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1. 发明申请

US20130026616A1 POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电源设备封装模块及其制造方法
公开(公告)号：US20130026616A1
公开(公告)日：2013-01-31
申请号：US13557834
申请日：2012-07-25
申请人： Suk Ho LEE , Jae Cheon DOH , Young Hoon KWAK , Tae Hoon KIM , Tao Jyun KIM , Young Ki LEE
发明人： Suk Ho LEE , Jae Cheon DOH , Young Hoon KWAK , Tae Hoon KIM , Tao Jyun KIM , Young Ki LEE
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/49575 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L25/18 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2225/1017 , H01L2225/1047 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/1515 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： The present invention relates to a power device package module and a manufacturing method thereof. In one aspect of the present invention, a power device package module includes: a control unit a first lead frame, a control chip and a first coupling portion that are mounted on a first substrate, wherein the first lead frame and the first coupling portion are electrically connected to the control chip, and individually molded; and a power unit including a second lead frame, a power chip and a second coupling portion that are mounted on a second substrate, wherein the second lead frame and the second coupling portion are electrically connected to the power chip, and individually molded, wherein the individually molded control unit and power unit are coupled by the first coupling portion and the second coupling portion.
摘要翻译：功率器件封装模块及其制造方法技术领域本发明涉及功率器件封装模块及其制造方法。在本发明的一个方面，功率器件封装模块包括：控制单元，安装在第一衬底上的第一引线框架，控制芯片和第一耦合部分，其中第一引线框架和第一耦合部分是电连接到控制芯片，并单独模制; 以及功率单元，其包括安装在第二基板上的第二引线框架，功率芯片和第二耦合部分，其中所述第二引线框架和所述第二耦合部分电连接到所述功率芯片，并且分别模制，其中单独模制的控制单元和动力单元通过第一联接部分和第二联接部分联接。

2. 发明申请

US20130270689A1 SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, AND MOUNTING STRUCTURE THEREOF 审中-公开
标题翻译：半导体封装，半导体模块及其安装结构
公开(公告)号：US20130270689A1
公开(公告)日：2013-10-17
申请号：US13550067
申请日：2012-07-16
申请人： Kwang Soo KIM , Young Ki LEE , Bum Seok SUH , Kee Ju UM , Suk Ho LEE , Young Hoon KWAK
发明人： Kwang Soo KIM , Young Ki LEE , Bum Seok SUH , Kee Ju UM , Suk Ho LEE , Young Hoon KWAK
IPC分类号： H01L23/36
CPC分类号： H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49562 , H01L23/49575 , H01L25/043 , H01L2224/32221 , H01L2224/32245 , H01L2224/4141 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/00 , H01L2224/37099
摘要： Provided are a semiconductor package capable of packaging and modularizing power semiconductor devices which are difficult to integrate due to heat generation, a semiconductor package module using the same, and a mounting structure thereof. The semiconductor package includes: a common connection terminal formed to have a flat plate shape; first and second electronic devices respectively bonded to both surfaces of the common connection terminals; first and second connection terminals having a flat plate shape and bonded to the first electronic device; and a third connection terminal having a flat plate shape and bonded to the second electronic device.
摘要翻译：提供了能够封装和模块化由于发热而难以集成的功率半导体器件的半导体封装，使用其的半导体封装模块及其安装结构。半导体封装包括：形成为具有平板形状的公共连接端子; 第一和第二电子设备分别接合到公共连接端子的两个表面; 第一和第二连接端子具有平板形状并且结合到第一电子设备; 以及具有平板形状并结合到第二电子设备的第三连接端子。

3. 发明申请

US20130069108A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20130069108A1
公开(公告)日：2013-03-21
申请号：US13313713
申请日：2011-12-07
申请人： Young Ki LEE , Dong Soo SEO , Kwang Soo KIM , Young Hoon KWAK
发明人： Young Ki LEE , Dong Soo SEO , Kwang Soo KIM , Young Hoon KWAK
IPC分类号： H01L29/739
CPC分类号： H01L23/4824 , H01L29/7393 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.
摘要翻译：本文公开了一种功率半导体模块，包括：电路板，其上形成有栅极，发射极和集电极图案; 安装在所述电路板上的第一半导体芯片，在其一个表面上形成有栅极和发射极端子，并且在其另一个表面上形成集电极端子; 安装在所述第一半导体芯片上的第二半导体芯片，具有在其一个表面上形成的阴极端子，并且在其另一个表面上形成阳极端子; 第一导电连接构件，其一端设置在第一半导体芯片的集电极端子和第二半导体芯片的阴极端子之间，另一端接触电路板的集电体图案; 以及第二导电连接构件，其一端接触第二半导体芯片的阳极端子，另一端接触电路板的发射极图案。

4. 发明申请

US20130134571A1 POWER MODULE PACKAGE 有权
标题翻译：电源模块封装
公开(公告)号：US20130134571A1
公开(公告)日：2013-05-30
申请号：US13353128
申请日：2012-01-18
申请人： Kwang Soo KIM , Young Hoon KWAK , Young Ki LEE
发明人： Kwang Soo KIM , Young Hoon KWAK , Young Ki LEE
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/072 , H01L25/162 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.
摘要翻译：本文公开了一种功率模块封装，包括：第一散热板，包括顺序地形成的第一流路，第二流路和第三流路，第一流路和第三流路形成为具有台阶之间; 以及形成在所述第一散热板下方的第二散热板，具有一个面和另一个面，在其一个面上形成有半导体器件安装槽，并且包括第四流路，其一端连接到所述第二流路并且另一端连接到第三流动路径，其中通过第一流动路径引入的冷却材料基于第二流动路径分配到第三流动路径和第四流动路径。

