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    • 4. 发明申请
    • FUSED NITROGEN-COMPRISING HETEROCYCLIC COMPOUND
    • 熔融氮化物杂环化合物
    • US20100234351A1
    • 2010-09-16
    • US12280228
    • 2007-02-22
    • Masaki SetoTomohiro Ohashi
    • Masaki SetoTomohiro Ohashi
    • A61K31/55C07D487/04A61P35/00A61K31/519
    • C07D487/04
    • A compound of the formula: wherein ring A is a 7-membered or 8-membered nitrogen-containing ring optionally further substituted, ring B is an optionally substituted aryl group or an optionally substituted heteroaryl group, X1 is a group represented by —NR3—Y1—, —O—, —S—, —SO—, —SO2— or —CHR3— wherein R3 is a hydrogen atom or an optionally substituted aliphatic hydrocarbon group, or R3 may be bonded to the carbon atom of ring B to form an optionally substituted ring structure, and Y1 is a bond or an optionally substituted alkylene, R1 is a hydrogen atom, or an optionally substituted group bonded via a carbon atom or a sulfur atom, the formula shows a single bond or a double bond, when R2 is —R2, R2 is a hydrogen atom, or an optionally substituted group bonded via a carbon atom, a nitrogen atom, an oxygen atom or a sulfur atom, and when R2 is ═R2, R2 is an oxo group, an optionally substituted alkylidene group, or an optionally substituted imino group.
    • 下式的化合物:其中环A为任选进一步取代的7-元或8-元含氮环,环B为任选取代的芳基或任选取代的杂芳基,X 1为-NR 3 - Y 1,-O - , - S - , - SO - , - SO 2 - 或-CHR 3 - ,其中R 3是氢原子或任选取代的脂族烃基,或者R 3可以键合到环B的碳原子上以形成 任选取代的环结构,并且Y 1是键或任选取代的亚烷基,R 1是氢原子或经由碳原子或硫原子键合的任选取代的基团,该式表示单键或双键,当 R2是-R2,R2是氢原子或通过碳原子,氮原子,氧原子或硫原子键合的任选取代的基团,当R 2是= R 2时,R 2是氧代基, 亚烷基或任选取代的亚氨基。
    • 6. 发明申请
    • VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD
    • 真空加工设备和真空加工方法
    • US20130053997A1
    • 2013-02-28
    • US13236818
    • 2011-09-20
    • Tomohiro OhashiAkitaka MakinoHiroho KitadaHideki Kihara
    • Tomohiro OhashiAkitaka MakinoHiroho KitadaHideki Kihara
    • B25J9/10B25J13/08
    • H01L21/68H01L21/67742Y10S901/03Y10S901/46
    • A vacuum processing apparatus includes a robot connected to a vacuum container to carry a wafer on one of its two arms to or from a processing chamber; a unit to detect an amount of deviation of the wafer from a predetermined wafer mounting position on the arm that may occur when the robot carries the wafer into or out of the processing chamber; and an adjusting device to adjust the operation of the robot based on the detected amount of deviation. The adjusting device adjusts the robot operation based on the result of a teaching operation performed in advance. After being subjected to the initial teaching operation, the robot again undergoes a second teaching operation according to the information on the amount of wafer position deviation that is detected by moving the wafer in a predetermined transfer pattern, before the wafer processing is performed.
    • 真空处理装置包括连接到真空容器以将其两个臂中的一个上的晶片携带到处理室或从处理室移动的机器人; 用于检测当机器人将晶片进入或离开处理室时可能发生的晶片与在臂上的预定晶片安装位置的偏移量的单元; 以及基于检测到的偏差量来调整机器人的操作的调整装置。 调整装置根据预先执行的教学动作的结果调整机器人的动作。 在进行初始教导操作之后,根据关于在执行晶片处理之前通过以预定的传送图案移动晶片来检测的晶片位置偏差量的信息,机器人再次进行第二示教操作。
    • 7. 发明授权
    • Vacuum chamber
    • 真空室
    • US08532818B2
    • 2013-09-10
    • US12712861
    • 2010-02-25
    • Tomohiro OhashiTsutomu NakamuraHidenobu TanimuraMichiaki Kobayashi
    • Tomohiro OhashiTsutomu NakamuraHidenobu TanimuraMichiaki Kobayashi
    • G06F7/00
    • H01L21/67766H01L21/67778
    • A vacuum chamber includes: a vacuum vessel arranged at the backward side, where a wafer of a processing subject is processed inside an internal processing chamber; a transfer chamber arranged at the forward side, where said wafer is transferred at the inside thereof under atmospheric pressure; a cassette stage arranged at the forward of this transfer chamber, where a cassette storing said wafer is mounted; a lock chamber connected with said transfer chamber at the backward of said transfer chamber; a robot arranged inside said transfer chamber, where said wafer is transferred between said cassette and said lock chamber; and an aligning machine for making position of said wafer fit with the predetermined position, wherein the wafer is transferred to said lock chamber, after performing alignment of said wafer on said aligning machine, in the case where displacement amount of position of this wafer is larger than the predetermined value.
