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1. 发明申请

US20150059253A1 POLISHING PAD 有权
标题翻译：抛光垫
公开(公告)号：US20150059253A1
公开(公告)日：2015-03-05
申请号：US14537497
申请日：2014-11-10
申请人： TOYO TIRE & RUBBER CO., LTD.
发明人： Yoshiyuki NAKAI , Tsuyoshi KIMURA , Atsushi KAZUNO , Kazuyuki OGAWA , Tetsuo SHIMOMURA
IPC分类号： B24B37/24 , B24D3/32
CPC分类号： B24B37/24 , B24B29/00 , B24D3/26 , B24D3/32 , C08G18/10 , C08G18/14 , C08G18/4854 , C08G18/6674 , C08G18/724 , C08G18/7831 , C08G18/3814 , C08G18/792
摘要： A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.
摘要翻译：能够在吸收水分或水的同时保持高水平的尺寸稳定性的抛光垫包括包含具有细孔的聚氨酯泡沫的抛光层，其中聚氨酯泡沫包括异氰酸酯封端的预聚物（a）的反应的固化产物，，聚合二异氰酸酯和扩链剂，异氰酸酯封端的预聚物（a）包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇。制造这种抛光垫的方法包括将含有异氰酸酯封端的预聚物的第一组分与含有扩链剂的第二组分混合并固化该混合物以形成聚氨酯泡沫。如此制成的焊盘用于制造半导体器件。

2. 发明授权

US08602846B2 Polishing pad and a method for manufacturing the same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US08602846B2
公开(公告)日：2013-12-10
申请号：US13552346
申请日：2012-07-18
申请人： Takeshi Fukuda , Junji Hirose , Kenji Nakamura , Masato Doura , Akinori Sato
发明人： Takeshi Fukuda , Junji Hirose , Kenji Nakamura , Masato Doura , Akinori Sato
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24D3/26 , B24D11/001
摘要： A polishing pad of excellent durability and adhesion between the polishing layer and the base material layer includes a polishing layer arranged on a base material layer, wherein the polishing layer includes a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 μm. The polyurethane foam includes an isocyanate component and an active hydrogen-containing compound as starting material components, and the active hydrogen-containing compound includes 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g.
摘要翻译：抛光层和基材层之间具有优异的耐久性和粘附性的抛光垫包括布置在基材层上的抛光层，其中抛光层包括热固性聚氨酯泡沫，其具有平均泡孔直径为20至 300个妈妈聚氨酯泡沫包括异氰酸酯组分和含活性氢的化合物作为起始原料组分，并且含活性氢的化合物包括30至85重量％的具有2-4个官能团的高分子量多元醇和羟基值为20〜100mg KOH / g。

3. 发明授权

US08303372B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US08303372B2
公开(公告)日：2012-11-06
申请号：US12439135
申请日：2007-08-22
申请人： Atsushi Kazuno , Tetsuo Shimomura , Yoshiyuki Nakai , Kazuyuki Ogawa , Tsuyoshi Kimura
发明人： Atsushi Kazuno , Tetsuo Shimomura , Yoshiyuki Nakai , Kazuyuki Ogawa , Tsuyoshi Kimura
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24D3/26 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G18/7621 , C08J9/30 , C08J2375/04 , C08L83/00 , C08G18/3243
摘要： A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.
摘要翻译：具有优异的平坦化性能和耐磨性的抛光垫包括包括具有细孔的聚氨酯泡沫的抛光层。聚氨酯泡沫体是（1）异氰酸酯封端的预聚物（A）与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ的非发泡聚氨酯的反应的固化产物峰温度为100℃以上，（2）能与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ峰的非发泡聚氨酯的异氰酸酯封端的预聚物（B）温度为40℃以下，（3）4,4'-亚甲基双（邻氯苯胺）和异氰酸酯封端的预聚物（A）和（B）以（A）/（B）比为50/50至90/10（重量％）。如此制成的焊盘用于制造半导体器件。