5. 发明申请

US20110075374A1 RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US20110075374A1
公开(公告)日：2011-03-31
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
发明人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
IPC分类号： H05K7/20 , H05K1/00 , H05K3/10
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

6. 发明申请

US20120001544A1 LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：发光模块及其制造方法
公开(公告)号：US20120001544A1
公开(公告)日：2012-01-05
申请号：US12904512
申请日：2010-10-14
申请人： Tae Hoon KIM , Sang Hyun SHIN , Cheol Ho HEO , Young Ki LEE , Ji Hyun PARK , Ki Ho SEO
发明人： Tae Hoon KIM , Sang Hyun SHIN , Cheol Ho HEO , Young Ki LEE , Ji Hyun PARK , Ki Ho SEO
IPC分类号： H01J7/44 , H01J9/00
CPC分类号： H01L25/167 , H01L27/3276 , H01L27/3288 , H01L33/641 , H01L51/529 , H01L2924/0002 , H05K1/0203 , H05K3/445 , H05K2201/10106 , H05K2201/10128 , H05K2203/0315 , H01L2924/00
摘要： Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component.
摘要翻译：公开了发光模块和制造发光模块的方法。发光模块包括：散热基板，其包括具有通孔的金属基板，沿着通孔的内壁形成的内部绝缘层，以及覆盖金属基板的所有外表面的外部绝缘层; 设置在散热基板的上表面上的发光部件单元; 驱动电路单元，其电连接到所述发光部件单元，并且安装在所述散热基板上以向所述发光部件单元施加驱动信号; 无源部件，其被安装在散热基板上并电连接到驱动电路单元; 以及电路布线层，其分别设置在散热基板的顶部和底部，并且通过形成在通孔上的通孔与散热基板的内部绝缘层相互连接，并且起到电互连的作用驱动电路单元和发光部件单元，或者驱动电路单元和无源部件。

7. 发明申请

US20150084089A1 INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：高温条件绝缘结构及其制造方法
公开(公告)号：US20150084089A1
公开(公告)日：2015-03-26
申请号：US14555186
申请日：2014-11-26
申请人： Young Ki LEE , Seog Moon CHOI , Sang Hyun SHIN
发明人： Young Ki LEE , Seog Moon CHOI , Sang Hyun SHIN
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H05K3/28 , H05K2203/0315 , H05K2203/0542
摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.
摘要翻译：一种用于高温条件的绝缘结构及其制造方法。在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

8. 发明申请

US20120273558A1 HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：散热电路板及其制造方法
公开(公告)号：US20120273558A1
公开(公告)日：2012-11-01
申请号：US13540504
申请日：2012-07-02
申请人： Hye Sook SHIN , Seog Moon CHOI , Shan GAO , Chang Hyun LIM , Tae Hyun KIM , Young Ki LEE
发明人： Hye Sook SHIN , Seog Moon CHOI , Shan GAO , Chang Hyun LIM , Tae Hyun KIM , Young Ki LEE
IPC分类号： B23K1/20
CPC分类号： H05K7/205 , H05K1/0209 , H05K1/0263 , H05K1/053 , H05K3/202 , H05K3/24 , H05K3/341 , H05K2201/066 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要翻译：公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层，使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力由于电镀过程而导致散热电路板。还提供了制造散热电路板的方法。

9. 发明申请

US20100279803A1 ARROW FOR HUNTING 有权
标题翻译：搜索引擎
公开(公告)号：US20100279803A1
公开(公告)日：2010-11-04
申请号：US12770266
申请日：2010-04-29
申请人： Young Ki LEE
发明人： Young Ki LEE
IPC分类号： F42B6/08 , F42B6/06
CPC分类号： F42B6/06 , F42B6/08
摘要： Disclosed herein is an arrow for hunting. The arrow includes an arrow shaft having a predetermined length and including a nock on one end and a shaft threaded part in the other end. A plurality of feathers is positioned to be adjacent to the nock of the arrow shaft. A connector includes a connecting threaded part fastened to the shaft threaded part, a stopper, and a penetration threaded part. An arrowhead is connected to the connector in such a way as to be opposite to the connecting threaded part. A penetration rotary unit has a threaded part to be fastened to the penetration threaded part of the connector, is shorter than the penetration threaded part, and has wings. A spring is positioned between the stopper and the penetration rotary unit, and provides a restoring force to bias the penetration rotary unit toward the arrowhead.
摘要翻译：这里公开了一种狩猎的箭头。箭头包括具有预定长度的箭头轴，并且在另一端包括一端的一个孔和一个轴螺纹部分。多个羽毛被定位成与箭头轴的nock相邻。连接器包括紧固到轴螺纹部分的连接螺纹部分，止动件和穿透螺纹部分。箭头以与连接螺纹部分相对的方式连接到连接器。穿透旋转单元具有要紧固到连接器的穿透螺纹部分的螺纹部分，比穿透螺纹部分短，并且具有翼部。弹簧定位在止动器和穿透旋转单元之间，并且提供恢复力以将穿透旋转单元偏向箭头。

10. 发明申请

US20110312109A1 LIGHT EMITTING DIODE PACKAGE HAVING ANODIZED INSULATION LAYER AND FABRICATION METHOD THEREFOR 有权
标题翻译：具有阳离子绝缘层的发光二极管封装及其制造方法
公开(公告)号：US20110312109A1
公开(公告)日：2011-12-22
申请号：US13220258
申请日：2011-08-29
申请人： Young Ki LEE , Seog Moon CHOI , Sang Hyun SHIN
发明人： Young Ki LEE , Seog Moon CHOI , Sang Hyun SHIN
IPC分类号： H01L33/48
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/58 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
摘要翻译：一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

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