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1. 发明申请

US20190174662A1 SUBSTRATE POSITION DETECTION DEVICE 审中-公开
公开(公告)号：US20190174662A1
公开(公告)日：2019-06-06
申请号：US16258817
申请日：2019-01-28
申请人： CKD Corporation
发明人： Takahiro Ninomiya , Kensuke Takamura , Nobuyuki Umemura
IPC分类号： H05K13/08 , H05K13/04 , H05K3/00 , G01N21/84 , H05K1/02
CPC分类号： H05K13/081 , G01N21/84 , H05K1/0269 , H05K3/0044 , H05K13/04 , H05K2201/09009 , H05K2201/09918
摘要： A substrate position detection device includes: an irradiator that irradiates a predetermined range of a substrate with a predetermined light; an imager that takes an image of the predetermined range of the substrate irradiated with the predetermined light; a moving mechanism that causes a relative movement of the imager and the substrate; and a controller that: detects a position of the substrate by sequentially executing to a plurality of recognition objects on the substrate: a moving process of relatively moving the imager to a position corresponding to a predetermined recognition object among the plurality of recognition objects on the substrate; an imaging process of taking an image of the predetermined recognition object under a predetermined imaging condition; and a recognition process of recognizing the predetermined recognition object based on image data obtained by the imaging process.

2. 发明申请

US20180110125A1 DISPLAY DEVICE 审中-公开
公开(公告)号：US20180110125A1
公开(公告)日：2018-04-19
申请号：US15846450
申请日：2017-12-19
申请人： Japan Display Inc.
发明人： Hideaki ABE , Yasushi NAKANO , Hitoshi KAWAGUCHI , Ryouhei SUZUKI
IPC分类号： H05K1/18 , H01R12/62 , H01R4/04 , H05K1/11 , G02F1/1345 , G02F1/1362
CPC分类号： H05K1/189 , G02F1/1345 , G02F1/136286 , H01R4/04 , H01R12/62 , H01R2107/00 , H05K1/118 , H05K3/323 , H05K3/3442 , H05K3/361 , H05K2201/09663 , H05K2201/09918 , H05K2201/10136
摘要： Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for a pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions.

3. 发明申请

US20170318680A1 DEVICE FOR PRODUCING AND/OR PROCESSING A WORKPIECE 审中-公开
公开(公告)号：US20170318680A1
公开(公告)日：2017-11-02
申请号：US15654977
申请日：2017-07-20
申请人： Konrad GmbH
发明人： Michael Konrad , Stefan Werner
IPC分类号： H05K3/00
CPC分类号： H05K3/0008 , H05K2201/09918 , H05K2203/162 , H05K2203/166 , Y10T29/53261
摘要： In a device for producing and/or processing a workpiece, in particular circuit boards, in a work station, in particular for printing a corresponding blank or for checking finished circuit boards, at least one mark is provided on the workpiece. In this arrangement, at least one reference, which can be brought into alignment with the mark, is provided in the work station.

4. 发明授权

US09596765B2 Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method 有权
标题翻译：使用该方法制造的组件引入基板和组件结合基板的制造方法
公开(公告)号：US09596765B2
公开(公告)日：2017-03-14
申请号：US14426364
申请日：2012-09-11
申请人： Akira Yamaki , Tatsuya Kikuchi , Mitsuaki Toda
发明人： Akira Yamaki , Tatsuya Kikuchi , Mitsuaki Toda
IPC分类号： H05K3/30 , H05K3/00 , H05K1/18 , H05K3/46 , H01L23/00 , C25D7/06 , H05K1/09 , H05K3/40 , H01L23/544 , H01L21/683 , H05K1/02 , H01L21/56
CPC分类号： H05K3/0008 , C25D7/0607 , H01L21/568 , H01L21/6835 , H01L23/544 , H01L24/19 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2221/68359 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/2741 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32245 , H01L2224/82039 , H01L2224/82132 , H01L2224/83005 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2924/12042 , H01L2924/14 , H05K1/0269 , H05K1/09 , H05K1/185 , H05K1/188 , H05K3/305 , H05K3/4007 , H05K3/403 , H05K3/4038 , H05K3/4602 , H05K3/4655 , H05K3/4658 , H05K3/4661 , H05K3/4682 , H05K2201/0209 , H05K2201/0293 , H05K2201/09063 , H05K2201/09472 , H05K2201/09918 , H05K2203/0353 , H05K2203/0361 , H05K2203/063 , H01L2924/00
摘要： A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.
摘要翻译：根据本发明的用于组件的基片的制造方法包括：根据形成在铜层上的标记来定位电子部件，该标记由铜蚀刻剂（铜蚀刻剂）蚀刻铜不易蚀刻的材料构成在将电子部件粘附在铜层上之后，将电子部件和标记嵌入绝缘基板后，将铜层的一部分进行蚀刻除去，形成露出标记的窗口，形成参照曝光标记的LVH到达电子部件的端子，经由通过将电镀施加到LVH而形成的导通孔将端子和铜层电连接，然后将铜层形成布线图案。

