会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明授权
    • Method of forming piezoelectric resin film
    • 形成压电树脂薄膜的方法
    • US08048493B2
    • 2011-11-01
    • US11823906
    • 2007-06-29
    • Takeshi HabuTakayuki Sasaki
    • Takeshi HabuTakayuki Sasaki
    • H05H1/00
    • C08G73/1064C08G18/3243C08G18/7657H01L41/257H01L41/45
    • An objective is to provide a method of forming a piezoelectric resin film produced at low cost, and specifically to provide the method in which a large-area piezoelectric resin film is produced at low cost, and at reduced investment in facilities. Disclosed is a method of forming a piezoelectric resin film possessing the steps of polymerizing a monomer at a temperature of 5-60° C. to obtain a resin having a polymerization degree of 4-300, and a polarity group possessing one bond selected from a urea bond, an ester bond, an amide bond and an imide bond, coating the resin onto a substrate; and further polymerizing the resin at 70-250° C. while conducting a poling treatment.
    • 目的是提供一种形成低成本制造的压电树脂膜的方法,具体地提供了以低成本生产大面积压电树脂膜并且在设备中投资减少的方法。 公开了一种形成压电树脂膜的方法,所述压电树脂膜具有在5-60℃的温度下使单体聚合以获得聚合度为4-300的树脂和具有一个键的极性基团的步骤,所述极性基团选自 脲键,酯键,酰胺键和酰亚胺键,将树脂涂布到基底上; 并进一步在70-250℃聚合树脂,同时进行极化处理。