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1. 发明申请

US20190211517A1 COMPOSITE ABRASIVE ATTACHMENT ARTICLE FOR CONCRETE POWER TROWEL MACHINE 审中-公开
公开(公告)号：US20190211517A1
公开(公告)日：2019-07-11
申请号：US16299084
申请日：2019-03-11
申请人： Clint A Howle , James L McArdle , Carl G Cabot, JR.
发明人： Clint A Howle , James L McArdle , Carl G Cabot, JR.
IPC分类号： E01C19/42 , E04F21/24 , B24B7/18 , B24B7/22 , B24D7/06 , B24D3/08
CPC分类号： E01C19/42 , B24B7/186 , B24B7/22 , B24D3/08 , B24D3/30 , B24D7/066 , E04F21/245
摘要： The invention provides a float trowel blade attachment for cement floor finishers comprising a rectangular section of sheet metal having a top surface and a bottom surface and having its edges optionally bent upwardly, means for providing to the top surface a three-sided rearwardly open pocket on the back of the section adjacent the leading edge thereof adapted to partially receive a finish trowel blade of the finisher, a spring clip secured to the top surface or the pocket-forming means and extending rearwardly therefrom so as to be engageable with the finish trowel blade to retain the section thereon, and wherein said rectangular sheet metal has attached to its bottom surface using an adhesive or mechanical attachment material interlayer, a composite rigid abrasive element bonded to a resilient backing.

2. 发明授权

US2611689A Article for polishing 失效
标题翻译：抛光用品
公开(公告)号：US2611689A
公开(公告)日：1952-09-23
申请号：US11427549
申请日：1949-09-06
申请人： D & H SCOVIL INC
发明人： PORTER PHILIP W
IPC分类号： B24D3/30 , B24D3/34
CPC分类号： B24D3/30 , B24D3/344

3. 发明申请

US20060280929A1 POLISHING PAD AND METHOD OF PRODUCING THE SAME 有权
标题翻译：抛光垫及其生产方法
公开(公告)号：US20060280929A1
公开(公告)日：2006-12-14
申请号：US11466878
申请日：2006-08-24
申请人： Tetsuo SHIMOMURA , Masahiko NAKAMORI , Takatoshi YAMADA , Takashi MASUI , Shigeru KOMAI , Koichi ONO , Kazuyuki OGAWA , Atsushi KAZUNO , Tsuyoshi KIMURA , Hiroshi SEYANAGI
发明人： Tetsuo SHIMOMURA , Masahiko NAKAMORI , Takatoshi YAMADA , Takashi MASUI , Shigeru KOMAI , Koichi ONO , Kazuyuki OGAWA , Atsushi KAZUNO , Tsuyoshi KIMURA , Hiroshi SEYANAGI
IPC分类号： B32B3/26 , B24B9/00 , B24B7/00
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译：本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光，可平坦化，抛光效率高。本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。提供了可以使平面性改善和划痕减少兼容的抛光垫。

4. 发明申请

US20050266226A1 Chemical mechanical polishing pad and method for selective metal and barrier polishing 审中-公开
标题翻译：化学机械抛光垫和选择性金属和屏障抛光方法
公开(公告)号：US20050266226A1
公开(公告)日：2005-12-01
申请号：US10962108
申请日：2004-10-08
申请人： Yaw Obeng
发明人： Yaw Obeng
IPC分类号： B24B37/24 , B24D3/30 , B32B3/00 , B32B3/26 , C08J9/36
CPC分类号： B24B37/24 , B24D3/26 , B24D3/30 , C08J9/36 , C08J2331/04 , Y10T428/249953 , Y10T428/249976
摘要： The present invention is directed, in general, to a polishing pad comprising a polishing body. The polishing body comprises a thermoplastic foam substrate having a surface comprising concave cells. The thermoplastic foam substrate comprises a blend of cross-linked ethylene vinyl acetate copolymer and polyethylene. The thermoplastic foam substrate has a hardness ranging from about 24 Shore A to about 100 Shore A. Other embodiments include a method for preparing the polishing pad, a polishing apparatus that includes the polishing pad, and a method of polishing a semiconductor substrate using the polishing pad.
摘要翻译：本发明总体上涉及包括抛光体的抛光垫。抛光体包括具有包括凹槽的表面的热塑性泡沫基材。热塑性泡沫基材包括交联的乙烯 - 乙酸乙烯酯共聚物和聚乙烯的共混物。热塑性泡沫基材的硬度范围为约24肖氏A至约100肖氏A.其他实施方案包括制备抛光垫的方法，包括抛光垫的抛光装置和使用抛光的半导体基板的抛光方法垫。

