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1. 发明申请

US20130026616A1 POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电源设备封装模块及其制造方法
公开(公告)号：US20130026616A1
公开(公告)日：2013-01-31
申请号：US13557834
申请日：2012-07-25
申请人： Suk Ho LEE , Jae Cheon DOH , Young Hoon KWAK , Tae Hoon KIM , Tao Jyun KIM , Young Ki LEE
发明人： Suk Ho LEE , Jae Cheon DOH , Young Hoon KWAK , Tae Hoon KIM , Tao Jyun KIM , Young Ki LEE
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/49575 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L25/18 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2225/1017 , H01L2225/1047 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/1515 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： The present invention relates to a power device package module and a manufacturing method thereof. In one aspect of the present invention, a power device package module includes: a control unit a first lead frame, a control chip and a first coupling portion that are mounted on a first substrate, wherein the first lead frame and the first coupling portion are electrically connected to the control chip, and individually molded; and a power unit including a second lead frame, a power chip and a second coupling portion that are mounted on a second substrate, wherein the second lead frame and the second coupling portion are electrically connected to the power chip, and individually molded, wherein the individually molded control unit and power unit are coupled by the first coupling portion and the second coupling portion.
摘要翻译：功率器件封装模块及其制造方法技术领域本发明涉及功率器件封装模块及其制造方法。在本发明的一个方面，功率器件封装模块包括：控制单元，安装在第一衬底上的第一引线框架，控制芯片和第一耦合部分，其中第一引线框架和第一耦合部分是电连接到控制芯片，并单独模制; 以及功率单元，其包括安装在第二基板上的第二引线框架，功率芯片和第二耦合部分，其中所述第二引线框架和所述第二耦合部分电连接到所述功率芯片，并且分别模制，其中单独模制的控制单元和动力单元通过第一联接部分和第二联接部分联接。

2. 发明申请

US20130270689A1 SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, AND MOUNTING STRUCTURE THEREOF 审中-公开
标题翻译：半导体封装，半导体模块及其安装结构
公开(公告)号：US20130270689A1
公开(公告)日：2013-10-17
申请号：US13550067
申请日：2012-07-16
申请人： Kwang Soo KIM , Young Ki LEE , Bum Seok SUH , Kee Ju UM , Suk Ho LEE , Young Hoon KWAK
发明人： Kwang Soo KIM , Young Ki LEE , Bum Seok SUH , Kee Ju UM , Suk Ho LEE , Young Hoon KWAK
IPC分类号： H01L23/36
CPC分类号： H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49562 , H01L23/49575 , H01L25/043 , H01L2224/32221 , H01L2224/32245 , H01L2224/4141 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/00 , H01L2224/37099
摘要： Provided are a semiconductor package capable of packaging and modularizing power semiconductor devices which are difficult to integrate due to heat generation, a semiconductor package module using the same, and a mounting structure thereof. The semiconductor package includes: a common connection terminal formed to have a flat plate shape; first and second electronic devices respectively bonded to both surfaces of the common connection terminals; first and second connection terminals having a flat plate shape and bonded to the first electronic device; and a third connection terminal having a flat plate shape and bonded to the second electronic device.
摘要翻译：提供了能够封装和模块化由于发热而难以集成的功率半导体器件的半导体封装，使用其的半导体封装模块及其安装结构。半导体封装包括：形成为具有平板形状的公共连接端子; 第一和第二电子设备分别接合到公共连接端子的两个表面; 第一和第二连接端子具有平板形状并且结合到第一电子设备; 以及具有平板形状并结合到第二电子设备的第三连接端子。

3. 发明申请

US20130037967A1 SEMICONDUCTOR PACKAGE SUBSTRATE 有权
标题翻译：半导体封装基板
公开(公告)号：US20130037967A1
公开(公告)日：2013-02-14
申请号：US13308441
申请日：2011-11-30
申请人： Jong Man KIM , Young Hoon KWAK , Kyu Hwan OH , Seog Moon CHOI , Tae Hoon KIM
发明人： Jong Man KIM , Young Hoon KWAK , Kyu Hwan OH , Seog Moon CHOI , Tae Hoon KIM
IPC分类号： H01L23/488
CPC分类号： H01L23/36 , H01L21/563 , H01L23/562 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26145 , H01L2224/26175 , H01L2224/29076 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/83385 , H01L2224/834 , H01L2224/83411 , H01L2224/83418 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83466 , H01L2224/83471 , H01L2224/8348 , H01L2224/83484 , H01L2924/15787 , H01L2924/00014 , H01L2924/01014 , H01L2924/014 , H01L2924/0665 , H01L2924/00
摘要： Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.
摘要翻译：本发明公开了一种半导体封装基板，其包括基底基板，安装在基底基板的上部的安装部件和形成在基底基板与安装部件之间的粘合层，其中粘合层包括导热粘合剂和在导热粘合剂的外周形成的韧性粘合剂。

