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1. 发明授权

US09918389B2 Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts 有权
公开(公告)号：US09918389B2
公开(公告)日：2018-03-13
申请号：US14477855
申请日：2014-09-04
申请人： Rohm and Haas Electronic Materials LLC
发明人： Feng Liu , Maria Rzeznik
IPC分类号： C23C18/40 , H05K3/18 , C23C18/30 , C23C18/34 , C23C18/50 , C23C18/16 , B01J31/22
CPC分类号： H05K3/181 , B01J31/181 , B01J31/2295 , B01J2231/005 , B01J2531/824 , C23C18/1641 , C23C18/1658 , C23C18/166 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/34 , C23C18/38 , C23C18/40 , C23C18/50 , H05K3/422 , H05K2203/0709
摘要： Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.

2. 发明申请

US20170156216A9 ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRAZINE DERIVATIVE CONTAINING CATALYSTS 有权
公开(公告)号：US20170156216A9
公开(公告)日：2017-06-01
申请号：US14477855
申请日：2014-09-04
申请人： Rohm and Haas Electronic Materials LLC
发明人： Feng Liu , Maria Rzeznik
IPC分类号： H05K3/18 , C23C18/40 , B01J31/22 , C23C18/50 , C23C18/16 , C23C18/30 , C23C18/34
CPC分类号： H05K3/181 , B01J31/181 , B01J31/2295 , B01J2231/005 , B01J2531/824 , C23C18/1641 , C23C18/1658 , C23C18/166 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/34 , C23C18/38 , C23C18/40 , C23C18/50 , H05K3/422 , H05K2203/0709
摘要： Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.

3. 发明授权

US09551073B2 Method for depositing a first metallic layer onto non-conductive polymers 有权
标题翻译：将第一金属层沉积在非导电聚合物上的方法
公开(公告)号：US09551073B2
公开(公告)日：2017-01-24
申请号：US14765594
申请日：2014-01-15
申请人： Atotech Deutschland GmbH
发明人： Leonas Naruskevicius , Mykolas Baranauskas , Loreta Tamasiunaite Tamasauskaite , Ona Gyliene
IPC分类号： C23C18/24 , C23C18/22 , C23C18/30 , C23C18/32 , C09K13/04 , C23C18/16
CPC分类号： C23C18/24 , C09K13/04 , C23C18/166 , C23C18/168 , C23C18/22 , C23C18/30 , C23C18/32
摘要： The present invention relates to the etching, activation and deposition of a first metal or metal alloy layer onto non-conductive polymers. The non-conductive polymer is etched with an aqueous solution comprising 0.75 to 3.6 g/l permanganate ions in 60 to 80 vol.-% sulfuric acid, activating with a solution comprising a noble metal and depositing a first metal or metal alloy by immersion-type or electroless (autocatalytic) plating. The first metal or metal alloy layer obtained has a high adhesion on the non-conductive polymer and serves as a plating base for electroplating further metal and/or metal alloy layer(s) thereon.
摘要翻译：本发明涉及第一金属或金属合金层在非导电聚合物上的蚀刻，活化和沉积。用包含0.75至3.6g / l高锰酸盐离子的水溶液在60至80体积％的硫酸中蚀刻非导电聚合物，用包含贵金属的溶液活化并通过浸渍沉积第一金属或金属合金，类型或无电解（自动催化）电镀。所获得的第一金属或金属合金层对非导电聚合物具有高粘附性，并且用作在其上进一步电镀金属和/或金属合金层的电镀基底。

