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    • 3. 发明授权
    • Non-electrolytic method for metallizing a substrate by the reduction of metallic salt(s) and the spraying of aerosol(s)
    • 通过金属盐的还原和气溶胶的喷射对基板进行金属化的非电解方法
    • US08507043B2
    • 2013-08-13
    • US12515461
    • 2007-11-26
    • Samuel Stremsdoerfer
    • Samuel Stremsdoerfer
    • B05D3/00
    • C23C18/40C23C18/1617C23C18/1619C23C18/1658C23C18/166C23C18/1675C23C18/1683C23C18/34Y02T50/67
    • The invention relates to a non-electrolytic method for metallizing a substrate by projecting an aerosol containing a solution of an oxidant metallic cation and of a reducing agent; said method comprising a step of -a- wetting the substrate; starting to project a metallisation according to a succession of projecting phases alternating with relaxing phases: (i) by adjusting the duration Dp of the projection phases and the duration Dr of the relaxing phases from a metallisation constant k intrinsic for each metal; and (ii) by adjusting the projection flow-rate. The metallisation projection is carried out dynamically by displacing projection means relative to the substrate in order to carry out a periodical scanning, wherein Dp correspond to the duration during which the surface unit in question is submitted to the continuous projection of the aerosol and Dr corresponds to the duration during which the part is not submitted to projection.
    • 本发明涉及一种用于通过投射包含氧化剂金属阳离子和还原剂的溶液的气溶胶来金属化基底的非电解方法; 所述方法包括 - 润湿所述基底的步骤; 开始根据一系列突变阶段与松弛相交替进行金属化:(i)通过从每个金属的固有金属化常数k调整投影相的持续时间Dp和松弛相的持续时间Dr; 和(ii)通过调整投影流量。 通过相对于衬底相对于衬底移位投影装置来动态地执行金属化投影,以便执行周期性扫描,其中Dp对应于所讨论的表面单元被提交到气溶胶的连续投影的持续时间,并且Dr对应于 该部分未提交投影的期限。
    • 6. 发明申请
    • NON-ELECTROLYTIC METHOD FOR METALLIZING A SUBSTRATE BY THE REDUCTION OF METALLIC SALT(S) AND THE SPRAYING OF AEROSOL(S)
    • 通过减少金属盐(S)和喷雾剂(S)来金属化底物的非电解方法
    • US20100075053A1
    • 2010-03-25
    • US12515461
    • 2007-11-26
    • Samuel Stremsdoerfer
    • Samuel Stremsdoerfer
    • B05D3/00B05C11/00
    • C23C18/40C23C18/1617C23C18/1619C23C18/1658C23C18/166C23C18/1675C23C18/1683C23C18/34Y02T50/67
    • The invention relates to a non-electrolytic method for metallizing a substrate by projecting an aerosol containing a solution of an oxidant metallic cation and of a reducing agent; said method comprising a step of—a—wetting the substrate; starting to project a metallisation according to a succession of projecting phases alternating with relaxing phases: (i) by adjusting the duration Dp of the projection phases and the duration Dr of the relaxing phases from a metallisation constant k intrinsic for each metal; and (ii) by adjusting the projection flow-rate. The metallisation projection is carried out dynamically by displacing projection means relative to the substrate in order to carry out a periodical scanning, wherein Dp correspond to the duration during which the surface unit in question is submitted to the continuous projection of the aerosol and Dr corresponds to the duration during which the part is not submitted to projection.
    • 本发明涉及一种用于通过投射包含氧化剂金属阳离子和还原剂的溶液的气溶胶来金属化基底的非电解方法; 所述方法包括使基底润湿的步骤; 开始根据一系列突变阶段与松弛相交替进行金属化:(i)通过从每个金属的固有金属化常数k调整投影相的持续时间Dp和松弛相的持续时间Dr; 和(ii)通过调整投影流量。 通过相对于衬底相对于衬底移位投影装置来动态地执行金属化投影,以便执行周期性扫描,其中Dp对应于所讨论的表面单元被提交到气溶胶的连续投影的持续时间,并且Dr对应于 该部分未提交投影的期限。