5. 发明授权

US3661544A A method for making thermosetting resinous abrasive tools 失效
标题翻译：一种制造热固性研磨工具的方法
公开(公告)号：US3661544A
公开(公告)日：1972-05-09
申请号：US3661544D
申请日：1969-11-28
申请人： BMI LAB INDUSTRY
发明人： WHITAKER NOBLE D
IPC分类号： B24D3/30 , B24D7/00 , B24D18/00 , B24B17/00 , C08G51/12
CPC分类号： B24D3/30 , B24D7/00 , B24D18/0009
摘要： A method for producing an abrasive tool or structure which includes the steps of mixing an abrasive composition containing abrasive particles and, preferably, friable particles, with a liquid, multi-stage, thermosetting resin and coating substantially all of the individual particles with the resin; curing the resin to the B-stage while the resin is in contact with the particles to form a fusible solid coating on the particles and forming individual particles coated with said Bstage resin, and placing said resin coated particles in a mold and heating the particles sufficiently to render the resin tacky and fusible and, concurrently, applying sufficient pressure to form a coherent mass of said particles and curing the resin to a hard infusible state to form a high tensile strength bond between said particles. An abrasive tool composed of abrasive particles and lightweight, easily crushable, friable particles uniformly dispersed throughout the abrasive particles, each of the particles being bonded together with a high strength bond formed by a thermosetting resin cured to a hard and infusible state.
摘要翻译：一种用于生产研磨工具或结构的方法，包括以下步骤：将含有磨料颗粒，优选易碎颗粒的磨料组合物与液体，多级热固性树脂混合并将基本上所有的单个颗粒涂覆在树脂上; 将树脂固化到B阶段，同时树脂与颗粒接触以在颗粒上形成可熔固体涂层并形成涂覆有所述B阶树脂的单个颗粒，并将所述树脂涂覆的颗粒放置在模具中并加热颗粒足以使树脂发粘和可熔，并且同时施加足够的压力以形成所述颗粒的粘结块，并将树脂固化成硬的不可渗透状态，以在所述颗粒之间形成高拉伸强度的粘结。研磨工具由磨料颗粒和均匀分散在磨料颗粒上的轻质，易破碎，易碎的颗粒组成，每个颗粒通过固化至硬质和不熔状态的热固性树脂形成的高强度粘合在一起。

6. 发明申请

US20180318983A1 SYSTEMS AND METHODS FOR MAKING ABRASIVE ARTICLES 审中-公开
公开(公告)号：US20180318983A1
公开(公告)日：2018-11-08
申请号：US15735644
申请日：2016-06-15
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： Geoffrey I. Wilson , Mark R. Nyberg , Jeffery S. Thomford , Ernest L. Thurber , Brian G. Koethe , Charles C. Drange , Robert J. Hnatyk , John T. Boden
IPC分类号： B24D11/02 , B24D11/08 , B24D11/00 , B24D3/34 , B24D3/30
CPC分类号： B24D11/02 , B24D3/30 , B24D3/346 , B24D11/00 , B24D11/005 , B24D11/08 , B24D18/00 , B24D18/0072 , B24D2203/00 , C09K3/1409 , C09K3/1436
摘要： Methods of making an abrasive article. Abrasive particles are loaded to a distribution tool including a plurality of walls defining a plurality of slots. Each slot is open to a lower side of the tool. The loaded particles are distributed from the distribution tool to a major face of a backing web below the lower side and moving relative to the tool. At least a majority of the particles distributed from the tool undergo an orientation sequence in which each particle first enters one of the slots. The particle then passes partially through the slot such that a first portion is beyond the lower side and in contact with the major face, and a second portion within the slot. The sequence then includes the particle remaining in simultaneous contact with one of the walls and the major face for a dwell period while the web moves relative to the tool.