4. 发明申请

US20160253586A1 COUNTERFEIT PROOFING OF PLATED POLYMERS 审中-公开
标题翻译：涂料聚合物的防伪
公开(公告)号：US20160253586A1
公开(公告)日：2016-09-01
申请号：US14903926
申请日：2014-07-09
申请人： UNITED TECHNOLOGIES CORPORATION
发明人： Grant O. Cook , Wendell V. Twelves
IPC分类号： G06K19/077 , B32B27/28 , C25D5/06 , C23C18/32 , C23C28/02 , C23C18/16 , C23C18/30 , B32B27/08 , C25D5/54
CPC分类号： G06K19/07749 , B29C37/0025 , B29C64/106 , B29C64/124 , B29C64/153 , B29C70/42 , B29C70/54 , B29K2079/08 , B29K2105/0058 , B29K2105/12 , B29K2105/251 , B29K2105/253 , B29K2307/04 , B29K2309/08 , B29L2009/008 , B29L2031/082 , B32B27/08 , B32B27/281 , B32B2250/02 , B32B2255/10 , B32B2255/205 , B32B2262/101 , B32B2262/106 , B32B2603/00 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C23C18/1641 , C23C18/1653 , C23C18/1657 , C23C18/166 , C23C18/22 , C23C18/30 , C23C18/32 , C23C28/021 , C23C28/023 , C25D1/003 , C25D1/02 , C25D1/20 , C25D3/02 , C25D5/06 , C25D5/54 , C25D5/56 , C25D7/00 , C25D7/04 , C25D9/02 , C25D17/12 , G01B7/16 , G01D5/12 , G01N3/08 , G01N2203/026 , G01N2203/0268 , G01N2203/0298
摘要： Plated polymeric articles having anti-counterfeiting tags therein and method of making the same are disclosed. A plated polymeric article comprises a polymer shaped formed into a desired shape with an anti-counterfeiting tag incorporated therein. The plated polymeric article comprises a first metal plated onto the polymer and a second metal deposited onto the first metal. Alternatively, a plated polymeric article comprises a composite layup having first and second polymer layers with an anti-counterfeiting tag disposed between the layers. The plated polymeric article further comprises a first metal plated onto the polymer. Lastly, a method for fabricating a plated polymeric article is disclosed. A polymer is formed into a desired shape, the polymer having an anti-counterfeiting tag incorporated therein. The outer surface of the article is prepared to receive a catalyst and then is activated with the catalyst. A first metallic layer is then plated onto the outer surface.
摘要翻译：公开了具有防伪标签的镀覆的聚合物制品及其制造方法。镀覆的聚合物制品包括形成为期望形状的聚合物，其中结合有防伪标签。镀覆的聚合物制品包括镀在聚合物上的第一金属和沉积在第一金属上的第二金属。或者，镀覆的聚合物制品包括具有设置在层之间的防伪标签的第一和第二聚合物层的复合叠层。镀覆的聚合物制品还包括镀在聚合物上的第一金属。最后，公开了一种制造镀覆聚合物的方法。聚合物形成所需的形状，聚合物中含有防伪标签。制品的外表面准备接收催化剂，然后用催化剂活化。然后将第一金属层电镀到外表面上。

5. 发明申请

US20160160066A1 PROCESS FOR DEPOSITING METAL ON A SUBSTRATE 有权
标题翻译：在基材上沉积金属的工艺
公开(公告)号：US20160160066A1
公开(公告)日：2016-06-09
申请号：US14906670
申请日：2014-07-16
申请人： National Research Council of Canada
发明人： Zhiyi Zhang , Ye Tao , Hiroshi Fukutani , Gaozhi Xiao
IPC分类号： C09D11/52 , C23C16/06
CPC分类号： C09D11/52 , C09D11/037 , C09D11/322 , C09D11/38 , C09D11/54 , C23C16/06 , C23C18/161 , C23C18/166 , C23C18/1676 , C23C18/1678 , C23C18/2066 , C23C18/31 , C23C18/40 , C23C18/44 , H05K3/12 , H05K3/182 , H05K3/241 , H05K2203/1105 , H05K2203/1157
摘要： A process for depositing a metal on a substrate involves the use of two reduction reactions in a bottom-up based tandem manner starting from a substrate surface and working upward. A first reduction reaction starts on the substrate surface at ambient temperature, and a second reduction reaction, which is initiated by the reaction heat of the first reduction reaction, occurs in a reactive ink solution film coated on top, which becomes solid after the reaction. Gas and other small molecules generated from the reduction reactions, and the solvent, can readily escape through the upper surface of the film before the solid metal layer is formed or during post-treatment, with no or few voids left in the metal film. Thus, the process can be used to form highly conductive films and features at ambient temperature on various substrates.
摘要翻译：用于在基板上沉积金属的方法涉及以从底部向上串联的方式使用两个还原反应，从基板表面开始并向上工作。第一还原反应在环境温度下在基材表面上开始，并且通过第一还原反应的反应热引发的第二还原反应发生在反应性油墨溶液膜上，反应性油墨溶液膜在反应后变成固体。由还原反应产生的气体和其它小分子以及溶剂可以在形成固体金属层之前或在后处理期间容易地从薄膜的上表面逸出，而金属膜中没有留下或少量的空隙。因此，该方法可用于在环境温度下在各种基材上形成高导电膜和特征。

