专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20190211517A1 COMPOSITE ABRASIVE ATTACHMENT ARTICLE FOR CONCRETE POWER TROWEL MACHINE 审中-公开
公开(公告)号：US20190211517A1
公开(公告)日：2019-07-11
申请号：US16299084
申请日：2019-03-11
申请人： Clint A Howle , James L McArdle , Carl G Cabot, JR.
发明人： Clint A Howle , James L McArdle , Carl G Cabot, JR.
IPC分类号： E01C19/42 , E04F21/24 , B24B7/18 , B24B7/22 , B24D7/06 , B24D3/08
CPC分类号： E01C19/42 , B24B7/186 , B24B7/22 , B24D3/08 , B24D3/30 , B24D7/066 , E04F21/245
摘要： The invention provides a float trowel blade attachment for cement floor finishers comprising a rectangular section of sheet metal having a top surface and a bottom surface and having its edges optionally bent upwardly, means for providing to the top surface a three-sided rearwardly open pocket on the back of the section adjacent the leading edge thereof adapted to partially receive a finish trowel blade of the finisher, a spring clip secured to the top surface or the pocket-forming means and extending rearwardly therefrom so as to be engageable with the finish trowel blade to retain the section thereon, and wherein said rectangular sheet metal has attached to its bottom surface using an adhesive or mechanical attachment material interlayer, a composite rigid abrasive element bonded to a resilient backing.

2. 发明授权

US2611689A Article for polishing 失效
标题翻译：抛光用品
公开(公告)号：US2611689A
公开(公告)日：1952-09-23
申请号：US11427549
申请日：1949-09-06
申请人： D & H SCOVIL INC
发明人： PORTER PHILIP W
IPC分类号： B24D3/30 , B24D3/34
CPC分类号： B24D3/30 , B24D3/344

3. 发明申请

US20060280929A1 POLISHING PAD AND METHOD OF PRODUCING THE SAME 有权
标题翻译：抛光垫及其生产方法
公开(公告)号：US20060280929A1
公开(公告)日：2006-12-14
申请号：US11466878
申请日：2006-08-24
申请人： Tetsuo SHIMOMURA , Masahiko NAKAMORI , Takatoshi YAMADA , Takashi MASUI , Shigeru KOMAI , Koichi ONO , Kazuyuki OGAWA , Atsushi KAZUNO , Tsuyoshi KIMURA , Hiroshi SEYANAGI
发明人： Tetsuo SHIMOMURA , Masahiko NAKAMORI , Takatoshi YAMADA , Takashi MASUI , Shigeru KOMAI , Koichi ONO , Kazuyuki OGAWA , Atsushi KAZUNO , Tsuyoshi KIMURA , Hiroshi SEYANAGI
IPC分类号： B32B3/26 , B24B9/00 , B24B7/00
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译：本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光，可平坦化，抛光效率高。本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。提供了可以使平面性改善和划痕减少兼容的抛光垫。

4. 发明申请

US20050266226A1 Chemical mechanical polishing pad and method for selective metal and barrier polishing 审中-公开
标题翻译：化学机械抛光垫和选择性金属和屏障抛光方法
公开(公告)号：US20050266226A1
公开(公告)日：2005-12-01
申请号：US10962108
申请日：2004-10-08
申请人： Yaw Obeng
发明人： Yaw Obeng
IPC分类号： B24B37/24 , B24D3/30 , B32B3/00 , B32B3/26 , C08J9/36
CPC分类号： B24B37/24 , B24D3/26 , B24D3/30 , C08J9/36 , C08J2331/04 , Y10T428/249953 , Y10T428/249976
摘要： The present invention is directed, in general, to a polishing pad comprising a polishing body. The polishing body comprises a thermoplastic foam substrate having a surface comprising concave cells. The thermoplastic foam substrate comprises a blend of cross-linked ethylene vinyl acetate copolymer and polyethylene. The thermoplastic foam substrate has a hardness ranging from about 24 Shore A to about 100 Shore A. Other embodiments include a method for preparing the polishing pad, a polishing apparatus that includes the polishing pad, and a method of polishing a semiconductor substrate using the polishing pad.
摘要翻译：本发明总体上涉及包括抛光体的抛光垫。抛光体包括具有包括凹槽的表面的热塑性泡沫基材。热塑性泡沫基材包括交联的乙烯 - 乙酸乙烯酯共聚物和聚乙烯的共混物。热塑性泡沫基材的硬度范围为约24肖氏A至约100肖氏A.其他实施方案包括制备抛光垫的方法，包括抛光垫的抛光装置和使用抛光的半导体基板的抛光方法垫。

