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1. 发明授权

US09075213B2 Plastic optical fiber cable 有权
标题翻译：塑料光缆
公开(公告)号：US09075213B2
公开(公告)日：2015-07-07
申请号：US14344368
申请日：2012-09-14
申请人： Tsuyoshi Kimura , Yoshihiro Tsukamoto , Kouji Asano
发明人： Tsuyoshi Kimura , Yoshihiro Tsukamoto , Kouji Asano
IPC分类号： G02B6/44 , G02B6/02 , G02B6/12
CPC分类号： G02B6/443 , G02B6/02033 , G02B6/02395 , G02B6/4436 , G02B6/448 , G02B2006/12069
摘要： Provided is a plastic optical fiber cable including a plastic optical fiber 12 comprising of a core 11A and a cladding 11B, and a jacketing layer covering the plastic optical fiber 12, in which the jacketing layer includes at least two layers of an inner layer 13 and an outer layer 14, the inner layer 13 is formed of a resin comprising of a copolymer of ethylene and a (meth)acrylic compound, and the outer layer 14 is formed of a fluorine-based resin. A plastic optical fiber cable excellent in flame retardance, appearance, and processability at the time of use is obtained from the plastic optical fiber cable described above.
摘要翻译：本发明提供一种塑料光缆，其包括由芯11A和包层11B构成的塑料光纤12，以及覆盖塑料光纤12的护套层，其中护套层包括至少两层内层13和外层14，内层13由乙烯与（甲基）丙烯酸系化合物的共聚物构成的树脂形成，外层14由氟系树脂形成。从上述塑料光缆获得使用时的阻燃性，外观和加工性优异的塑料光纤电缆。

2. 发明申请

US20140213151A1 POLISHING PAD 有权
标题翻译：抛光垫
公开(公告)号：US20140213151A1
公开(公告)日：2014-07-31
申请号：US14241008
申请日：2012-08-24
申请人： Tsuyoshi Kimura
发明人： Tsuyoshi Kimura
IPC分类号： B24B37/20 , H01L21/304 , B24B37/22
CPC分类号： B24B37/205 , B24B37/22 , H01L21/304
摘要： An object of the invention is to provide a polishing pad that is prevented from slurry leaks and has high optical detection accuracy. The present invention relates to a polishing pad comprising a polishing region, a cushion layer, and a support film layered in this order, wherein a light-transmitting region is provided on the support film and in an opening part that passes through the polishing region and the cushion layer; the light-transmitting region has a peripheral part and a recessed part on the surface of a polishing platen-side; the support film is layered on the peripheral part; and the support film is not layered on the recessed part, which remains open.
摘要翻译：本发明的目的是提供一种防止浆料泄漏并具有高光学检测精度的抛光垫。抛光垫技术领域本发明涉及一种抛光垫，其包括依次层叠的研磨区域，缓冲层和支撑膜，其中在所述支撑膜上和穿过所述研磨区域的开口部分设置透光区域，缓冲层; 光透射区域在研磨台板侧的表面上具有周边部分和凹陷部分; 支撑膜层叠在周边部分上; 并且支撑膜不会层叠在保持打开的凹部上。

3. 发明授权

US08517798B2 Polishing pad, method of producing the same and method of producing semiconductor device by using the same 有权
标题翻译：抛光垫，其制造方法以及使用该半导体器件的方法
公开(公告)号：US08517798B2
公开(公告)日：2013-08-27
申请号：US13615065
申请日：2012-09-13
申请人： Tsuyoshi Kimura , Yoshiyuki Nakai , Masahiro Watanabe
发明人： Tsuyoshi Kimura , Yoshiyuki Nakai , Masahiro Watanabe
IPC分类号： B24B49/00
CPC分类号： B24B37/26 , B24D3/32 , Y10T29/49995 , Y10T83/0304 , Y10T409/303808 , Y10T409/304536
摘要： The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.
摘要翻译：本发明提供了一种用于在半导体器件的制造工艺中通过CMP（化学机械抛光）平坦化层间电介质等的抛光垫，制造抛光垫的方法以及通过使用该半导体器件制造半导体器件的方法抛光垫本发明涉及一种半导体晶片抛光垫，该抛光垫在抛光表面上由发泡聚氨酯形成，其中包括侧面和底面的槽的加工表面的表面粗糙度Ra不大于10。