5. 发明授权

US09556510B2 Printing of multiple inks to achieve precision registration during subsequent processing 有权
标题翻译：打印多种油墨以在后续处理中实现精度配准
公开(公告)号：US09556510B2
公开(公告)日：2017-01-31
申请号：US15076236
申请日：2016-03-21
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： Mikhail L. Pekurovsky , Ann M. Gilman , Daniel J. Theis
IPC分类号： H05K3/16 , C23C14/34 , B41F33/00 , B05D1/28 , B05D3/06 , B05D3/00 , B41F3/00 , H05K13/00 , B41F9/10 , B41M3/00 , B41F31/00 , B41F31/02 , B41F31/04 , H05K1/02 , H05K3/12 , H05K3/46 , H05K1/03 , H05K3/24
CPC分类号： B41F33/0081 , B05D1/28 , B05D3/007 , B05D3/067 , B41F3/00 , B41F9/1063 , B41F31/008 , B41F31/02 , B41F31/04 , B41M3/008 , C23C14/34 , H05K1/0269 , H05K1/0283 , H05K1/0393 , H05K3/1275 , H05K3/16 , H05K3/246 , H05K3/4679 , H05K13/0015 , H05K2201/09918 , H05K2203/0143 , H05K2203/1344 , H05K2203/1545 , H05K2203/166
摘要： A method of achieving precision registration in a roll to roll process by simultaneously depositing multiple inks onto a printing roll. One of these inks prints a pattern of fiducial marks onto a substrate while another ink prints a predetermined pattern on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks.
摘要翻译：一种通过将多种油墨同时沉积到印刷辊上来实现辊轧工艺精密配准的方法。这些墨水中的一种将基准标记的图案打印到基板上，而另一墨水在同一基板上印刷预定图案，使得预定图案与基准图案的图案具有可预测的空间关系。因此，即使形成预定图案的墨水是不可见的，或者具有如此低的对比度，使得它在实际上是不可见的，或者甚至已经在随后的处理步骤中被溶解掉，则仍然可以知道预定图案在哪里通过参考基准标记的模式。

6. 发明申请

US20160323992A1 ALUMINUM NITRIDE SUBSTRATE 审中-公开
标题翻译：氮化铝衬底
公开(公告)号：US20160323992A1
公开(公告)日：2016-11-03
申请号：US15138116
申请日：2016-04-25
申请人： FINISAR CORPORATION
发明人： Henry Meyer Daghighian , Steven C. Bird
IPC分类号： H05K1/02 , H05K1/11 , G02B6/12 , H05K1/09 , G02B6/122 , G02B6/136 , H05K1/03 , H01P3/08
CPC分类号： H05K1/0274 , G02B6/12007 , G02B6/122 , G02B6/1221 , G02B6/124 , G02B6/132 , G02B6/136 , G02B6/42 , G02B6/4214 , G02B6/4269 , G02B2006/12035 , G02B2006/121 , G02B2006/12104 , G02B2006/12107 , G02B2006/12164 , H01P3/081 , H05K1/0201 , H05K1/0207 , H05K1/0209 , H05K1/024 , H05K1/028 , H05K1/032 , H05K1/09 , H05K1/115 , H05K3/323 , H05K3/4605 , H05K3/4611 , H05K3/4614 , H05K3/4638 , H05K3/4688 , H05K2201/0154 , H05K2201/09918
摘要： A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.
摘要翻译：印刷电路板可以包括包含AIN薄膜和作为AIN薄膜的载体衬底的高频聚合物层的氮化铝（AlN）衬底。 AIN衬底形成印刷电路板的第一层。 AIN衬底包括散热器，其横向散布来自印刷电路板上的散热器的热量，以形成与印刷电路板上的信号路径平行的散热路径。印刷电路板可以包括与AIN衬底对准并与其结合的主衬底。主衬底可以包括印刷电路板的一个或多个附加层。

7. 发明授权

US09345129B2 Mounting structure, electro-optical apparatus, and electronic apparatus 有权
标题翻译：安装结构，电光设备和电子设备
公开(公告)号：US09345129B2
公开(公告)日：2016-05-17
申请号：US14326729
申请日：2014-07-09
申请人： SEIKO EPSON CORPORATION
发明人： Hidetaka Saito
IPC分类号： H05K7/00 , H05K1/02 , H05K1/14
CPC分类号： H05K1/0269 , H05K1/144 , H05K1/189 , H05K2201/09918 , H05K2201/10121 , H05K2203/166
摘要： A mounting structure in which a plurality of substrates are electrically connected to each other includes a first substrate having a first alignment mark formed by partially cutting away a first terminal, and a second substrate having a second alignment mark formed by partially cutting away a second terminal. The first terminal and the second terminal are electrically connected to each other by being relatively positioned with respect to each other.
摘要翻译：其中多个基板彼此电连接的安装结构包括具有通过部分地切除第一端子而形成的第一对准标记的第一基板和具有通过部分地切除第二端子而形成的第二对准标记的第二基板。第一端子和第二端子通过相对于彼此相对定位而彼此电连接。

