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1. 发明公开

US20240218517A1 METHOD FOR TREATING A NON-METALLIC SUBSTRATE FOR SUBSEQUENT METALLIZATION 审中-公开
公开(公告)号：US20240218517A1
公开(公告)日：2024-07-04
申请号：US18558381
申请日：2022-05-10
申请人： Atotech Deutschland GmbH & Co. KG
发明人： Frank BAYER , Michael MERSCHKY , Thorsten WEISS
IPC分类号： C23C18/20 , B33Y40/20 , C23C18/16 , C23C18/24 , C23C18/30 , C23C18/32 , C23C28/02 , C25D3/38 , C25D5/56
CPC分类号： C23C18/2086 , B33Y40/20 , C23C18/1641 , C23C18/24 , C23C18/30 , C23C18/32 , C23C18/1653 , C23C28/023 , C25D3/38 , C25D5/56
摘要： The present invention relates to a method, and respective use, for treating a non-metallic substrate for subsequent metallization, the method comprising step (A), optional step (B), and step (C), wherein step (C) comprises a contacting with an acidic treatment composition comprising one or more than one manganese species, characterized in that the substrate is a 3D-printed substrate.

2. 发明申请

US20180215915A1 GALVANIZED COMPONENT WITH HIGH HEAT DISTORTION RESISTANCE 审中-公开
公开(公告)号：US20180215915A1
公开(公告)日：2018-08-02
申请号：US15742259
申请日：2016-07-04
申请人： Covestro Deutschland AG
发明人： Andreas SEIDEL , Wolfgang SCHWARTMANN , Eckhard WENZ , Peter WEIMAR
IPC分类号： C08L69/00 , C23C18/16 , C23C18/20 , C23C18/24 , C23C18/30 , C23C18/32 , C23C18/38 , C25D5/14 , C23F17/00
CPC分类号： C08L69/00 , C08L2205/025 , C08L2205/03 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/30 , C23C18/32 , C23C18/38 , C23F17/00 , C25D5/14 , C08L55/02 , C08L51/04
摘要： The invention relates to a composite component consisting of a plastic support and a multi-ply metal layer applied in a galvanizing operation, the plastic support being made of a thermoplastic composition consisting of A) 50 to 90 parts by weight of at least one aromatic polycarbonate, B) 10 to 50 parts by weight of at least one graft polymer comprising a diene-containing, rubber-elastic, particulate graft base and a vinyl (co)polymer shell, C) 0 to 15 parts by weight of at least one additive, where the sum of the parts by weight of components A) and B) in the composition is standardized to 100, (i) characterized in that the rubber content from component B in the composition is at least 6 wt %, (ii) characterized in that the ratio K/S of the weight fractions of butadiene-containing, rubber-elastic, particulate graft base from component B) in the composition (viz. K) to the sum of free—that is, not bound covalently to the rubber base in the graft polymer of component B)—vinyl (co)polymer from component B) and of any free vinyl (co)polymer from component C) in the composition (viz. S) is at least 1.5, (iii) characterized in that component A) comprises at least one monomer unit selected from the group consisting of monomer units described by the general formula (2) in which R4 is H, linear or branched C1-C10 alkyl, and R5 is linear or branched C1-C10 alkyl, and monomer units derived from bis(4-hydroxyphenyl) compounds and bridged via the 1,1′-position of a cyclic, optionally heteroatom-substituted hydrocarbon, (iv) characterized in that the fraction (Acyc) of monomer units derived from bis(4-hydroxyphenyl) compounds and bridged via the 1,1′-position of a cyclic, optionally heteroatom-substituted hydrocarbon, based on the sum of all bisphenol-derived monomer units in component A), is in the range from 0 to 40 wt %, and, if the fraction of monomer units derived from bis(4-hydroxyphenyl) compounds and bridged via the 1,1′-position of a cyclic, optionally heteroatom-substituted hydrocarbon, based on the sum of all bisphenol-derived monomer units in component A), is in the range

3. 发明申请

US20180208792A1 FILM COATING AND FILM COATING COMPOSITIONS FOR SURFACE MODIFICATION AND METALLIZATION 审中-公开
公开(公告)号：US20180208792A1
公开(公告)日：2018-07-26
申请号：US15928527
申请日：2018-03-22
申请人： Jun YANG
发明人： Jun YANG , Mingjun HU , Tengyuan ZHANG , Qiuquan GUO
IPC分类号： C09D139/08 , B05D3/06 , B05D3/02 , C23C18/42 , C23C18/16 , C09D7/20 , C09D7/63 , C08J7/04 , H05K3/12 , H05K3/18
CPC分类号： C09D139/08 , B05D1/18 , B05D3/0254 , B05D3/0272 , B05D3/067 , B05D7/02 , B05D2401/10 , B05D2518/00 , C08J7/047 , C08J2367/02 , C08J2439/08 , C08L39/08 , C09D7/20 , C09D7/63 , C23C18/1605 , C23C18/1608 , C23C18/165 , C23C18/2006 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/405 , C23C18/42 , H05K1/038 , H05K1/0386 , H05K1/0393 , H05K3/1208 , H05K3/181 , H05K3/182 , H05K3/387 , H05K2203/013 , H05K2203/072 , H05K2203/0783 , H05K2203/125 , C08L63/00
摘要： The present disclosure provides a coating composition for use in coating polyester film, polyimide film, polyvinyl chloride film, semi-embossed film, polyvinyl chloride film and like, comprises poly(4-vinyl pyridine), SU-8, a solution such as isopropyl alcohol, 1,4-dioxane. A simple universal solution-based coating method for fast surface modification of various substances by applying an effective amount of pyridine ligands to immobilize transitional metal ions that can behave as the catalyst of electroless copper plating for surface metallization while functioning as the adhesion-promoting layer between the substrate and deposited metal.

