳米粒子上的蛋白质结合的模型。

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