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1. 发明授权

US10506711B2 Ceramic circuit plate and method of making same 有权
公开(公告)号：US10506711B2
公开(公告)日：2019-12-10
申请号：US15934494
申请日：2018-03-23
申请人： Meng-Hsiu Hsieh
发明人： Meng-Hsiu Hsieh
IPC分类号： H05K1/03 , H05K3/46 , H01L23/14 , H01L23/498 , H01L21/48 , H05K1/05 , H05K3/10 , H05K3/44 , H05K1/09 , H05K3/00 , H05K3/18 , H05K3/42 , B22F1/00
CPC分类号： H05K1/0306 , H01L21/486 , H01L21/4846 , H01L23/142 , H01L23/49827 , H05K1/053 , H05K1/092 , H05K3/0061 , H05K3/105 , H05K3/44 , H05K3/4629 , B22F1/0081 , H05K3/188 , H05K3/424 , H05K2201/0195 , H05K2203/107
摘要： A ceramic circuit board and a method of making are provided. The ceramic circuit board includes a substrate and a composite material layer. The composite material layer is formed on the substrate and comprises metal oxide powders and ceramic powders. The composite material layer has an interface layer which is transformed from the metal oxide powders by reduction and includes comprises zero-valent metal, lower-valent metal oxide and eutectic mixture reduced from the metal oxide powders of the composite material layer.

2. 发明申请

US20180200989A1 SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING A SUBSTRATE OF THIS TYPE 审中-公开
公开(公告)号：US20180200989A1
公开(公告)日：2018-07-19
申请号：US15744349
申请日：2016-07-18
申请人： Rogers Germany GmbH
发明人： Andreas MEYER , Karsten SCHMIDT
IPC分类号： B32B9/00 , B32B15/04 , B32B15/12 , B32B15/20 , B32B29/00 , B32B29/08 , B32B5/12 , B32B5/20 , B32B7/12 , B32B9/04 , B32B9/06 , C25D11/00 , C25D11/04 , C25D17/12 , H01L23/373 , H05K1/05
CPC分类号： B32B9/005 , B32B5/12 , B32B5/20 , B32B7/12 , B32B9/041 , B32B9/06 , B32B15/043 , B32B15/12 , B32B15/20 , B32B29/002 , B32B29/08 , B32B2255/06 , B32B2255/205 , B32B2255/26 , B32B2255/28 , B32B2264/107 , B32B2307/202 , B32B2307/206 , B32B2307/54 , B32B2457/08 , B32B2605/00 , C25D11/005 , C25D11/04 , C25D11/08 , C25D17/12 , H01L23/3735 , H05K1/0201 , H05K1/0313 , H05K1/053 , H05K3/4688 , H05K2201/0116 , H05K2201/0338 , H05K2203/0315 , H05K2203/11 , H05K2203/1126
摘要： A substrate (1, 10) for electrical circuits, comprising at least one metal layer (2,3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2,3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a′, 6a″, 6b′, 6b″) to the metal layer (2,3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a′, 6a″, 6b′,6b″).

3. 发明授权

US09970648B2 Light source module, fabrication method therefor, and lighting device including the same 有权
公开(公告)号：US09970648B2
公开(公告)日：2018-05-15
申请号：US15153053
申请日：2016-05-12
申请人： LG ELECTRONICS INC.
发明人： Jaepyo Hong , Jaechan Kim , Injoong Kim , Hyeuk Chang , Sumin Jun
IPC分类号： F21S4/00 , F21V29/74 , H01L33/64 , H05K1/05 , H01L33/62 , F21Y101/02 , H05K3/28
CPC分类号： F21V29/74 , F21Y2101/00 , H01L33/62 , H01L33/64 , H01L33/647 , H05K1/053 , H05K3/28 , H05K2201/0376 , H05K2201/10106 , H05K2201/2054 , H05K2203/1355
摘要： A light source module includes at least one light source, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties, and a conductive layer provided on the insulating layer. The conductive layer includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source mounted therein. A protective layer is stacked in the connection region. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, improvement of the lifespan of products, and enhancement of the stability of products.