4. 发明授权

US10021789B2 Metal-laminated polyimide substrate, and method for production thereof 有权
公开(公告)号：US10021789B2
公开(公告)日：2018-07-10
申请号：US12666872
申请日：2008-06-26
申请人： Shinya Ochi , Ryuichi Nakagami , Makoto Kohtoku , Mika Hamada
发明人： Shinya Ochi , Ryuichi Nakagami , Makoto Kohtoku , Mika Hamada
IPC分类号： B32B15/08 , C23C18/22 , C23C18/32 , H05K3/38 , C23C18/16 , C23C18/20 , H05K3/18 , B32B15/20 , B32B27/28 , C23C18/30 , H05K1/03
CPC分类号： H05K3/381 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/204 , B32B2307/306 , B32B2307/712 , B32B2307/714 , B32B2457/00 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/32 , H05K1/0346 , H05K3/181 , H05K2201/0154 , H05K2203/0793 , Y10T428/2495 , Y10T428/31681
摘要： An object is to provide a laminated polyimide substrate, and a method for the production thereof, in which various properties are ensured and/or provided by effectively controlling changes over time under stringent conditions, while ensuring sufficient adhesion between a polyimide film and metal layer. A laminated polyimide substrate comprises a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer, arranged in that order, wherein the alkali-treated layer contains an anionic functional group, and is a laminated structure having a layer containing a metal catalyst arranged on the metal layer side and a layer containing a complex of the metal catalyst arranged on the polyimide layer side.

5. 发明授权

US09919493B2 Electromagnetic wave penetrative metal film, manufacturing method of electromagnetic wave penetrative metal film, and radome for vehicle-mounted radar devices 有权
公开(公告)号：US09919493B2
公开(公告)日：2018-03-20
申请号：US14355888
申请日：2012-11-02
申请人： Sankei Giken Kogyo Co., Ltd.
发明人： Shuji Yamamoto
IPC分类号： B32B15/00 , B32B15/04 , C23C18/20 , C23C18/28 , C23C18/30 , C23C18/44 , G01S7/03 , H01Q1/42 , C23C18/16 , C23C18/48 , C23C18/31 , C23C18/42 , B32B15/08 , B32B3/10 , G01S13/93
CPC分类号： B32B15/04 , B32B3/10 , B32B15/08 , C23C18/1646 , C23C18/165 , C23C18/1689 , C23C18/2086 , C23C18/285 , C23C18/30 , C23C18/31 , C23C18/42 , C23C18/44 , C23C18/48 , G01S7/032 , G01S13/931 , G01S2013/9378 , H01Q1/42 , Y10T428/24917 , Y10T428/25 , Y10T428/256
摘要： An object of the present invention is to provide an electromagnetic wave penetrative metal film having high mass productivity and an extremely low attenuation rate in the electromagnetic wave penetrated through, a manufacturing method of the electromagnetic wave penetrative metal film, and a radome for a vehicle-mounted radar devices using the electromagnetic wave penetrative metal file. To achieve the object, the present invention provides an electromagnetic wave penetrative metal film composed of more than 10000 of fine metal film pieces per unit area (1 mm2) provided on a surface of a substrate through an electroless plating step, wherein fine metal film pieces adjacent to each other are electrically isolated, a manufacturing method of the electromagnetic wave penetrative metal film, and a radome for a vehicle-mounted radar devices using the electromagnetic wave penetrative metal film.

6. 发明授权

US09914115B2 Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds 有权
公开(公告)号：US09914115B2
公开(公告)日：2018-03-13
申请号：US14921220
申请日：2015-10-23
申请人： Rohm and Haas Electronic Materials LLC
发明人： Kristen M. Milum , Donald E. Cleary , Maria A. Rzeznik
IPC分类号： B01J31/18 , C23C18/20 , C23C18/30 , B01J31/28 , C23C18/18 , C23C18/32 , C23C18/38 , B01J31/22 , B01J31/02 , C23C18/16
CPC分类号： B01J31/1805 , B01J31/0247 , B01J31/2243 , B01J31/28 , B01J2531/17 , B01J2531/824 , B01J2531/828 , C23C18/1653 , C23C18/1837 , C23C18/1844 , C23C18/1886 , C23C18/2073 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38
摘要： Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.

