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1. 发明授权

US10059852B2 Metal compound, method for preparing the same, selective metallization of surface of substrate with the metal compound 有权
公开(公告)号：US10059852B2
公开(公告)日：2018-08-28
申请号：US14242763
申请日：2014-04-01
申请人： SHENZHEN BYD AUTO R&D COMPANY LIMITED , BYD COMPANY LIMITED
发明人： Qing Gong , Wei Zhou , Bifeng Mao , Weifeng Miao
IPC分类号： C23C18/40 , H05K3/18 , C09D11/322 , C23C18/18 , C23C18/16 , C23C18/20 , C01G37/00 , C01G39/00 , C01G49/00 , C01G15/00 , C09D11/10 , B01J37/34 , B01J37/04 , B01J37/08 , B01J23/00 , B01J23/825 , B01J23/86 , B01J23/887 , B01J35/02 , B01J37/00 , B01J31/06
CPC分类号： C09D11/322 , B01J23/002 , B01J23/825 , B01J23/868 , B01J23/8874 , B01J23/8878 , B01J31/06 , B01J35/023 , B01J37/0036 , B01J37/04 , B01J37/08 , B01J37/349 , B01J2523/00 , C01G15/006 , C01G37/006 , C01G39/006 , C01G49/009 , C01P2004/61 , C01P2004/62 , C01P2006/60 , C01P2006/80 , C09D11/10 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/1651 , C23C18/1653 , C23C18/1879 , C23C18/204 , C23C18/206 , H05K3/182 , H05K3/185 , H05K2201/0236 , H05K2201/09118 , H05K2203/0709 , H05K2203/107 , H05K2203/1131 , H05K2203/125 , B01J2523/17 , B01J2523/31 , B01J2523/67 , B01J2523/32 , B01J2523/842 , B01J2523/33 , B01J2523/68
摘要： The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0

2. 发明申请

US20170175270A1 POLYMER PRODUCT AND METHOD FOR SELECTIVELY METALLIZING POLYMER SUBSTRATE 审中-公开
公开(公告)号：US20170175270A1
公开(公告)日：2017-06-22
申请号：US15447522
申请日：2017-03-02
申请人： BYD COMPANY LIMITED
发明人： WEI ZHOU , BIFENG MAO
IPC分类号： C23C18/16 , C23C18/40 , C23C18/18 , B01J37/08 , B01J35/00 , B01J35/02 , B01J37/00 , C23C18/20 , B01J23/20
CPC分类号： C23C18/1612 , B01J23/20 , B01J35/0013 , B01J35/026 , B01J37/0072 , B01J37/08 , C08K3/22 , C08K9/02 , C08K2003/2231 , C08L77/06 , C09D11/03 , C09D11/10 , C09D11/102 , C09D11/322 , C09D11/38 , C09D11/52 , C09D167/02 , C09D169/00 , C09D177/10 , C23C18/1608 , C23C18/1633 , C23C18/1641 , C23C18/1646 , C23C18/1653 , C23C18/1655 , C23C18/1893 , C23C18/20 , C23C18/204 , C23C18/2066 , C23C18/40 , C25D3/12 , H05K3/182 , H05K3/185 , H05K2201/0236 , H05K2203/0709 , H05K2203/107
摘要： A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about −5 to about 5, and a coordinate b value of about −5 to about 5 in a CIELab color space.

3. 发明申请

US20160329067A1 PLASMA TREATMENTS FOR FLEXURES OF HARD DISK DRIVES 审中-公开
标题翻译：硬盘驱动器的等离子体处理
公开(公告)号：US20160329067A1
公开(公告)日：2016-11-10
申请号：US15148034
申请日：2016-05-06
申请人： HUTCHINSON TECHNOLOGY INCORPORATED
发明人： Kurt F. Fischer , Alex W. Haas , Matthew J. Horner , Peter F. Ladwig , Carl C. Minton , Paul V. Pesavento , David D. Smahel , Christopher J. Sperl , Darrell C. Sydlo , Ritesh K. Tiwari , Kyle T. Tobias , Maryam O. Yusuf
IPC分类号： G11B5/48 , C23C18/16 , C25D5/34 , C25D3/38 , C25D5/02 , H01J37/32 , C25D7/00
CPC分类号： C25D5/34 , C23C18/1653 , C25D5/022 , C25D7/00 , C25D7/0614 , C25D7/0678 , G11B5/484 , G11B5/486 , H01J37/32403 , H01J37/32825 , H05K1/053 , H05K3/182 , H05K2203/0709 , H05K2203/095
摘要： Methods for producing flexible circuits can include creating treating a surface of the flexible circuit with at least one of an atmospheric plasma and a beam of ions. The atmospheric plasma is formed by directing a flow of gas between an electrode and the surface of the flexible circuit and generating a voltage between the electrode and the flexible circuit to create a plasma from the gas. A mean ion energy of the ions in the ion beam ranges from about 500 electron volts to about 1,500 electron volts.
摘要翻译：用于制造柔性电路的方法可以包括利用大气等离子体和离子束中的至少一种来产生处理柔性电路的表面。大气等离子体通过在电极和柔性电路的表面之间引导气体流而形成，并且在电极和柔性电路之间产生电压以从气体产生等离子体。离子束中离子的平均离子能量范围为约500电子伏特至约1500电子伏特。