    • 真空室包括:设置在后方的真空容器,处理对象的晶片在内部处理室内处理; 传送室,其布置在前侧,其中所述晶片在其大气压下在其内部传送; 设置在该传送室前方的盒级,其中安装有存储所述晶片的盒; 在所述传送室的后方与所述传送室连接的锁定室; 布置在所述传送室内部的机器,其中所述晶片在所述盒和所述锁定室之间传送; 以及用于使所述晶片的位置与所述预定位置配合的对准机,其中在所述晶片位于所述对准机器的位置的位移量较大的情况下,在将所述晶片对准所述对准机器之后,将所述晶片转移到所述锁定室 超过预定值。
    • 9. 发明授权
    • Wafer processing based on sensor detection and system learning
    • 基于传感器检测和系统学习的晶片处理
    • US08897906B2
    • 2014-11-25
    • US13236818
    • 2011-09-20
    • Tomohiro OhashiAkitaka MakinoHiroho KitadaHideki Kihara
    • Tomohiro OhashiAkitaka MakinoHiroho KitadaHideki Kihara
    • H01L21/68H01L21/677
    • H01L21/68H01L21/67742Y10S901/03Y10S901/46
    • A vacuum processing apparatus includes a robot connected to a vacuum container to carry a wafer on one of its two arms to or from a processing chamber; a unit to detect an amount of deviation of the wafer from a predetermined wafer mounting position on the arm that may occur when the robot carries the wafer into or out of the processing chamber; and an adjusting device to adjust the operation of the robot based on the detected amount of deviation. The adjusting device adjusts the robot operation based on the result of a teaching operation performed in advance. After being subjected to the initial teaching operation, the robot again undergoes a second teaching operation according to the information on the amount of wafer position deviation that is detected by moving the wafer in a predetermined transfer pattern, before the wafer processing is performed.
    • 真空处理装置包括连接到真空容器以将其两个臂中的一个上的晶片携带到处理室或从处理室移动的机器人; 用于检测当机器人将晶片进入或离开处理室时可能发生的晶片与在臂上的预定晶片安装位置的偏移量的单元; 以及基于检测到的偏差量来调整机器人的操作的调整装置。 调整装置根据预先执行的教学动作的结果调整机器人的动作。 在进行初始教导操作之后,根据关于在执行晶片处理之前通过以预定的传送图案移动晶片来检测的晶片位置偏差量的信息,机器人再次进行第二示教操作。
    • 10. 发明申请
    • FUSED HETEROCYCLIC COMPOUND
    • 熔融杂环化合物
    • US20100004238A1
    • 2010-01-07
    • US12518596
    • 2007-12-11
    • Tomoyasu IshikawaHiroshi BannoYouichi KawakitaTomohiro OhashiOsamu Kurasawa
    • Tomoyasu IshikawaHiroshi BannoYouichi KawakitaTomohiro OhashiOsamu Kurasawa
    • A61K31/5377C07D487/04A61K31/519A61K31/4985
    • C07D487/04
    • The present invention provides a fused heterocyclic compound having a tyrosine kinase inhibitory action, which is represented by the formula: wherein R1 is a hydrogen atom, a halogen atom, or an optionally substituted group bonded via a carbon atom, a nitrogen atom or an oxygen atom; R2 is a hydrogen atom, or an optionally substituted group bonded via a carbon atom or a sulfur atom, or R1 and R2, or R2 and R3 are optionally bonded to each other to form an optionally substituted ring structure; R3 is a hydrogen atom or an optionally substituted aliphatic hydrocarbon group, or R3 is optionally bonded to the carbon atom on ring A to form an optionally substituted ring structure; ring A is an optionally substituted benzene ring; and ring B is (i) an optionally substituted fused ring, or (ii) a pyridine ring having optionally substituted carbamoyl (the pyridine ring is optionally further substituted).
    • 本发明提供具有酪氨酸激酶抑制作用的稠合杂环化合物,其由下式表示:其中R1是氢原子,卤原子或经由碳原子,氮原子或氧键键合的任意取代的基团 原子; R2是氢原子,或通过碳原子或硫原子键合的任选取代的基团,或者R 1和R 2,或R 2和R 3相互结合形成任选取代的环结构; R3是氢原子或任选取代的脂族烃基,或R3任选地键合到环A上的碳原子上以形成任选取代的环结构; 环A是任选取代的苯环; 和环B是(i)任选取代的稠合环,或(ii)具有任选取代的氨基甲酰基的吡啶环(吡啶环任选进一步被取代)。