7. 发明申请

US20180057943A1 METHOD OF MANUFACTURING CONDUCTIVE LAMINATE, CONDUCTIVE LAMINATE, PLATED LAYER PRECURSOR LAYER-ATTACHED SUBSTRATE, PLATED LAYER-ATTACHED SUBSTRATE, AND TOUCH SENSOR 审中-公开
公开(公告)号：US20180057943A1
公开(公告)日：2018-03-01
申请号：US15805976
申请日：2017-11-07
申请人： FUJIFILM Corporation
发明人： Naoki TSUKAMOTO
IPC分类号： C23C18/18 , B32B15/08 , B32B1/00 , G06F3/044 , H05K3/18
CPC分类号： C23C18/18 , B32B1/00 , B32B15/08 , B32B2307/202 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/1646 , C23C18/2013 , C23C18/204 , C23C18/2086 , C23C18/30 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0284 , H05K3/0014 , H05K3/181 , H05K3/182 , H05K2201/0129 , H05K2203/0545 , H05K2203/302
摘要： An object of the present invention is to provide a method of simply manufacturing a conductive laminate which has a three-dimensional shape including a curved surface and in which a metal layer is disposed on the curved surface, a conductive laminate, a plated layer-attached substrate, a plated layer precursor layer-attached substrate, and a touch sensor.The method of manufacturing the conductive laminate having three-dimensional shape including a curved surface according to the present invention includes: Step A of forming a pattern-shaped plated layer precursor layer including a predetermined compound on a substrate to obtain a plated layer precursor layer-attached substrate; Step B of deforming a plated layer precursor layer-attached substrate such that at least a portion of the plated layer precursor layer is deformed to form a three-dimensional shape including a curved surface; Step C of applying energy to the plated layer precursor layer to form a pattern-shaped plated layer; and Step D of applying a plating catalyst or a precursor thereof to the pattern-shaped plated layer, and then performing a plating treatment to form a pattern-shaped metal layer on the plated layer.

8. 发明申请

US20180044813A1 Inhibitor Composition for Racks When Using Chrome Free Etches in a Plating on Plastics Process 审中-公开
公开(公告)号：US20180044813A1
公开(公告)日：2018-02-15
申请号：US15551052
申请日：2016-02-23
申请人： MACDERMID ENTHONE, INC.
发明人： Frank Noffke , Andreas Konigshofen , Axel Fuhrmann , Christoph Werner
IPC分类号： C25D21/11 , C09K15/26 , C08J7/06 , C25D5/56 , C25D5/34 , C23C18/38 , C23C18/16 , C23C18/20 , C23C18/22 , C23C18/30 , C23C18/32 , C09K15/30 , C25D17/08
CPC分类号： C25D21/11 , C08J7/02 , C08J7/06 , C08J7/065 , C09K15/26 , C09K15/30 , C23C18/1625 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/32 , C23C18/38 , C25D5/34 , C25D5/56 , C25D17/08
摘要： The invention relates to an aqueous inhibition composition for the inhibition of electrochemical metal plating on polymer surfaces, said inhibition composition comprising an inhibition agent selected from the group of compounds having at least one sulfur and at least one nitrogen atom as well as to a method for the inhibition of an insulated surface of a rack area. The inventive inhibition composition is capable to provide a solution for prohibiting unintended metallization on insulated areas of the racks when non-chromic etching is utilized for plating on plastics processes.

9. 发明授权

US09850578B1 Shielding coating for selective metallization 有权
公开(公告)号：US09850578B1
公开(公告)日：2017-12-26
申请号：US15263645
申请日：2016-09-13
申请人： Rohm and Haas Electronic Materials LLC
发明人： Hung Tat Chan , Ka Ming Yip , Chit Yiu Chan , Kwok Wai Yee
IPC分类号： C23C18/16 , C23C18/18 , C23C18/38 , C09K13/00 , C23C18/22 , C23C18/20
CPC分类号： C23C18/1641 , C09K13/00 , C23C18/1605 , C23C18/2013 , C23C18/204 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/38
摘要： Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain five-membered heterocyclic nitrogen compounds and the top coat contains hydrophobic alky organic compounds.

10. 发明授权

US09803283B1 Method of electroless deposition of aluminum or aluminum alloy, an electroless plating composition, and an article including the same 有权
公开(公告)号：US09803283B1
公开(公告)日：2017-10-31
申请号：US14167733
申请日：2014-01-29
申请人： HRL LABORATORIES, LLC
发明人： John H. Martin , Joanna A. Kolodziejska , John J. Vajo , Jason A. Graetz , Christopher S. Roper
IPC分类号： B05D3/10 , C23C18/16 , C23C18/31
CPC分类号： C23C18/1687 , C23C18/1632 , C23C18/1651 , C23C18/1657 , C23C18/1662 , C23C18/1844 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/31 , C23C18/48 , C23C18/52
摘要： A method for electroless deposition of aluminum on a substrate includes: activating the substrate; providing an aluminum ionic liquid; adding a reducing agent and an additive to the aluminum ionic liquid to form an electroless plating composition, wherein the additive may include a catalyst, an alloying element, or a combination thereof; and immersing the substrate in the electroless plating composition to have an aluminum layer deposited on the substrate. An article includes the electroless deposited aluminum layer.

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