4. 发明申请

US20160135297A1 VIA IN A PRINTED CIRCUIT BOARD 有权
标题翻译：通过印刷电路板
公开(公告)号：US20160135297A1
公开(公告)日：2016-05-12
申请号：US15001140
申请日：2016-01-19
申请人： SIERRA CIRCUITS, INC.
发明人： Konstantine Karavakis , Kenneth S. Bahl
IPC分类号： H05K1/11 , H05K3/42 , H05K1/09 , H05K3/00
CPC分类号： H05K3/387 , H05K3/427 , H05K2201/0221 , H05K2201/0236 , H05K2203/0709 , Y10T29/49167
摘要： A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.
摘要翻译：印刷电路板中的通孔由延伸穿过介电层压材料中的孔的图案化金属层组成。一层催化粘合剂涂在孔内的墙壁。图案化金属层放置在孔内的催化粘合剂上。

5. 发明申请

US20150188016A1 ELECTRIC CONDUCTIVE HEAT DISSIPATION SUBSTRATE 有权
标题翻译：导电散热基板
公开(公告)号：US20150188016A1
公开(公告)日：2015-07-02
申请号：US14287205
申请日：2014-05-27
申请人： Industrial Technology Research Institute
发明人： Cheng-Chuan Wang , Cheng-Chou Wong , Chia-Ying Yen , Hsin-Hwa Chen
IPC分类号： H01L33/64
CPC分类号： H01L33/641 , C23C28/00 , C23C28/30 , C23C28/32 , C23C28/321 , C23C28/322 , C23C28/324 , C23C28/34 , C23C30/00 , C23C30/005 , H01L23/00 , H01L33/62 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K3/185 , H05K3/188 , H05K2203/0709 , H05K2203/072 , H05K2203/0723 , Y10T428/12576 , Y10T428/12611 , Y10T428/12618 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/2495 , Y10T428/24959 , Y10T428/24967 , Y10T428/24975 , Y10T428/263 , Y10T428/264 , Y10T428/265 , H01L2924/00
摘要： An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.
摘要翻译：导电散热基板包括陶瓷基板和种子层，以及依次形成在其上的缓冲材料层和铜电路层。缓冲材料层具有陶瓷基板与铜电路层的热膨胀系数。此外，缓冲材料层由合金材料和陶瓷材料组成或由金属材料和陶瓷材料组成。

6. 发明申请

US20150156871A1 INK COMPOSITION AND CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：墨水组合物和电路板及其制造方法
公开(公告)号：US20150156871A1
公开(公告)日：2015-06-04
申请号：US14606777
申请日：2015-01-27
申请人： BYD COMPANY LIMITED
发明人： Haibin LI , Wen HU , Hongye LIN
IPC分类号： H05K1/09 , C09D11/52 , H05K3/12 , C09D167/00 , C09D133/00 , H05K1/02 , C09D163/00
CPC分类号： H01B1/22 , C09D11/037 , C09D11/104 , C09D11/52 , C09D133/00 , C09D163/00 , C09D167/00 , H05K1/0298 , H05K1/092 , H05K3/12 , H05K3/185 , H05K2201/032 , H05K2203/0709 , H05K2203/107
摘要： An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which the metal element of the modified metal compound is at least one selected from the group consisting of Zn, Cr, Co, Cu, Mn, Mo, and Ni.
摘要翻译：提供油墨组合物和电路板及其制造方法。油墨组合物包括：丙烯酸树脂; 环氧树脂; 聚酯树脂; 固化剂; 以及包含改性金属化合物的活性粉末，其中所述改性金属化合物的金属元素为选自Zn，Cr，Co，Cu，Mn，Mo和Ni中的至少一种。

7. 发明申请

US20150130069A1 Self-Aligned Capillarity-Assisted Microfabrication 有权
标题翻译：自对准毛细管辅助微加工
公开(公告)号：US20150130069A1
公开(公告)日：2015-05-14
申请号：US14538367
申请日：2014-11-11
申请人： REGENTS OF THE UNIVERSITY OF MINNESOTA
发明人： Ankit Mahajan , Carl Daniel Frisbie , Lorraine F. Francis
IPC分类号： H01L23/528 , H01L21/768
CPC分类号： H01L21/76834 , C23C18/1608 , C23C18/2006 , C23C18/30 , C23C18/405 , H01L21/4867 , H01L21/6835 , H01L21/76879 , H01L21/76882 , H01L27/1285 , H01L27/1292 , H01L29/0673 , H01L29/0676 , H01L29/78693 , H01L29/78696 , H01L31/0392 , H01L51/0005 , H01L51/0036 , H01L51/0037 , H01L51/0048 , H01L51/0545 , H05K1/162 , H05K1/167 , H05K3/107 , H05K3/1258 , H05K3/182 , H05K2201/09036 , H05K2203/0709
摘要： A manufacturing process, which we term Self-Aligned Capillarity-Assisted Lithography for manufacturing devices having nano-scale or micro-scale features, such as flexible electronic circuits, is described.
摘要翻译：描述了一种制造工艺，我们将其称为自对准毛细管辅助光刻技术用于制造具有纳米尺度或微尺度特征的器件，例如柔性电子电路。