7. 发明申请

US20140073230A1 Large Diameter Cutting Tool 有权
标题翻译：大直径切割工具
公开(公告)号：US20140073230A1
公开(公告)日：2014-03-13
申请号：US14012171
申请日：2013-08-28
申请人： Kelley McNeal , Charles Deleuze , Andrew B. Schoch , Siddharth Srinivasan
发明人： Kelley McNeal , Charles Deleuze , Andrew B. Schoch , Siddharth Srinivasan
IPC分类号： B24D5/12
CPC分类号： B24D5/12 , B24D3/06 , B24D3/30 , B24D3/342 , B24D3/346 , B24D5/04 , B24D5/123
摘要： An abrasive cutting tool includes a body in a shape of a large diameter disk having an outer diameter of at least about 60 centimeters. The body has an aspect ratio defined as a ratio (D:T) between the outer diameter to an axial thickness of the body of at least about 10:1. The body includes an abrasive portion having a bond material and abrasive particles contained within the bond material. The abrasive portion also includes a first filler having iron and sulfur with an average particle size of not greater than about 40 microns. The body also includes a reinforcing member and a Thermal Adhesion Factor (TAF) of at least about 30%.
摘要翻译：研磨切削工具包括具有至少约60厘米的外径的大直径圆盘形状的主体。身体的长宽比定义为外径与身体轴向厚度之比（D：T）至少约为10：1。主体包括具有粘合材料的磨料部分和包含在粘结材料内的磨料颗粒。研磨部分还包括具有平均粒度不大于约40微米的铁和硫的第一填料。身体还包括至少约30％的加强构件和热粘附因子（TAF）。

8. 发明申请

US20140057534A1 RESIN BONDED GRINDING WHEEL 审中-公开
标题翻译：树脂粘结砂轮
公开(公告)号：US20140057534A1
公开(公告)日：2014-02-27
申请号：US14111280
申请日：2012-04-17
申请人： Janusz Hajduk , James L. McArdle
发明人： Janusz Hajduk , James L. McArdle
IPC分类号： B24D3/28 , B24D3/10
CPC分类号： B24D3/28 , B24B5/22 , B24D3/10 , B24D3/30 , B24D3/344 , B24D3/346
摘要： A resin bonded grinding wheel suitable for grinding polycrystalline diamond compacts is disclosed. The resin bonded grinding wheel uses a high concentration of diamonds based on a volume percent along with a mixture of hard and soft filler particles to effectively grind the polycrystalline diamond compacts while eliminating or reducing the need to continuously dress the outer surface of the resin bonded grinding wheel.
摘要翻译：公开了一种适用于研磨多晶金刚石压块的树脂粘结砂轮。树脂粘合砂轮使用基于体积百分比的高浓度金刚石以及硬和软填料颗粒的混合物，以有效地研磨多晶金刚石压块，同时消除或减少连续地连接树脂粘合研磨的外表面的需要轮。

9. 发明授权

US08318825B2 Polishing pad and method of producing the same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US08318825B2
公开(公告)日：2012-11-27
申请号：US11466878
申请日：2006-08-24
申请人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura
发明人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura
IPC分类号： C08G18/28
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译：本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光，可平坦化，抛光效率高。本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。提供了可以使平面性改善和划痕减少兼容的抛光垫。

10. 发明申请

US20060280930A1 POLISHING PAD AND METHOD OF PRODUCING THE SAME 有权
公开(公告)号：US20060280930A1
公开(公告)日：2006-12-14
申请号：US11466909
申请日：2006-08-24
申请人： Tetsuo SHIMOMURA , Masahiko NAKAMORI , Takatoshi YAMADA , Takashi Masui , Shigeru KOMAI , Koichi ONO , Kazuyuki OGAWA , Atsushi KAZUNO , Tsuyoshi KIMURA , Hiroshi Seyanagi
发明人： Tetsuo SHIMOMURA , Masahiko NAKAMORI , Takatoshi YAMADA , Takashi Masui , Shigeru KOMAI , Koichi ONO , Kazuyuki OGAWA , Atsushi KAZUNO , Tsuyoshi KIMURA , Hiroshi Seyanagi
IPC分类号： B32B3/26 , B24B9/00 , B24B7/00
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.

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