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1. 发明授权

US08242371B2 Heat dissipating circuit board and method of manufacturing the same 有权
标题翻译：散热电路板及其制造方法
公开(公告)号：US08242371B2
公开(公告)日：2012-08-14
申请号：US12614405
申请日：2009-11-07
申请人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
发明人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
IPC分类号： H05K7/20 , H05K1/00
CPC分类号： H05K7/205 , H05K1/0209 , H05K1/0263 , H05K1/053 , H05K3/202 , H05K3/24 , H05K3/341 , H05K2201/066 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要翻译：公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层，使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力由于电镀过程而导致散热电路板。还提供了制造散热电路板的方法。

2. 发明申请

US20110240346A1 HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：加热基板及其制造方法
公开(公告)号：US20110240346A1
公开(公告)日：2011-10-06
申请号：US12852323
申请日：2010-08-06
申请人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
发明人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
IPC分类号： H05K1/09 , H01B13/16
CPC分类号： H05K3/445 , H01L2924/0002 , H05K3/4608 , H05K3/465 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T29/49128 , H01L2924/00
摘要： Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer.Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer.In addition, disclosed is a method of manufacturing the heat-radiating substrate.
摘要翻译：本文公开了一种散热基板。散热基板包括：金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层，具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层，其被嵌入在所述第一绝缘层中，填充在所述多孔层的第二孔中，并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。此外，在本实施方式的散热基板中，第一电路层部分地填充在第二孔中，第二绝缘层填充在第二孔中，以使第一绝缘层成为平面。此外，公开了制造散热基板的方法。

3. 发明申请

US20120273558A1 HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：散热电路板及其制造方法
公开(公告)号：US20120273558A1
公开(公告)日：2012-11-01
申请号：US13540504
申请日：2012-07-02
申请人： Hye Sook SHIN , Seog Moon CHOI , Shan GAO , Chang Hyun LIM , Tae Hyun KIM , Young Ki LEE
发明人： Hye Sook SHIN , Seog Moon CHOI , Shan GAO , Chang Hyun LIM , Tae Hyun KIM , Young Ki LEE
IPC分类号： B23K1/20
CPC分类号： H05K7/205 , H05K1/0209 , H05K1/0263 , H05K1/053 , H05K3/202 , H05K3/24 , H05K3/341 , H05K2201/066 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要翻译：公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层，使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力由于电镀过程而导致散热电路板。还提供了制造散热电路板的方法。

4. 发明授权

US08198543B2 Rigid-flexible circuit board and method of manufacturing the same 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US08198543B2
公开(公告)日：2012-06-12
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun Kang , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Chang Hyun Lim
发明人： Jung Eun Kang , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Chang Hyun Lim
IPC分类号： H05K1/00
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

5. 发明授权

US08338714B2 Heat-radiating substrate and manufacturing method thereof 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US08338714B2
公开(公告)日：2012-12-25
申请号：US12852323
申请日：2010-08-06
申请人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
发明人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
IPC分类号： H05K1/00
CPC分类号： H05K3/445 , H01L2924/0002 , H05K3/4608 , H05K3/465 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T29/49128 , H01L2924/00
摘要： Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.
摘要翻译：本文公开了一种散热基板。散热基板包括：金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层，具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层，其被嵌入在所述第一绝缘层中，填充在所述多孔层的第二孔中，并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。此外，在本实施方式的散热基板中，第一电路层部分地填充在第二孔中，第二绝缘层填充在第二孔中，以使第一绝缘层成为平面。此外，公开了制造散热基板的方法。

6. 发明授权

US08134077B2 Heat dissipating circuit board and method of manufacturing the same 有权
公开(公告)号：US08134077B2
公开(公告)日：2012-03-13
申请号：US12614405
申请日：2009-11-07
申请人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
发明人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
IPC分类号： H05K7/20 , H05K1/00
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

7. 发明申请

US20110088928A1 HEAT DISSIPATING SUBSTRATE 审中-公开
标题翻译：热消散基板
公开(公告)号：US20110088928A1
公开(公告)日：2011-04-21
申请号：US12631640
申请日：2009-12-04
申请人： Chang Hyun LIM , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Young Ho Sohn
发明人： Chang Hyun LIM , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Young Ho Sohn
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0262 , H05K1/0263 , H05K1/053 , H05K3/44 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/09345 , H05K2201/09509 , H05K2201/09554 , H05K2203/0315
摘要： Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer.
摘要翻译：公开了一种散热基板，其包括金属板，形成在金属板的表面上的绝缘膜，形成在绝缘膜上的电路图案，以及形成为穿过金属板的至少一部分的第一通孔使得金属板和电路图形彼此电连接，并且还表现出优异的散热效果，并且由于不需要另外提供接地层和功率层，能够使电路板的构造简单。

8. 发明申请

US20110075374A1 RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US20110075374A1
公开(公告)日：2011-03-31
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
发明人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
IPC分类号： H05K7/20 , H05K1/00 , H05K3/10
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

9. 发明申请

US20110067902A1 HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热电路板及其制造方法
公开(公告)号：US20110067902A1
公开(公告)日：2011-03-24
申请号：US12614405
申请日：2009-11-07
申请人： Hye Sook SHIN , Seog Moon CHOI , Shan GAO , Chang Hyun LIM , Tae Hyun KIM , Young Ki LEE
发明人： Hye Sook SHIN , Seog Moon CHOI , Shan GAO , Chang Hyun LIM , Tae Hyun KIM , Young Ki LEE
IPC分类号： H05K1/00 , H05K7/20
CPC分类号： H05K7/205 , H05K1/0209 , H05K1/0263 , H05K1/053 , H05K3/202 , H05K3/24 , H05K3/341 , H05K2201/066 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要翻译：公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层，使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力由于电镀过程而导致散热电路板。还提供了制造散热电路板的方法。

10. 发明申请

US20130319734A1 PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：封装基板及其制造方法
公开(公告)号：US20130319734A1
公开(公告)日：2013-12-05
申请号：US13595900
申请日：2012-08-27
申请人： Sang Hyun Shin , Kwang Jik Lee , Hye Sook Shin , Joon Seok Kang
发明人： Sang Hyun Shin , Kwang Jik Lee , Hye Sook Shin , Joon Seok Kang
IPC分类号： H05K1/11 , H05K3/42 , H05K1/03
CPC分类号： H01L21/486 , H01L23/142 , H01L23/49827 , H01L2924/0002 , H05K3/424 , H05K3/427 , H05K3/445 , H05K2201/0959 , H05K2203/0716 , H05K2203/1423 , H01L2924/00
摘要： Disclosed herein is a package substrate including: a base substrate; insulation layers formed on upper and lower portions of the base substrate; a first metal layer formed on an upper portion of the insulation layer; a first through-via penetrating through the base substrate, the insulation layer, and the first metal layer and being made of an insulating material; a seed layer formed on upper and lower portions and an inner wall of the first through-via; a second metal layer formed on upper portions of the first metal layer and the seed layer; and a second through-via formed in the seed layer formed at the inner wall of the first through-via and the second metal layer.
摘要翻译：本文公开了一种封装衬底，包括：基底; 形成在基底基板的上部和下部的绝缘层; 形成在所述绝缘层的上部的第一金属层; 穿过基底基板，绝缘层和第一金属层并由绝缘材料制成的第一通孔; 形成在第一通孔的上部和下部以及内壁上的种子层; 形成在第一金属层和种子层的上部的第二金属层; 以及形成在形成在第一通孔和第二金属层的内壁处的种子层中的第二通孔。

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