6. 发明申请

US20160145758A1 IN-SITU BALANCING OF PLATED POLYMERS 审中-公开
标题翻译：涂料聚合物的现场平衡
公开(公告)号：US20160145758A1
公开(公告)日：2016-05-26
申请号：US14903915
申请日：2014-07-09
申请人： UNITED TECHNOLOGIES CORPORATION
发明人： Colin J. King , Joseph Parkos , Gary M. Lomasney , William Bogue
IPC分类号： C25D5/06 , C25D3/02 , C25D7/00 , C25D5/56 , C25D17/12 , C25D9/02
CPC分类号： G06K19/07749 , B29C37/0025 , B29C64/106 , B29C64/124 , B29C64/153 , B29C70/42 , B29C70/54 , B29K2079/08 , B29K2105/0058 , B29K2105/12 , B29K2105/251 , B29K2105/253 , B29K2307/04 , B29K2309/08 , B29L2009/008 , B29L2031/082 , B32B27/08 , B32B27/281 , B32B2250/02 , B32B2255/10 , B32B2255/205 , B32B2262/101 , B32B2262/106 , B32B2603/00 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C23C18/1641 , C23C18/1653 , C23C18/1657 , C23C18/166 , C23C18/22 , C23C18/30 , C23C18/32 , C23C28/021 , C23C28/023 , C25D1/003 , C25D1/02 , C25D1/20 , C25D3/02 , C25D5/06 , C25D5/54 , C25D5/56 , C25D7/00 , C25D7/04 , C25D9/02 , C25D17/12 , G01B7/16 , G01D5/12 , G01N3/08 , G01N2203/026 , G01N2203/0268 , G01N2203/0298
摘要： A method for balancing a rotatable component is disclosed This method comprises and then plating the component to deposit a metal layer onto the component until the component is balanced. In addition, and alternative method for balancing a rotatable component is disclosed. This method comprises attaching a balancing weight to the rotatable component and rotating the component. This is followed by plating the component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced.
摘要翻译：公开了一种用于平衡可旋转部件的方法。该方法包括然后对部件进行电镀以将金属层沉积到部件上直到部件平衡。此外，还公开了用于平衡可旋转部件的替代方法。该方法包括将平衡重件附接到可旋转部件并旋转部件。然后将组件和平衡重量电镀以将金属层沉积到平衡重和组件上，直到组件平衡。

7. 发明授权

US09099528B2 Method for manufacturing three-dimensional integrated circuit 有权
标题翻译：三维集成电路制造方法
公开(公告)号：US09099528B2
公开(公告)日：2015-08-04
申请号：US14296419
申请日：2014-06-04
申请人： Innetech (Tianjin) Electronics Co., Ltd.
发明人： Dongsheng Liu , Meng Wang
IPC分类号： H01L21/768 , C23C18/32 , C23C18/16 , C23C18/20 , C23C18/38 , H05K3/18 , B29C45/00 , C23C18/18
CPC分类号： H01L21/768 , B29C45/0053 , B29C2045/0079 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/1651 , C23C18/166 , C23C18/1868 , C23C18/204 , C23C18/208 , C23C18/32 , C23C18/36 , C23C18/38 , C23C18/405 , H05K3/185 , H05K2201/0129 , H05K2201/0236 , H05K2201/09118 , H05K2203/107
摘要： A method for manufacturing a three-dimensional integrated circuit. The method includes: 1) adding a non-metallic light-induced catalyst including an alcohol and/or an aldehyde to a thermoplastic carrier material, and molding the resulting mixture by an injection molding machine to form a structural component; 2) irradiating a surface of the structural component with a laser ray to form a line pattern thereon; 3) immersing the structural component in a metal ion solution at room temperature for between 5 and 7 minutes; 4) washing the structural component with distilled water, and immersing the structural component in an aqueous solution including a reducing agent for between 5 and 7 minutes to allow the surface of the structural component to form a metal core; and 5) performing electroless copper plating and medium-phosphorus electroless nickel plating on an area comprising the metal core to yield a conductor track.
摘要翻译：一种三维集成电路的制造方法。该方法包括：1）向热塑性载体材料中加入包含醇和/或醛的非金属光诱导催化剂，并通过注塑机成型所得混合物以形成结构组分; 2）用激光照射结构部件的表面以在其上形成线图案; 3）在室温下将结构成分浸入金属离子溶液中5〜7分钟; 4）用蒸馏水洗涤结构组分，并将结构组分浸入包括还原剂的水溶液中5至7分钟以使结构组分的表面形成金属芯; 以及5）在包括所述金属芯的区域上执行无电镀铜和中磷化学镀镍以产生导体轨道。

8. 发明申请

US20140017410A1 ELECTROLESS PLATING PROCESS 审中-公开
标题翻译：电镀工艺
公开(公告)号：US20140017410A1
公开(公告)日：2014-01-16
申请号：US13976323
申请日：2011-12-27
申请人： Ganesh Ravindra Kale
发明人： Ganesh Ravindra Kale
IPC分类号： C23C10/26
CPC分类号： C23C10/26 , C23C18/1619 , C23C18/1644 , C23C18/1648 , C23C18/1658 , C23C18/166 , C23C18/1682 , C23C18/1694 , C23C18/1837
摘要： An electroless plating method for use in metal plating on a porous substrate is disclosed. It uses selective contact of the plating metal salt solution with a reducing solution on the activated surface on or inside the porous substrate. This electroless plating method in the setup is useful for unmanned, automatic operation resulting in almost 100% membrane (pure/composite) with substantially no pinholes or cracks.
摘要翻译：公开了一种用于多孔基材上的金属电镀的无电镀方法。它使用电镀金属盐溶液与多孔基材上面或内部的活化表面上的还原溶液的选择性接触。该设置中的无电镀方法对于无人自动操作是有用的，导致几乎100％的膜（纯/复合），基本上没有针孔或裂纹。