4. 发明申请

US20170121840A1 METHODS OF MANUFACTURING STRUCTURES HAVING CONCEALED COMPONENTS 有权
公开(公告)号：US20170121840A1
公开(公告)日：2017-05-04
申请号：US15336701
申请日：2016-10-27
申请人： Essential Products, Inc.
发明人： David John Evans, V , Xinrui Jiang , Andrew E. Rubin , Matthew Hershenson , Xiaoyu Miao , Joseph Anthony Tate , Jason Sean Gagne-Keats , Rebecca Schultz Zavin
IPC分类号： C25D11/26 , H01Q1/38 , B32B37/12 , B32B7/12 , B32B15/00 , B32B18/00 , H01Q1/12 , C25F3/08
CPC分类号： C25D11/26 , B32B7/12 , B32B15/00 , B32B18/00 , B32B37/12 , B32B2255/24 , B32B2307/202 , B32B2307/206 , B32B2311/18 , B32B2315/02 , B32B2457/00 , C25D11/02 , C25D11/022 , C25D11/026 , C25D11/04 , C25D11/18 , C25F3/08 , H01Q1/12 , H01Q1/38 , H05K1/053 , H05K1/09 , H05K3/4602 , H05K2203/0315
摘要： The disclosed embodiments include a method of integrating metal elements separated by gaps with a structure that conceals the metal elements and gaps. The method includes treating a metal substrate to a plasma electrolytic oxidation process to form a ceramic layer from a portion of the metal substrate, thereby providing the ceramic layer and an underlying metal portion of the metal substrate. The method further includes etching gap(s) in the underlying metal portion of the metal substrate to form metal elements separated by the gap(s), and backfilling the gap(s) with a non-conductive substance. As such, the metal elements, the non-conductive substance filling the gap(s), and the ceramic layer collectively form a structure whereby the ceramic layer at least partially conceals the metal elements and the gap(s).

5. 发明申请

US20170009975A1 LIGHT SOURCE MODULE, FABRICATION METHOD THEREFOR, AND LIGHTING DEVICE INCLUDING THE SAME 有权
标题翻译：光源模块，其制造方法和包括其的照明装置
公开(公告)号：US20170009975A1
公开(公告)日：2017-01-12
申请号：US15153053
申请日：2016-05-12
申请人： LG ELECTRONICS INC.
发明人： Jaepyo HONG , Jaechan KIM , Injoong KIM , Hyeuk CHANG , Sumin JUN
IPC分类号： F21V29/74
CPC分类号： F21V29/74 , F21Y2101/00 , H01L33/62 , H01L33/64 , H01L33/647 , H05K1/053 , H05K3/28 , H05K2201/0376 , H05K2201/10106 , H05K2201/2054 , H05K2203/1355
摘要： A light source module includes at least one light source, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties, and a conductive layer provided on the insulating layer. The conductive layer includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source mounted therein. A protective layer is stacked in the connection region. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, improvement of the lifespan of products, and enhancement of the stability of products.
摘要翻译：光源模块包括至少一个光源和支撑光源的主体。本体包括在其顶表面上支撑光源的散热器，散热片吸收来自光源的热量并将热量散发到外部，设置在散热器的至少一个表面上的绝缘层，绝缘层具有电绝缘性，以及设置在绝缘层上的导电层。导电层包括通过其向电源供应电流的连接区域和设置在连接区域之间的光源区域，其中安装有光源的光源区域。保护层层叠在连接区域中。因此，可以获得快速制造工艺，廉价的制造成本，便于大量生产，提高产品产量，保护导电材料，提高产品寿命以及提高产品稳定性等效果。

6. 发明授权

US09516748B2 Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board 有权
标题翻译：具有电路板的电路板，电子模块和照明装置以及电路板的制造方法
公开(公告)号：US09516748B2
公开(公告)日：2016-12-06
申请号：US14407074
申请日：2013-06-14
申请人： OSRAM GmbH
发明人： Jianghui Yang , Chuanpeng Zhong , Hao Li , Xiaomian Chen
IPC分类号： H05K1/05 , H05K1/02 , H05K1/18 , H05K1/03 , H05K3/10 , H05K1/14
CPC分类号： H05K1/053 , H01L2224/48091 , H01L2224/73265 , H05K1/0201 , H05K1/0203 , H05K1/0204 , H05K1/0284 , H05K1/0306 , H05K1/056 , H05K1/142 , H05K1/181 , H05K3/10 , H05K2201/048 , H05K2201/06 , H05K2201/09745 , H05K2201/10106 , H05K2201/10416 , Y10T29/49155 , H01L2924/00014
摘要： Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.
摘要翻译：各种实施例涉及包括基底和导热层的电路板。所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。各种实施例还涉及一种用于制造这种电路板的方法。