4. 发明申请

US20080293345A1 Porous abrasive articles with agglomerated abrasives and method for making the agglomerated abrasives 审中-公开
标题翻译：具有附聚研磨剂的多孔磨料制品和用于制造附聚磨料的方法
公开(公告)号：US20080293345A1
公开(公告)日：2008-11-27
申请号：US12221074
申请日：2008-07-31
申请人： Eric Bright , Mianxue Wu
发明人： Eric Bright , Mianxue Wu
IPC分类号： B24B5/00 , B24B1/00 , B02C11/08
CPC分类号： B24B5/363 , B24D3/18 , B24D3/26 , B24D3/32 , B24D18/00 , C09K3/1436
摘要： A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintered agglomerates having a loose packing density of ≦1.6 g/cc and three-dimensional shape; a bond material; and about 35-80 volume % total porosity, including at least 30 volume % interconnected porosity. Methods for making the sintered agglomerates and abrasive tools containing the sintered agglomerates are described.
摘要翻译：具有可流体流动的结构的粘合研磨工具包括多个磨粒和粘结材料的烧结附聚物，所述粘合材料的特征在于熔融温度在500至1400℃之间，并且所述烧结附聚物具有松散填充密度<= 1.6g / cc和三维形状; 债券资料; 和约35-80体积％的总孔隙率，包括至少30体积％互连的孔隙率。描述了制备烧结附聚物和含有烧结附聚物的研磨工具的方法。

5. 发明申请

US20080066387A1 Abrasive Articles with Novel Structures and Methods for Grinding 审中-公开
标题翻译：具有新结构的研磨制品和研磨方法
公开(公告)号：US20080066387A1
公开(公告)日：2008-03-20
申请号：US11862946
申请日：2007-09-27
申请人： Anne Bonner , Eric Bright , Edward Lambert , Dean Matsumoto , Xavier Orlhac , David Sheldon
发明人： Anne Bonner , Eric Bright , Edward Lambert , Dean Matsumoto , Xavier Orlhac , David Sheldon
IPC分类号： B24D3/04 , B24D3/02
CPC分类号： B24D3/20 , B24B5/363 , B24D3/18 , B24D3/26 , B24D3/32 , B24D18/00 , C09K3/1436
摘要： Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mechanical strength and grinding performance. Methods for making the abrasive tools utilizing agglomerated abrasive grain are described.
摘要翻译：具有可渗透流体流动的新型多孔结构的粘结研磨工具包括相对较小的磨粒和粘结体积百分比以及较低硬度等级，但其特征在于优异的机械强度和研磨性能。描述了使用附聚磨粒制造研磨工具的方法。

6. 发明申请

US20070214592A1 PAD, SYSTEM AND METHOD FOR POLISHING, BUFFING, COMPOUNDING AND GLAZING 审中-公开
标题翻译：抛光，抛光，复合和玻璃的系统和方法
公开(公告)号：US20070214592A1
公开(公告)日：2007-09-20
申请号：US11686717
申请日：2007-03-15
申请人： Lewyn B. BOLER
发明人： Lewyn B. BOLER
IPC分类号： B24D13/14
CPC分类号： B24D3/26 , B24D13/147 , B24D13/20
摘要： An pad for polishing, buffing, compounding, and glazing comprises: a working pad of open-cell foam or absorbent natural padding; an insert affixed to said rear surface of said working pad, said insert having a coupling disposed in the center thereof for engaging a corresponding coupling of a drive shaft of a driving device; a first carrier layer disposed between said rear surface of said working pad and said insert; a first affixing layer disposed between said carrier layer and said rear surface of said working pad; a second affixing layer disposed between said insert and said first carrier layer so as to fix said insert to said first carrier layer; a second carrier layer disposed upon the side of said insert opposite said working pad; a third affixing layer disposed between said second carrier layer and said insert wherein said insert has an aperture passing therethrough to allow for material to pass therethrough to secure said insert to one or more of said first carrier layer and said second carrier layer.
摘要翻译：用于抛光，抛光，复合和上光的垫包括：开孔泡沫或吸收剂天然填料的工作垫; 固定在所述工作垫的所述后表面上的插入件，所述插入件具有设置在其中心的联接件，用于与驱动装置的驱动轴的相应联接件接合; 设置在所述工作垫的所述后表面和所述插入件之间的第一载体层; 设置在所述载体层和所述工作垫的所述后表面之间的第一固定层; 第二固定层，设置在所述插入件和所述第一载体层之间，以将所述插入物固定到所述第一载体层; 第二载体层，设置在与所述工作垫相对的所述插入件的侧面上; 设置在所述第二载体层和所述插入件之间的第三固定层，其中所述插入件具有穿过其中的孔，以允许材料通过，以将所述插入件固定到所述第一载体层和所述第二载体层中的一个或多个。

