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    • 3. 发明授权
    • Virtual ground EPROM structure
    • 虚拟地EPROM结构
    • US06175519B1
    • 2001-01-16
    • US09359197
    • 1999-07-22
    • Tao Cheng LuMam Tsung WangChin Hsi LinFul Long Ni
    • Tao Cheng LuMam Tsung WangChin Hsi LinFul Long Ni
    • G11C1606
    • G11C16/0491G11C5/063
    • In a virtual ground semiconductor memory device such as an EPROM or a Flash EPROM, a program disturb inhibited unit is operatively connected to a memory array. The memory array includes a plurality of metal virtual ground and bit lines, with at least two bit line selection transistors connected to each of the metal lines. The program disturb inhibited is connected to each virtual ground line and each bit line. In this structure, one metal pitch is connected to two buried diffusion lines. The program inhibited unit includes a plurality of program disturb inhibited transistors, wherein each transistor is connected between a virtual ground and a bit line. A DWL and a DWR dummy line are connected to control the plurality of program disturb inhibited transistors. By combining the program disturb inhibit unit with the memory array, a conventional array structure which has only been suitable for MROM applications can be applied to an EPROM or a Flash EEPROM, allowing the cell size to be reduced.
    • 在诸如EPROM或闪存EPROM的虚拟地面半导体存储器件中,程序干扰抑制单元可操作地连接到存储器阵列。 存储器阵列包括多个金属虚拟接地和位线,其中至少两个位线选择晶体管连接到每个金属线。 禁止的程序干扰连接到每个虚拟接地线和每个位线。 在这种结构中,一个金属间距连接到两个掩埋的扩散线。 程序禁止单元包括多个编程干扰禁止晶体管,其中每个晶体管连接在虚拟地和位线之间。 连接DWL和DWR虚拟线以控制多个编程干扰被禁止的晶体管。 通过将编程干扰抑制单元与存储器阵列组合,仅适用于MROM应用的常规阵列结构可以应用于EPROM或闪速EEPROM,从而可以减小单元大小。
    • 4. 发明授权
    • 8 bit per cell non-volatile semiconductor memory structure utilizing trench technology and dielectric floating gate
    • 8位每单元非易失性半导体存储器结构利用沟槽技术和介质浮栅
    • US06204529B1
    • 2001-03-20
    • US09384482
    • 1999-08-27
    • Hsing Lan LungTao Cheng LuMam Tsung Wang
    • Hsing Lan LungTao Cheng LuMam Tsung Wang
    • H01L218247
    • H01L27/11568H01L27/115H01L29/7923H01L29/7926
    • The present application discloses a non-volatile semiconductor memory device for storing up to eight-bits of information. The device has a semiconductor substrate of one conductivity type, a central bottom diffusion region on top of a portion of the semiconductor substrate, a second semiconductor layer on top of the bottom diffusion region, and left and right diffusion regions formed in the second semiconductor layer apart from the central bottom diffusion region thus forming a first vertical channel between the right and central bottom diffusion regions. The device further includes a trapping dielectric layer formed over exposed portions of the semiconductor substrate, left, central and right bottom diffusion regions and second semiconductor layer and a wordline formed over the trapping dielectric layer. A methods of fabricating this novel cell using trench technology is also disclosed.
    • 本申请公开了一种用于存储多达8位信息的非易失性半导体存储器件。 该器件具有一个导电类型的半导体衬底,半导体衬底的一部分的顶部上的中心底部扩散区域,在底部扩散区域的顶部上的第二半导体层,以及形成在第二半导体层中的左右扩散区域 除了中心底部扩散区域,从而在右侧和中央底部扩散区域之间形成第一垂直通道。 该器件还包括形成在半导体衬底,左,中,右底部扩散区和第二半导体层的暴露部分之上的俘获电介质层,以及形成在俘获电介质层上的字线。 还公开了使用沟槽技术制造这种新型电池的方法。
    • 5. 发明授权
    • Multi-level memory cell device and method for self-converged programming
    • 用于自融合编程的多级存储单元器件和方法
    • US06215697B1
    • 2001-04-10
    • US09231044
    • 1999-01-14
    • Tao Cheng LuDer Shin ShyuShi Xian ChenWen Jer TsaiMam Tsung Wang
    • Tao Cheng LuDer Shin ShyuShi Xian ChenWen Jer TsaiMam Tsung Wang
    • G11C1604
    • G11C16/10G11C11/5621G11C11/5628G11C11/5642G11C2211/5625G11C2211/5634
    • A multi-level memory cell device and method for self-converged programming which includes a memory cell switchably coupled to a non-programmable reference cell (or dummy cell), the cells arranged in respective arrays. A current source voltage between the source node and ground of the cells is relational to the threshold voltage, so as the threshold voltage is increased, the current source voltage decreases. The threshold voltage of the dummy cell is set by a stable voltage source. The memory cell is programmed and the current source voltage of the memory cell is compared to the current source voltage of the reference cell and therefore the difference in the voltages can be used to sense convergence of the programmed cell with a target threshold level set on the reference cell. A controller is also included between the reference cell and memory cell for adjusting the threshold voltage of the dummy cell according to the gate coupling ratio of the floating gate memory cell. The controller is also used to adjust voltages for both programming and read operations. The voltage difference resulting from the sources of the memory cell and reference cell is used to provide program control signals and thereby cease programming of the memory cell when convergence has been reached.