7. 发明授权

US09504147B2 Resin composition, and printed circuit board using same 有权
标题翻译：树脂组合物和使用其的印刷电路板
公开(公告)号：US09504147B2
公开(公告)日：2016-11-22
申请号：US14651771
申请日：2013-12-06
申请人： LG INNOTEK CO., LTD.
发明人： Yeo Eun Yoon , Myeong Jeong Kim , Sungjin Yun , Sanga Ju
IPC分类号： H05K1/05 , B32B15/092 , B32B27/20 , B32B27/26 , B32B27/38 , C08G59/24 , C08G59/50 , C08L63/00 , C08K3/22 , H05K1/03 , C08G59/22
CPC分类号： H05K1/0373 , C08G59/22 , C08G59/245 , C08G59/4064 , C08K3/22 , C08K2003/2227 , C08K2201/005 , C08L63/00 , H05K1/053 , H05K2201/0209
摘要： According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.
摘要翻译：根据本发明的一个实施方案，环氧树脂组合物包括：包含环氧化合物，三亚乙基二胺，二苯基膦和/或四苯基硼酸盐的树脂; 包括二氨基二苯砜，乙二胺，二氨基丙烷，甲二胺，苯二胺和/或三乙醇胺的固化剂; 和无机填料，其中所述无机填料包括至少两个按粒径分级的氧化铝（Al2O3）。

8. 发明申请

US20160286644A1 METAL SUBSTRATE WITH INSULATED VIAS 审中-公开
标题翻译：带绝缘VIAS的金属基板
公开(公告)号：US20160286644A1
公开(公告)日：2016-09-29
申请号：US15154198
申请日：2016-05-13
申请人： Cambridge Nanotherm Limited , Rogers Corporation
发明人： Pavel SHASHKOV , Sergey USOV , Steven CURTIS , Brett W. KILHENNY
IPC分类号： H05K1/11 , H05K3/40 , H05K1/09 , H05K1/03 , H05K1/05 , H05K1/02
CPC分类号： H05K1/0206 , C22C21/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49827 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2924/13055 , H05K1/0271 , H05K1/053 , H05K3/445 , H05K3/4623 , H05K2201/0116 , H05K2201/068 , H05K2201/10106 , H05K2203/0723 , Y10T29/49169 , H01L2924/00014 , H01L2924/00
摘要： A metal substrate with insulated vias (MSIV) has a metallic layer with through-holes defined through a thickness of the layer, a dielectric layer formed on part of the surface of the metallic layer and extending to cover internal walls of the through-hole, a conductive material extending through the insulated through-hole to form an insulated via, and an electrical circuit formed on a portion of the dielectric layer in thermal and/or electrical contact with the conductive via. The dielectric layer is a dielectric nanoceramic layer having an equiaxed crystalline structure with an average grain size of 500 nanometres or less, a thickness of between 0.1 and 100 micrometres, a dielectric strength of greater than 20 KV mm−1, and a thermal conductivity of greater than 3 W/mK. Such a MSIV can be used as an electronic substrate to support devices such as power, microwave, optoelectronic, solid-state lighting and thermoelectric devices.
摘要翻译：具有绝缘通孔（MSIV）的金属基板具有通过所述层的厚度限定的通孔的金属层，形成在金属层表面的一部分上并延伸以覆盖通孔的内壁的电介质层，延伸穿过绝缘通孔形成绝缘通孔的导电材料，以及形成在与导电通孔热接触和/或电接触的介电层的一部分上的电路。电介质层是具有平均晶粒尺寸为500纳米或更小，厚度为0.1至100微米，介电强度大于20KV /毫米-1的等轴晶体结构的电介质纳米陶瓷层，以及导热系数大于3 W / mK。这样的MSIV可以用作电子基板来支持诸如电力，微波，光电子，固态照明和热电装置的装置。