7. 发明申请

US20060154579A1 Thermoplastic chemical mechanical polishing pad and method of manufacture 审中-公开
标题翻译：热塑性化学机械抛光垫及其制造方法
公开(公告)号：US20060154579A1
公开(公告)日：2006-07-13
申请号：US11033690
申请日：2005-01-12
申请人： Daniel Marks , John Bare , Anthony Clark , Edward Atkinson , Timothy Blotkamp
发明人： Daniel Marks , John Bare , Anthony Clark , Edward Atkinson , Timothy Blotkamp
IPC分类号： B24B29/00
CPC分类号： B24B37/24 , B24D3/26
摘要： The present invention is directed, in general, to a chemical mechanical polishing pad comprising a closed-cell thermoplastic foam polishing body. The polishing body comprises an ethylene vinyl acetate block copolymer. The ethylene vinyl acetate block copolymer comprises a vinyl acetate content ranging from about 1 to about 18 wt %. The closed-cell thermoplastic foam polishing body also comprises filler particles comprising an average size ranging from about 1 to about 20 microns. Other aspects of the invention comprise a method for manufacturing the above-described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad.
摘要翻译：本发明一般涉及包括闭孔热塑性泡沫抛光体的化学机械抛光垫。抛光体包括乙烯 - 乙酸乙烯酯嵌段共聚物。乙烯乙酸乙烯酯嵌段共聚物包含约1-约18重量％的乙酸乙烯酯含量。闭孔热塑性泡沫抛光体还包括平均尺寸为约1至约20微米的填料颗粒。本发明的其它方面包括制造上述化学机械抛光垫的方法和包括化学机械抛光垫的化学机械抛光装置。

8. 发明授权

US07074115B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US07074115B2
公开(公告)日：2006-07-11
申请号：US10937914
申请日：2004-09-10
申请人： David B. James , Mary Jo Kulp
发明人： David B. James , Mary Jo Kulp
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24D3/26 , C08G18/10 , C08G18/4854 , C08G18/3808
摘要： A polishing pad is useful planarizing semiconductor substrates. The polishing pad comprises a polymeric material having a porosity of at least 0.1 volume percent, a KEL energy loss factor at 40° C. and 1 rad/sec of 385 to 750 1/Pa and a modulus E′ at 40° C. and 1 rad/sec of 100 to 400 MPa.
摘要翻译：抛光垫是有用的平面化半导体衬底。抛光垫包括具有至少0.1体积％的孔隙率，40℃下的KEL能量损耗系数和385-7501 / Pa的1弧度/秒和40℃的模量E'的聚合材料，以及 1rad / sec为100〜400MPa。

9. 发明授权

US06998166B2 Polishing pad with oriented pore structure 有权
标题翻译：具有取向孔结构的抛光垫
公开(公告)号：US06998166B2
公开(公告)日：2006-02-14
申请号：US10463730
申请日：2003-06-17
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B32B27/00 , D06N7/04 , B24D11/00 , B24D3/00
CPC分类号： B24B37/24 , B24D3/26 , B24D3/32 , Y10T428/24273 , Y10T428/24355 , Y10T428/24446 , Y10T428/249953 , Y10T428/268 , Y10T428/31551 , Y10T428/31591
摘要： The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.
摘要翻译：本发明提供了一种用于化学机械抛光的抛光垫，其包括主体，抛光表面和多个细长孔，其中约10％或更多的细长孔具有约3:1或更大的纵横比，并且基本上在与抛光表面共面的方向上取向。本发明还提供一种抛光衬底的方法。

10. 发明授权

US06869350B2 Polishing pads and methods relating thereto 有权
标题翻译：抛光垫及其相关方法
公开(公告)号：US06869350B2
公开(公告)日：2005-03-22
申请号：US10659889
申请日：2003-09-11
申请人： John H. V. Roberts , David B. James , Lee Melbourne Cook
发明人： John H. V. Roberts , David B. James , Lee Melbourne Cook
IPC分类号： B24B37/26 , B24B41/047 , B24D3/26 , B24D3/28 , B24D13/14 , B24B1/00
CPC分类号： B24D3/28 , B24B37/26 , B24B41/047 , B24D3/26
摘要： This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
摘要翻译：本发明描述了可用于制造半导体器件等的改进的抛光垫。本发明的垫具有有利的亲水性抛光材料，并且具有创新的表面形貌和纹理，其通常改善了可预测性和抛光性能。

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