    • 一种用于自融合编程的多级存储单元设备和方法,其包括可切换地耦合到非可编程参考单元(或虚拟单元)的存储单元,所述单元布置在相应阵列中。 电池的源节点和地之间的电流源电压与阈值电压相关,因此阈值电压增加,电流源电压降低。 虚拟单元的阈值电压由稳定的电压源设定。 对存储单元进行编程,并将存储单元的电流源电压与参考单元的电流源电压进行比较,因此可以使用电压差来检测编程单元的收敛与在 参考细胞。 参考单元和存储单元之间还包括控制器,用于根据浮动栅极存储单元的栅极耦合比来调整虚设单元的阈值电压。 控制器也用于调节编程和读取操作的电压。 由存储器单元和参考单元的源产生的电压差用于提供程序控制信号,从而在已经达到收敛时停止存储单元的编程。
    • 6. 发明授权
    • 8 bit per cell non-volatile semiconductor memory structure utilizing trench technology and dielectric floating gate
    • 8位每单元非易失性半导体存储器结构利用沟槽技术和介质浮栅
    • US06432782B1
    • 2002-08-13
    • US09776290
    • 2001-02-02
    • Hsing Lan LungTao Cheng LuMam Tsung Wang
    • Hsing Lan LungTao Cheng LuMam Tsung Wang
    • H01L21336
    • H01L27/11568H01L27/115H01L29/7923H01L29/7926
    • The present application discloses a non-volatile semiconductor memory device for storing up to eight-bits of information. The device has a semiconductor substrate of one conductivity type, a central bottom diffusion region on top of a portion of the semiconductor substrate, a second semiconductor layer on top of the bottom diffusion region, and left and right diffusion regions formed in the second semiconductor layer apart from the central bottom diffusion region thus forming a first vertical channel between the right and central bottom diffusion regions. The device further includes a trapping dielectric layer formed over exposed portions of the semiconductor substrate, left, central and right bottom diffusion regions and second semiconductor layer and a wordline formed over the trapping dielectric layer. A methods of fabricating this novel cell using trench technology is also disclosed.
    • 本申请公开了一种用于存储多达8位信息的非易失性半导体存储器件。 该器件具有一个导电类型的半导体衬底,半导体衬底的一部分的顶部上的中心底部扩散区域,在底部扩散区域的顶部上的第二半导体层,以及形成在第二半导体层中的左右扩散区域 除了中心底部扩散区域,从而在右侧和中央底部扩散区域之间形成第一垂直通道。 该器件还包括形成在半导体衬底,左,中,右底部扩散区和第二半导体层的暴露部分之上的俘获电介质层,以及形成在俘获电介质层上的字线。 还公开了使用沟槽技术制造这种新型电池的方法。
    • 7. 发明授权
    • Cell structure for mask ROM
    • 掩模ROM的单元结构
    • US6046482A
    • 2000-04-04
    • US935072
    • 1997-09-25
    • Tao Cheng LuMam-Tsung Wang
    • Tao Cheng LuMam-Tsung Wang
    • H01L21/8246H01L29/76
    • H01L27/1124
    • A mask read-only-memory cell structure without ROM code implantation is presented. By using double polysilicon technology, ROM code cells which store data "0" can be replaced by cells with double polysilicon layers and an insulating layer between them. Normal cells with double polysilicon layers but without an insulating layer between them form normal cells store data "1". According to the invention, further scaling of mask ROM is possible and operating condition can be released because of high junction breakdown voltage. Furthermore, the double polysilicon technology makes redundancy circuit more easily to implement.
    • 提出了一种没有ROM代码植入的掩模只读存储单元结构。 通过使用双重多晶硅技术,存储数据“0”的ROM代码单元可以由具有双多晶硅层的单元和它们之间的绝缘层代替。 具有双多晶硅层但在它们之间没有绝缘层的正电池形成正常电池存储数据“1”。 根据本发明,掩模ROM的进一步缩放是可能的,并且由于高的结击穿电压可以释放操作条件。 此外,双晶体技术使得冗余电路更容易实现。
    • 8. 发明授权
    • Method for fabricating a cell structure for mask ROM
    • 掩模ROM的单元结构的制造方法
    • US5895241A
    • 1999-04-20
    • US825301
    • 1997-03-28
    • Tao Cheng LuMam-Tsung Wang
    • Tao Cheng LuMam-Tsung Wang
    • H01L21/8246
    • H01L27/1124
    • A mask read-only-memory cell structure without ROM code implantation is presented. By using double polysilicon technology, ROM code cells which store data "0" can be replaced by cells with double polysilicon layers and an insulating layer between them. Normal cells with double polysilicon layers but without an insulating layer between them form normal cells store data "1". According to the invention, further scaling of mask ROM is possible and operating condition can be released because of high junction breakdown voltage. Furthermore, the double polysilicon technology makes redundancy circuit more easily to implement.
    • 提出了一种没有ROM代码植入的掩模只读存储单元结构。 通过使用双重多晶硅技术,存储数据“0”的ROM代码单元可以由具有双多晶硅层的单元和它们之间的绝缘层代替。 具有双多晶硅层但在它们之间没有绝缘层的正电池形成正常电池存储数据“1”。 根据本发明,掩模ROM的进一步缩放是可能的,并且由于高的结击穿电压可以释放操作条件。 此外,双晶体技术使得冗余电路更容易实现。