8. 发明申请

US20160105953A1 METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD 审中-公开
标题翻译：生产电路板区和电路板多路电路板的方法
公开(公告)号：US20160105953A1
公开(公告)日：2016-04-14
申请号：US14971688
申请日：2015-12-16
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Nikolai HASLEBNER , Markus LEITGEB , Michael GOESSLER , Mike MORIANZ
IPC分类号： H05K1/02 , H05K1/18 , H05K1/14 , H05K1/11
CPC分类号： H05K1/0266 , H01L2224/2518 , H05K1/0269 , H05K1/028 , H05K1/0298 , H05K1/11 , H05K1/115 , H05K1/14 , H05K1/18 , H05K1/182 , H05K1/189 , H05K3/36 , H05K3/4638 , H05K3/4688 , H05K2201/0355 , H05K2201/058 , H05K2201/09918 , H05K2201/09936 , H05K2203/166 , Y10T29/49126
摘要： For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.
摘要翻译：对于用于制造由多个电路板区域组成的电路板的方法，其中各个电路板区域包括至少一层由绝缘基材制成的层和位于基材上或其中的导电图案，下列提供：衬底材料，形成在衬底材料中的至少一个对准标记，布置在衬底材料上的第一电路板区域，至少一个额外的电路板区域，其基本上邻接第一电路板区域或至少部分重叠所述第一电路板，所述附加电路板区域相对于所述对准标记定向，以及所述第一电路板区域和所述至少一个附加电路板区域的导电图案的多个连接。因此，当电路板区域耦合时，可以实现改进的配准和取向。

9. 发明授权

US09301387B2 Printed circuit board with burr prevention structure 有权
标题翻译：带毛刺预防结构的印刷电路板
公开(公告)号：US09301387B2
公开(公告)日：2016-03-29
申请号：US13774655
申请日：2013-02-22
申请人： LG INNOTEK CO., LTD.
发明人： Chung Sang Ryou
IPC分类号： H05K1/11 , H05K1/14 , H05K1/02 , H05K3/00
CPC分类号： H05K1/0266 , H05K1/02 , H05K1/0269 , H05K3/0008 , H05K3/0052 , H05K2201/09063 , H05K2201/0909 , H05K2201/09918 , Y10T29/49117
摘要： A PCB according to an exemplary embodiment of the present disclosure includes a plurality of unit PCBs arrayed on the PCB, and a sawing line formed among the plurality of unit PCBs. The sawing line disposed among the dummy unit PCBs is formed with a conductive pad including a first layer formed with a PSR (Photo Solder Resistor) and a second layer on which the PSR is removed to open the conductive pad. Burr generation on the unit PCBs during a sawing process is prevented and a dummy area can be reduced.
摘要翻译：根据本公开的示例性实施例的PCB包括排列在PCB上的多个单元PCB以及在多个单元PCB之间形成的锯线。设置在虚拟单元PCB之间的锯线形成有导电焊盘，该导电焊盘包括由PSR（光电焊料电阻器）形成的第一层和去除了PSR以打开导电焊盘的第二层。在锯切过程中防止在单元PCB上的毛刺产生，并且可以减少虚拟区域。

10. 发明申请

US20160081193A1 Welded High-Density Low-Profile Interconnect System 有权
标题翻译：焊接高密度薄型互连系统
公开(公告)号：US20160081193A1
公开(公告)日：2016-03-17
申请号：US14487869
申请日：2014-09-16
申请人： Apple Inc.
发明人： William F. Leggett , John Raff
IPC分类号： H05K1/14 , H05K1/11 , H05K7/14 , H05K1/02
CPC分类号： H05K7/1427 , G06F1/1658 , H05K1/189 , H05K3/361 , H05K3/363 , H05K3/368 , H05K2201/09918 , H05K2201/10128 , H05K2203/107
摘要： An electronic device may have printed circuits to which electrical components are mounted. The printed circuits may have metal traces that form signal lines and contact pads. Vias or other conductive structures may he used in interconnecting the signal lines to the contact pads. The contact pads may have elongated shapes or other shapes and may he formed in arrays on the printed circuits. Laser welds or other electrical connections may be used to join contact pads on a first printed circuit to respective contact pads on a second printed circuit. The laser welds may form part of a rectangular region of welds or may form part of a non-rectangular region of welds such as a region with a curved edge. Alignment marks may be used in aligning the contact pads.
摘要翻译：电子设备可以具有安装电气部件的印刷电路。印刷电路可以具有形成信号线和接触焊盘的金属迹线。他可以使用通路或其他导电结构将信号线互连到接触焊盘。接触垫可以具有细长形状或其他形状，并且可以在印刷电路上以阵列形式。可以使用激光焊接或其它电连接将第一印刷电路上的接触焊盘连接到第二印刷电路上的相应接触焊盘。激光焊缝可以形成一个矩形焊缝区域的一部分，或者可以形成非矩形焊接区域的一部分，例如具有弯曲边缘的区域。对准标记可用于对准接触垫。

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