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    • 1. 发明授权
    • Socket for testing of semiconductor device, and semiconductor device and method of manufacturing the semiconductor device
    • 用于半导体器件测试的插座以及半导体器件及半导体器件的制造方法
    • US06710610B1
    • 2004-03-23
    • US09407838
    • 1999-09-29
    • Naotaka TanakaHiroyuki OhtaIchiro AnjohHideo ArimaAkio HasebeKenichi Yamamoto
    • Naotaka TanakaHiroyuki OhtaIchiro AnjohHideo ArimaAkio HasebeKenichi Yamamoto
    • G01R3102
    • G01R1/0441H05K3/326
    • Electrode pads are formed on a tape circuit to correspond to positions of solder bumps on an IC. A plurality of pins formed on a periphery of the tape circuit provide electrical connection between the tape circuit and a mother socket. An elastomer sheet is provided between a portion of the tape circuit, on which the electrode pads are formed and the IC is mounted, and the mother socket, and a side surface of the sheet, which contacts with the tape circuit, is formed with cut grooves in lattice fashion such that respective centers of the electrode pads substantially coincide with intersections of the grooves. Thus portions defined by the grooves on the sheet are made independent from one another to enable accommodating pushing forces from the solder bumps, so that, even if dispersion in height generates between the solder bumps, the respective portions defined by the grooves are hardly influenced by one another, and so accommodate the pushing forces from the solder bumps to permit the solder bumps and the electrode pads to surely contact with each other.
    • 电极焊盘形成在磁带电路上以对应于IC上的焊料凸块的位置。 形成在磁带电路的周边上的多个引脚在磁带电路和母插座之间提供电连接。 弹性体片材设置在带状电路的形成有电极垫的部分和安装有IC的部分之间,并且母带和与带电路接触的片材的侧表面形成有切口 凹槽以格子方式使得电极垫的各个中心基本上与凹槽的交叉重合。 因此,由片上的凹槽限定的部分彼此独立,以便能够容纳来自焊料凸块的推力,使得即使在焊料凸块之间产生高度分散,由凹槽限定的各个部分几乎不受 并且因此容纳来自焊料凸块的推力,以允许焊料凸块和电极焊盘彼此牢固地接触。