5. 发明授权

US3661544A A method for making thermosetting resinous abrasive tools 失效
标题翻译：一种制造热固性研磨工具的方法
公开(公告)号：US3661544A
公开(公告)日：1972-05-09
申请号：US3661544D
申请日：1969-11-28
申请人： BMI LAB INDUSTRY
发明人： WHITAKER NOBLE D
IPC分类号： B24D3/30 , B24D7/00 , B24D18/00 , B24B17/00 , C08G51/12
CPC分类号： B24D3/30 , B24D7/00 , B24D18/0009
摘要： A method for producing an abrasive tool or structure which includes the steps of mixing an abrasive composition containing abrasive particles and, preferably, friable particles, with a liquid, multi-stage, thermosetting resin and coating substantially all of the individual particles with the resin; curing the resin to the B-stage while the resin is in contact with the particles to form a fusible solid coating on the particles and forming individual particles coated with said Bstage resin, and placing said resin coated particles in a mold and heating the particles sufficiently to render the resin tacky and fusible and, concurrently, applying sufficient pressure to form a coherent mass of said particles and curing the resin to a hard infusible state to form a high tensile strength bond between said particles. An abrasive tool composed of abrasive particles and lightweight, easily crushable, friable particles uniformly dispersed throughout the abrasive particles, each of the particles being bonded together with a high strength bond formed by a thermosetting resin cured to a hard and infusible state.
摘要翻译：一种用于生产研磨工具或结构的方法，包括以下步骤：将含有磨料颗粒，优选易碎颗粒的磨料组合物与液体，多级热固性树脂混合并将基本上所有的单个颗粒涂覆在树脂上; 将树脂固化到B阶段，同时树脂与颗粒接触以在颗粒上形成可熔固体涂层并形成涂覆有所述B阶树脂的单个颗粒，并将所述树脂涂覆的颗粒放置在模具中并加热颗粒足以使树脂发粘和可熔，并且同时施加足够的压力以形成所述颗粒的粘结块，并将树脂固化成硬的不可渗透状态，以在所述颗粒之间形成高拉伸强度的粘结。研磨工具由磨料颗粒和均匀分散在磨料颗粒上的轻质，易破碎，易碎的颗粒组成，每个颗粒通过固化至硬质和不熔状态的热固性树脂形成的高强度粘合在一起。

6. 发明申请

US20190202031A1 COATED ABRASIVES HAVING AGGREGATES 审中-公开
公开(公告)号：US20190202031A1
公开(公告)日：2019-07-04
申请号：US16230084
申请日：2018-12-21
申请人： SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
发明人： Jianna WANG , Shih-Chieh Kung , Sujatha K. Iyengar , Doruk O. Yener , Darrell K. Everts
IPC分类号： B24D3/30 , B24D3/00 , B24D3/28
CPC分类号： B24D3/30 , B24D3/004 , B24D3/285
摘要： The present disclosure relates generally to coated abrasive articles that include a grinding aid aggregates in a make coat, a size coat, a supersize coat, or combinations thereof, as well as methods of making coated abrasive articles.

7. 发明授权

US08652225B2 Flexible coated abrasive finishing article and method of manufacturing the same 失效
标题翻译：柔性涂层磨料整理制品及其制造方法
公开(公告)号：US08652225B2
公开(公告)日：2014-02-18
申请号：US12837851
申请日：2010-07-16
申请人： Joseph H. MacKay
发明人： Joseph H. MacKay
IPC分类号： B24D11/00
CPC分类号： B24D11/00 , B24D3/30
摘要： A flexible abrasive finishing article including a backing of fabric or paper having first and second major surfaces with abrasive particles adhesively secured to said first major surface and a layer of cyanoacrylate based material substantially covering the second major surface. The method of making a flexible abrasive finishing material including the steps of applying a layer of cyanoacrylate based material to a surface of a backing material opposite the surface to which abrasive particles are adhesively secured and covering said cyanoacrylate material.
摘要翻译：一种柔性磨料整理制品，其包括具有第一和第二主表面的织物或纸的背衬，所述第一和第二主表面具有粘附地固定到所述第一主表面的磨料颗粒和基本上覆盖所述第二主表面的氰基丙烯酸酯基材料层。制备柔性磨料整理材料的方法包括以下步骤：将一层氰基丙烯酸酯基材料施加到与磨料颗粒粘附固定并覆盖所述氰基丙烯酸酯材料的表面相反的背衬材料的表面上。

