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    • 9. 发明授权
    • Cooling arrangement for semiconductor devices and method of making the
same
    • 用于半导体器件的冷却装置及其制造方法
    • US5133403A
    • 1992-07-28
    • US423386
    • 1989-10-19
    • Hitoshi YokonoTakao TerabayashiNobuo KayabaTakahiro DaikokuShigekazu KiedaFumiyuki KobayashiShizuo Zushi
    • Hitoshi YokonoTakao TerabayashiNobuo KayabaTakahiro DaikokuShigekazu KiedaFumiyuki KobayashiShizuo Zushi
    • H01L23/373H01L23/433H01L23/473H05K7/20
    • H01L23/4338H01L23/3733F28F2255/18H01L2224/16225
    • A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.
    • 一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。 该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成,并且二维方向的热导率的各向异性特性比AlN的各向异性高 各向同性的导热性。 即使复合烧结体的形状和尺寸一致,冷却装置也可以批量生产,同时具有与每个半导体元件产生的热量匹配的高转印性能。 复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成,并加入烧结助剂。 混合物进行热压烧结,由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。