8. 发明申请

US20150107474A1 HIGH RESOLUTION CONDUCTIVE PATTERNS HAVING LOW VARIANCE THROUGH OPTIMIZATION OF CATALYST CONCENTRATION 审中-公开
标题翻译：通过优化催化剂浓度具有低变化性的高分辨率导电图
公开(公告)号：US20150107474A1
公开(公告)日：2015-04-23
申请号：US14398657
申请日：2013-04-15
申请人： UNIPIXEL DISPLAYS, INC.
发明人： Ed S. Ramakrishnan
IPC分类号： C09D11/107 , C09D11/03 , C09D133/08 , B41F5/24
CPC分类号： C09D11/107 , B41F5/24 , C09D11/03 , C09D11/10 , C09D11/106 , C09D11/52 , C09D133/08 , H01B1/22 , H01Q1/364 , H01Q7/00 , H05K3/182 , H05K2203/0709 , H05K2203/121 , H05K2203/1545
摘要： An ink composition for flexographic printing having an acrylic polymer at a viscosity of 100 cps to 10,000 cps and an organometallic catalyst at a concentration of 1 wt % to 12 wt %.
摘要翻译：一种用于柔性版印刷的油墨组合物，其具有粘度为100cps至10,000cps的丙烯酸聚合物和浓度为1wt％至12wt％的有机金属催化剂。

9. 发明申请

US20150004375A1 PIXEL DEFINITION LAYER AND MANUFACTURING METHOD THEREOF, DISPLAY SUBSTRATE AND DISPLAY DEVICE 审中-公开
标题翻译：像素定义层及其制造方法，显示基板和显示设备
公开(公告)号：US20150004375A1
公开(公告)日：2015-01-01
申请号：US14345622
申请日：2013-12-09
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Wenjun Hou , Ze Liu
IPC分类号： H01L51/56 , H05K3/12
CPC分类号： H01L51/0014 , H01L27/3246 , H01L51/0005 , H01L51/56 , H05K3/185 , H05K2203/0709
摘要： A pixel circuit, driving method thereof, organic light-emitting display panel and display apparatus, comprise driving transistor, first storage capacitor, collecting unit, writing unit and light-emitting unit; the collecting unit is used for collecting the threshold voltage of the driving transistor and storing the threshold voltage into the first storage capacitor, under the control of the first scan signal; the writing unit is used for storing the data voltage inputted from the input terminal for the data voltage under the control of the second scan signal; and the light-emitting unit is used for emitting lights, driven by the data voltage and a voltage inputted from the input terminal for the controllable low voltage, under the control of the light-emitting control signal. Thus, the organic light-emitting device is not affected by the threshold voltage shift of the driving transistor, which may enhance the image uniformity of the organic light-emitting display panel effectively.
摘要翻译：像素电路，其驱动方法，有机发光显示面板和显示装置，包括驱动晶体管，第一存储电容器，收集单元，写入单元和发光单元; 收集单元用于在第一扫描信号的控制下收集驱动晶体管的阈值电压并将阈值电压存储到第一存储电容器中; 写入单元用于在第二扫描信号的控制下存储从数据电压输入端输入的数据电压; 并且发光单元用于在发光控制信号的控制下由数据电压和从输入端子输入的可控低电压的电压驱动的光。因此，有机发光器件不受驱动晶体管的阈值电压偏移的影响，这有效地提高了有机发光显示面板的图像均匀性。

10. 发明授权

US08801971B2 Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution 有权
标题翻译：铜导体膜及其制造方法，导电性基板及其制造方法，铜导体布线及其制造方法以及处理液
公开(公告)号：US08801971B2
公开(公告)日：2014-08-12
申请号：US12808768
申请日：2008-12-17
申请人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
发明人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
IPC分类号： H01B1/00 , H01B1/12 , C22C9/00 , C21B11/10 , B05D5/12 , B28B19/00 , B29B15/00 , C23C18/00 , C23C20/00 , C23C24/00 , C23C26/00 , C23C28/00 , C23C30/00 , H01C17/06 , H05K3/00 , B22F3/00 , B22F3/26 , B22F5/00 , B22F7/00 , C22C28/00 , C22C29/00 , B32B15/20
CPC分类号： H05K3/182 , C23C18/1601 , C23C18/1603 , C23C18/1633 , C23C18/1635 , C23C18/1637 , C23C18/1824 , C23C18/1872 , C23C18/30 , C23C18/40 , H01L24/29 , H01L2224/29 , H01L2224/2919 , H01L2224/29294 , H01L2224/29347 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/203 , H05K3/105 , H05K3/1241 , H05K2203/0315 , H05K2203/0709 , H05K2203/1157 , H05K2203/125 , Y10T428/12014 , Y10T428/12903 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/0002
摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.
摘要翻译：提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

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