8. 发明授权

US07488236B2 Polishing pad and method of producing the same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US07488236B2
公开(公告)日：2009-02-10
申请号：US11466909
申请日：2006-08-24
申请人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura
发明人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura
IPC分类号： B24B7/22
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译：本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光，可平坦化，抛光效率高。本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。提供了可以使平面性改善和划痕减少兼容的抛光垫。

9. 发明申请

US20070107316A1 Resin bonding type diamond tool and manufacturing method thereof 审中-公开
标题翻译：树脂粘合型金刚石工具及其制造方法
公开(公告)号：US20070107316A1
公开(公告)日：2007-05-17
申请号：US10561679
申请日：2004-07-02
申请人： Hyo Kim
发明人： Hyo Kim
IPC分类号： C22C32/00 , C09K3/14
CPC分类号： B24D18/0009 , B24D3/08 , B24D3/30 , C22C26/00
摘要： A resin bonding type diamond tool and manufacturing method thereof, in which the diamond tool is fabricated by preparing diamond pellets by sintering diamond powder and metal matrix, loading the diamond pellets into a mold and sintering the diamond pellets together with injected resin or powder resin. This can be applied to all tools of various shapes, in particular, complex tools having difficulty in fabrication, shorten a manufacturing process to save cost, time and molds, and remarkably improve the cutting ability of final products.
摘要翻译：一种树脂粘合型金刚石工具及其制造方法，其中通过烧结金刚石粉末和金属基质制备金刚石颗粒来制造金刚石工具，将金刚石颗粒装载到模具中并与注入的树脂或粉末树脂一起烧结金刚石颗粒。这可以应用于各种形状的所有工具，特别是难以制造的复杂工具，缩短制造过程以节省成本，时间和模具，并显着提高最终产品的切割能力。

10. 发明授权

US5567503A Polishing pad with abrasive particles in a non-porous binder 失效
标题翻译：抛光垫，磨料颗粒在无孔粘合剂中
公开(公告)号：US5567503A
公开(公告)日：1996-10-22
申请号：US308399
申请日：1994-09-19
申请人： John S. Sexton , Derek N. Wright
发明人： John S. Sexton , Derek N. Wright
IPC分类号： B24B7/22 , B24D3/30 , B24D7/00 , B24D7/06 , B24D13/14
CPC分类号： B24D7/066 , B24B7/22 , B24D3/30 , Y10T428/24322 , Y10T428/24355 , Y10T428/24372 , Y10T428/24488 , Y10T428/2457 , Y10T428/24587 , Y10T428/24612 , Y10T428/24893 , Y10T428/24909 , Y10T428/24926 , Y10T428/25 , Y10T428/252 , Y10T428/26 , Y10T428/268 , Y10T428/30
摘要： A polishing pad comprises a carrier and layer of a non-porous thermoplastic polymer secured to a surface thereof and containing a mass of discrete abrasive particles, comprising diamond or cubic boron nitride, uniformly dispersed therein. The abrasive particles have a particle size of up to 500 microns and are present in the layer in a concentration of up to 30 volume percent. The layer presents an abrasive polishing surface. The abrasive layer may also comprise a plurality of spaced strips secured to a surface of the carrier and each strip presents an abrasive polishing surface.
摘要翻译：抛光垫包括载体和固定到其表面的无孔热塑性聚合物层，并且包含大量分散的研磨颗粒，其包含均匀分散在其中的金刚石或立方氮化硼。研磨颗粒具有高达500微米的粒度，并且以高达30体积％的浓度存在于该层中。该层呈现研磨抛光表面。研磨层还可以包括固定到载体的表面的多个间隔的条，并且每个条呈现研磨抛光表面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式