4. 发明申请

US20130017769A1 POLISHING PAD 有权
标题翻译：抛光垫
公开(公告)号：US20130017769A1
公开(公告)日：2013-01-17
申请号：US13639475
申请日：2011-04-07
申请人： Tsuyoshi Kimura
发明人： Tsuyoshi Kimura
IPC分类号： H01L21/304 , B24B37/22
CPC分类号： B24B37/205 , B24B37/22
摘要： An object of the present invention is to provide a polishing pad which enables high accuracy optical end-point detection in a state where polishing is carrying out, and which can prevent slurry leakage from a polishing layer to a cushion layer even in the case of being used for a long period. Another object is to provide a method for producing a semiconductor device using the polishing pad. The present invention relates to a polishing pad in which a polishing layer having a polishing region and a light-transmitting region, and a cushion layer having a through hole are laminated via a double-sided adhesive sheet such that the light-transmitting region and the through hole are laid one upon another, wherein a transparent member is stuck on an adhesive layer of the double-sided adhesive sheet in the through hole.
摘要翻译：本发明的目的是提供一种抛光垫，其能够在进行抛光的状态下进行高精度的光学终点检测，并且即使在存在如下的情况下也能够防止浆料从抛光层向缓冲层的泄漏使用了很长时间。另一个目的是提供一种使用抛光垫制造半导体器件的方法。本发明涉及一种抛光垫，其中具有抛光区域和透光区域的抛光层和具有通孔的缓冲层通过双面粘合片层压，使得透光区域和通孔彼此放置，其中透明构件粘附在通孔中的双面粘合片的粘合剂层上。

5. 发明授权

US08303372B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US08303372B2
公开(公告)日：2012-11-06
申请号：US12439135
申请日：2007-08-22
申请人： Atsushi Kazuno , Tetsuo Shimomura , Yoshiyuki Nakai , Kazuyuki Ogawa , Tsuyoshi Kimura
发明人： Atsushi Kazuno , Tetsuo Shimomura , Yoshiyuki Nakai , Kazuyuki Ogawa , Tsuyoshi Kimura
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24D3/26 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G18/7621 , C08J9/30 , C08J2375/04 , C08L83/00 , C08G18/3243
摘要： A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.
摘要翻译：具有优异的平坦化性能和耐磨性的抛光垫包括包括具有细孔的聚氨酯泡沫的抛光层。聚氨酯泡沫体是（1）异氰酸酯封端的预聚物（A）与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ的非发泡聚氨酯的反应的固化产物峰温度为100℃以上，（2）能与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ峰的非发泡聚氨酯的异氰酸酯封端的预聚物（B）温度为40℃以下，（3）4,4'-亚甲基双（邻氯苯胺）和异氰酸酯封端的预聚物（A）和（B）以（A）/（B）比为50/50至90/10（重量％）。如此制成的焊盘用于制造半导体器件。

6. 发明授权

US08023789B2 Plastic optical fiber cable and method of signal transmission using the same 有权
标题翻译：塑料光缆和信号传输方法采用相同的方式
公开(公告)号：US08023789B2
公开(公告)日：2011-09-20
申请号：US12311360
申请日：2007-09-28
申请人： Amane Aoyagi , Yoshihito Tsukamoto , Yasushi Fujishige , Yoshiko Maeda , Tsuyoshi Kimura
发明人： Amane Aoyagi , Yoshihito Tsukamoto , Yasushi Fujishige , Yoshiko Maeda , Tsuyoshi Kimura
IPC分类号： G02B6/44 , G02B6/036
CPC分类号： G02B1/045 , G02B6/02033
摘要： A plastic optical fiber cable includes: a bare optical fiber including a core made of a poly(methyl methacrylate) or a copolymer including methyl methacrylate as a major component and a cladding layer including, at least in the outermost layer, a layer made of a certain fluorine-containing olefin-based resin; and a coating layer provided on the outer surface thereof. The coating layer includes a protective coating layer, a light blocking coating layer, and a functional coating layer, the layers being provided in the order mentioned from inner side. The protective coating layer is made of a certain resin material. The light blocking coating layer is made of a nylon-based resin including, as a major component, nylon 11 or nylon 12, the nylon-based resin containing monomer and oligomer compounds derived from the nylon-based resin in an amount of a certain range. The functional coating layer is made of a nylon-based resin composition having a crystalline melting point within a certain range, the nylon-based resin composition containing a certain amount of melamine cyanurate or bromine atoms and further containing a certain amount of inorganic chromatic pigments, or the layer is made of a nylon-based resin composition having a crystalline melting point of within a certain range and an oxygen transmission rate within a certain range.
摘要翻译：塑料光缆包括：包括由聚（甲基丙烯酸甲酯）制成的芯或包含甲基丙烯酸甲酯作为主要成分的共聚物的裸光纤，以及至少在最外层中包含由某些含氟烯烃类树脂; 以及设置在其外表面上的涂层。涂层包括保护涂层，遮光涂层和功能性涂层，这些层以从内侧提到的顺序提供。保护涂层由特定的树脂材料制成。防光涂层由尼龙类树脂制成，尼龙系树脂包括尼龙11或尼龙12作为主要成分，尼龙系树脂含有单体和衍生自尼龙系树脂的低聚物化合物，其量为一定范围。功能性涂层由结晶熔点在一定范围内的尼龙系树脂组合物构成，尼龙系树脂组合物含有一定量的氰尿酸三聚氰胺或溴原子，并含有一定量的无机彩色颜料，或者该层由结晶熔点在一定范围内且氧气透过率在一定范围内的尼龙类树脂组合物制成。