9. 发明授权

US08545932B2 Metallization of a porous silicon zone by in situ reduction and application to a fuel cell 有权
标题翻译：通过原位还原和应用于燃料电池来多孔硅区域的金属化
公开(公告)号：US08545932B2
公开(公告)日：2013-10-01
申请号：US12893613
申请日：2010-09-29
申请人： Frederic-Xavier Gaillard , Olivier Raccurt
发明人： Frederic-Xavier Gaillard , Olivier Raccurt
IPC分类号： B05D5/12
CPC分类号： H01M8/0232 , C23C18/1601 , C23C18/1603 , C23C18/1639 , C23C18/1644 , C23C18/166 , C23C18/1865 , C23C18/1882 , C23C18/31 , C23C18/54
摘要： A porous silicon zone is metallized by performing in situ reduction of metallic ions dissolved in an aqueous solution and fixing of the metallic particles obtained on said zone in a single step. This step consists in particular in bringing the solution containing the metallic ions into contact with the zone to be metallized, the surface whereof has previously been functionalized to enable in situ reduction of the metallic ions and fixing of the metallic particles. Functionalization of the porous silicon zone is achieved by grafting two particular and distinct types of chemical functions. The first function used is a chelating chemical function for the metallic ions and/or for the metal corresponding to the metallic ions, whereas the second function is a reducing chemical function for the metallic ions. Such a metallization can be used for producing an electrically conducting porous diffusion layer of a fuel cell.
摘要翻译：通过原位还原溶解在水溶液中的金属离子并在单一步骤中固定在所述区域上获得的金属颗粒，多孔硅区域被金属化。该步骤特别在于使含有金属离子的溶液与要金属化的区域接触，其表面已经被官能化以使金属离子原位还原和固定金属颗粒。多孔硅区域的功能化是通过接枝两种特殊和不同类型的化学功能来实现的。所使用的第一功能是金属离子和/或对应于金属离子的金属的螯合化学功能，而第二个功能是金属离子的还原化学功能。这种金属化可用于制造燃料电池的导电多孔扩散层。

10. 发明授权

US08507043B2 Non-electrolytic method for metallizing a substrate by the reduction of metallic salt(s) and the spraying of aerosol(s) 有权
标题翻译：通过金属盐的还原和气溶胶的喷射对基板进行金属化的非电解方法
公开(公告)号：US08507043B2
公开(公告)日：2013-08-13
申请号：US12515461
申请日：2007-11-26
申请人： Samuel Stremsdoerfer
发明人： Samuel Stremsdoerfer
IPC分类号： B05D3/00
CPC分类号： C23C18/40 , C23C18/1617 , C23C18/1619 , C23C18/1658 , C23C18/166 , C23C18/1675 , C23C18/1683 , C23C18/34 , Y02T50/67
摘要： The invention relates to a non-electrolytic method for metallizing a substrate by projecting an aerosol containing a solution of an oxidant metallic cation and of a reducing agent; said method comprising a step of -a- wetting the substrate; starting to project a metallisation according to a succession of projecting phases alternating with relaxing phases: (i) by adjusting the duration Dp of the projection phases and the duration Dr of the relaxing phases from a metallisation constant k intrinsic for each metal; and (ii) by adjusting the projection flow-rate. The metallisation projection is carried out dynamically by displacing projection means relative to the substrate in order to carry out a periodical scanning, wherein Dp correspond to the duration during which the surface unit in question is submitted to the continuous projection of the aerosol and Dr corresponds to the duration during which the part is not submitted to projection.
摘要翻译：本发明涉及一种用于通过投射包含氧化剂金属阳离子和还原剂的溶液的气溶胶来金属化基底的非电解方法; 所述方法包括 - 润湿所述基底的步骤; 开始根据一系列突变阶段与松弛相交替进行金属化：（i）通过从每个金属的固有金属化常数k调整投影相的持续时间Dp和松弛相的持续时间Dr; 和（ii）通过调整投影流量。通过相对于衬底相对于衬底移位投影装置来动态地执行金属化投影，以便执行周期性扫描，其中Dp对应于所讨论的表面单元被提交到气溶胶的连续投影的持续时间，并且Dr对应于该部分未提交投影的期限。

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