9. 发明授权

US09394615B2 Plasma resistant ceramic coated conductive article 有权
标题翻译：等离子陶瓷涂层导电制品
公开(公告)号：US09394615B2
公开(公告)日：2016-07-19
申请号：US13687512
申请日：2012-11-28
申请人： Applied Materials, Inc.
发明人： Jennifer Y. Sun , Biraja P. Kanungo , Ren-Guan Duan , Hamid Noorbakhsh , Junhan Yuh , Dmitry Lubomirsky
IPC分类号： C23F1/08 , B05D3/00 , B23K10/00 , H05K1/05 , H01J37/32 , C04B41/87 , C04B5/00 , C04B7/32 , C04B18/02 , C04B28/06 , C04B35/44 , C22C32/00 , C22C29/12 , B32B18/00 , C04B41/50 , C04B41/00
CPC分类号： C23F1/08 , B05D3/002 , B23K10/00 , B32B18/00 , C04B5/00 , C04B7/32 , C04B18/023 , C04B28/06 , C04B35/44 , C04B41/009 , C04B41/50 , C04B41/5045 , C04B41/87 , C22C29/12 , C22C32/00 , C22C32/0015 , C22C32/0021 , C22C32/0026 , H01J37/321 , H01J37/3244 , H01J37/32458 , H01J37/32467 , H01J37/32477 , H01J37/32495 , H05K1/053
摘要： To manufacture a ceramic coated article, at least one surface of a conductive article is roughened to a roughness of approximately 100 micro-inches (μin) to approximately 300 μin. The conductive article may then be heated and coated with a ceramic coating comprising a yttrium containing oxide to a thickness of approximately 10-40 mil.
摘要翻译：为了制造陶瓷涂层制品，将导电制品的至少一个表面粗糙化至约100微英寸（μin）至约300μin的粗糙度。然后可以将导电制品加热并用包含含钇的氧化物的陶瓷涂层涂覆至约10-40密耳的厚度。

10. 发明申请

US20160186352A1 NON-METALLIC COATING AND METHOD OF ITS PRODUCTION 有权
标题翻译：非金属涂料及其生产方法
公开(公告)号：US20160186352A1
公开(公告)日：2016-06-30
申请号：US13984096
申请日：2012-02-07
申请人： Pavel SHASHKOV , Gennady KHOMUTOV , Aleksey YEROKHIN , Sergey USOV
发明人： Pavel SHASHKOV , Gennady KHOMUTOV , Aleksey YEROKHIN , Sergey USOV
IPC分类号： C25D5/18 , C25D21/12 , C25D11/30 , C25D11/26 , C25D15/00 , C25D11/04
CPC分类号： C25D5/18 , C25D11/00 , C25D11/005 , C25D11/02 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/06 , C25D11/26 , C25D11/30 , C25D11/32 , C25D13/02 , C25D15/00 , C25D21/12 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L2224/48227 , H01L2224/49109 , H01L2924/01327 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K1/021 , H05K1/053 , H05K1/115 , H05K1/18 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T428/1317 , Y10T428/24917 , Y10T428/249969 , H01L2924/00
摘要： A method of forming a non-metallic coating on a metallic substrate involves the steps of positioning the metallic substrate in an electrolysis chamber and applying a sequence of voltage pulses of alternating polarity to electrically bias the substrate with respect to an electrode. Positive voltage pulses anodically bias the substrate with respect to the electrode and negative voltage pulses cathodically bias the substrate with respect to the electrode. The amplitude of the positive voltage pulses is potentiostatically controlled, wheras the amplitude of the negative voltage pulses is galvanostatically controlled.
摘要翻译：在金属基材上形成非金属涂层的方法包括以下步骤：将金属基材定位在电解室中，并且施加一系列交替极性的电压脉冲以相对于电极使基板电偏置。正电压脉冲相对于电极阳极偏置衬底，负电压脉冲相对于电极阴极偏置衬底。正电压脉冲的幅度被电位控制，从而恒定地控制负电压脉冲的幅度。

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