7. 发明授权

US07651761B2 Grinding pad and method of producing the same 有权
标题翻译：研磨垫及其制造方法
公开(公告)号：US07651761B2
公开(公告)日：2010-01-26
申请号：US10494249
申请日：2002-10-03
申请人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura , Hiroshi Seyanagi
发明人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura , Hiroshi Seyanagi
IPC分类号： B32B3/26 , B32B3/00
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译：本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光，可平坦化，抛光效率高。本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。提供了可以使平面性改善和划痕减少兼容的抛光垫。

8. 发明申请

US20090137188A1 POLISHING PAD 有权
标题翻译：抛光垫
公开(公告)号：US20090137188A1
公开(公告)日：2009-05-28
申请号：US12294391
申请日：2007-05-15
申请人： Takeshi Fukuda , Junji Hirose , Yoshiyuki Nakai , Tsuyoshi Kimura
发明人： Takeshi Fukuda , Junji Hirose , Yoshiyuki Nakai , Tsuyoshi Kimura
IPC分类号： B24B49/04 , B24B49/12 , B24D11/00
CPC分类号： B24B37/205
摘要： A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer with this polishing pad. The polishing pad has a polishing layer containing a polishing region and a light-transmitting region, wherein the light-transmitting region includes a polyurethane resin having an aromatic ring density of 2 wt % or less, and the light transmittance of the light-transmitting region is 30% or more in the overall range of wavelengths of 300 to 400 nm.
摘要翻译：抛光垫在宽波长范围（特别是在短波长侧）提供优异的光学检测精度特性。半导体器件的制造方法包括利用该研磨垫对半导体晶片的表面进行研磨的工序。抛光垫具有包含抛光区域和透光区域的抛光层，其中透光区域包括芳族环密度为2重量％以下的聚氨酯树脂，透光区域的透光率在波长为300〜400nm的整个范围内为30％以上。

9. 发明申请

US20080223540A1 SUPPLY METHOD AND SUPPLY APPARATUS OF SEMI-SOLID METAL 审中-公开
标题翻译：半固体金属的供应方法和供应设备
公开(公告)号：US20080223540A1
公开(公告)日：2008-09-18
申请号：US12046117
申请日：2008-03-11
申请人： Kenji Ohwada , Tomonori Sakai , Tsuyoshi Kimura , Koichi Kuroki
发明人： Kenji Ohwada , Tomonori Sakai , Tsuyoshi Kimura , Koichi Kuroki
IPC分类号： B22D27/09 , B22D17/20
CPC分类号： B22D17/007
摘要： A supply apparatus supplies a semi-solid metal to a molding apparatus having an injection sleeve formed with an opening portion and a plunger provided progressively/regressively at an inner portion of the injection sleeve. The supply apparatus includes a crucible in a shape of a cylinder containing a semi-solid metal, a carry arm for grabbing to move the crucible, and a control apparatus for controlling the carry arm. The control apparatus inserts a front end portion of a gutter mounted to the crucible into the opening portion of the injection sleeve by a predetermined angle to inject the semi-solid metal to a side of a direction of advancing the plunger more than at a position formed with the opening portion at inside of the injection sleeve.
摘要翻译：供给装置向具有在开口部形成的注射套筒和在注射套筒的内部逐渐/回退地设置的柱塞的成型装置供给半固体金属。供给装置包括：坩埚，其具有包含半固体金属的圆柱体，用于抓取以移动坩埚的携带臂;以及用于控制携带臂的控制装置。控制装置将安装在坩埚上的沟槽的前端部分插入注射套筒的开口部分中预定的角度，以将半固体金属注射到比所形成的位置更长的柱塞方向的一侧其中开口部分在注射套筒的内部。

10. 发明授权

US07221707B2 Image processing apparatus employing hierarchical encoding 有权
公开(公告)号：US07221707B2
公开(公告)日：2007-05-22
申请号：US09924015
申请日：2001-08-07
申请人： Tsuyoshi Kimura
发明人： Tsuyoshi Kimura
IPC分类号： H04N7/32
CPC分类号： G06T9/007
摘要： When image data to be encoded is divided into image data items in a plurality of hierarchies and an image data item in a given hierarchy among the divided image data items in the plurality of hierarchies is to be encoded as an intra picture, an image encoding apparatus and an image decoding apparatus provided by the invention allow improvement in efficiency of encoding the image data item in the given hierarchy. When input image data is divided into image data items in a plurality of hierarchies for encoding and a higher hierarchy image data item is to be encoded as an intra picture, a control circuit switches a switch so that reference data is supplied to a subtracting circuit. The subtracting circuit subtracts the reference data from the higher hierarchy image data item outputted from a preprocessing circuit. Encoding is performed on the subtraction result of the subtracting circuit, i.e. differential image data.

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