4. 发明申请

US20130069108A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20130069108A1
公开(公告)日：2013-03-21
申请号：US13313713
申请日：2011-12-07
申请人： Young Ki LEE , Dong Soo SEO , Kwang Soo KIM , Young Hoon KWAK
发明人： Young Ki LEE , Dong Soo SEO , Kwang Soo KIM , Young Hoon KWAK
IPC分类号： H01L29/739
CPC分类号： H01L23/4824 , H01L29/7393 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.
摘要翻译：本文公开了一种功率半导体模块，包括：电路板，其上形成有栅极，发射极和集电极图案; 安装在所述电路板上的第一半导体芯片，在其一个表面上形成有栅极和发射极端子，并且在其另一个表面上形成集电极端子; 安装在所述第一半导体芯片上的第二半导体芯片，具有在其一个表面上形成的阴极端子，并且在其另一个表面上形成阳极端子; 第一导电连接构件，其一端设置在第一半导体芯片的集电极端子和第二半导体芯片的阴极端子之间，另一端接触电路板的集电体图案; 以及第二导电连接构件，其一端接触第二半导体芯片的阳极端子，另一端接触电路板的发射极图案。

5. 发明申请

US20130134571A1 POWER MODULE PACKAGE 有权
标题翻译：电源模块封装
公开(公告)号：US20130134571A1
公开(公告)日：2013-05-30
申请号：US13353128
申请日：2012-01-18
申请人： Kwang Soo KIM , Young Hoon KWAK , Young Ki LEE
发明人： Kwang Soo KIM , Young Hoon KWAK , Young Ki LEE
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/072 , H01L25/162 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.
摘要翻译：本文公开了一种功率模块封装，包括：第一散热板，包括顺序地形成的第一流路，第二流路和第三流路，第一流路和第三流路形成为具有台阶之间; 以及形成在所述第一散热板下方的第二散热板，具有一个面和另一个面，在其一个面上形成有半导体器件安装槽，并且包括第四流路，其一端连接到所述第二流路并且另一端连接到第三流动路径，其中通过第一流动路径引入的冷却材料基于第二流动路径分配到第三流动路径和第四流动路径。

6. 发明申请

US20130069213A1 POWER MODULE PACKAGE 有权
标题翻译：电源模块封装
公开(公告)号：US20130069213A1
公开(公告)日：2013-03-21
申请号：US13610680
申请日：2012-09-11
申请人： Young Ho SOHN , Young Hoon KWAK , Jong Man KIM , Kyu Hwan OH , Tae Hyun KIM
发明人： Young Ho SOHN , Young Hoon KWAK , Jong Man KIM , Kyu Hwan OH , Tae Hyun KIM
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 第二基板，与第一基板的一个表面接触; 第三基板，其接触所述第一基板的另一表面的一侧; 与所述第一基板的另一表面的另一侧接触的第一引线框架; 以及电连接到第三基板的第二引线框架。

7. 发明申请

US20130314870A1 HEAT DISSIPATION SYSTEM FOR POWER MODULE 审中-公开
标题翻译：电源模块散热系统
公开(公告)号：US20130314870A1
公开(公告)日：2013-11-28
申请号：US13620337
申请日：2012-09-14
申请人： Young Hoon KWAK , Kyu Hwan OH
发明人： Young Hoon KWAK , Kyu Hwan OH
IPC分类号： F28F1/00 , H05K7/20
CPC分类号： H05K7/20927 , F28F3/12
摘要： Disclosed herein is a heat dissipation system for a power module, including: a manifold including an inlet and an outlet and formed so as to be opened at a surface thereof contacting a nozzle member; a nozzle member formed at an upper portion of the manifold and including inclined nozzles through which a cooling medium introduced through the inlet of the manifold passes; and a nozzle chamber formed on the nozzle member and forming a spacing space spaced from the nozzle member.
摘要翻译：本文公开了一种用于功率模块的散热系统，包括：歧管，包括入口和出口，并形成为在与喷嘴构件接触的表面处开口; 喷嘴构件，其形成在所述歧管的上部，并且包括倾斜的喷嘴，通过所述歧管的入口引入的冷却介质穿过所述喷嘴; 以及形成在所述喷嘴构件上并形成与所述喷嘴构件间隔开的间隔空间的喷嘴室。

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