专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09674646B2 Near field communication chip embedded in a wearable electronic device and wearable electronic device 有权
公开(公告)号：US09674646B2
公开(公告)日：2017-06-06
申请号：US14940247
申请日：2015-11-13
申请人： Yo-Han Jang , Byeong-Taek Moon , Young-Ki Lee , Il-Jong Song , Byeong-Hoon Lee
发明人： Yo-Han Jang , Byeong-Taek Moon , Young-Ki Lee , Il-Jong Song , Byeong-Hoon Lee
IPC分类号： H04B5/00 , H04W4/00 , H01Q7/00 , H01Q1/27 , H02J4/00 , H02J5/00
CPC分类号： H04W4/80 , H01Q1/273 , H01Q7/00 , H02J5/005 , H02J50/12 , H02J50/70 , H02J50/80 , H04B5/0031 , H04B5/0081
摘要： A wearable electronic device according to example embodiments includes a display panel configured to display an image, a main board including a processor configured to control an operation of the wearable electronic device, a metal frame defining a perimeter of the wearable electronic device, the metal frame including a metal material, the metal frame having first and second terminals, the first terminal being adjacent to the second terminal with a slit therebetween, a loop antenna between the display panel and the main board, the loop antenna configured to connect to the first and second terminals of the metal frame, and a near field communication (NFC) chip configured to connect to the metal frame and the loop antenna, the NFC chip configured to perform a near field communication by transmitting or receiving an NFC signal using the metal frame and the loop antenna.

2. 发明申请

US20160142866A1 NEAR FIELD COMMUNICATION CHIP EMBEDDED IN A WEARABLE ELECTRONIC DEVICE AND WEARABLE ELECTRONIC DEVICE 有权
标题翻译：嵌入式电子设备和可磨损电子设备中的现场通信芯片
公开(公告)号：US20160142866A1
公开(公告)日：2016-05-19
申请号：US14940247
申请日：2015-11-13
申请人： Yo-Han JANG , Byeong-Taek MOON , Young-Ki LEE , II-Jong SONG , Byeong-Hoon LEE
发明人： Yo-Han JANG , Byeong-Taek MOON , Young-Ki LEE , II-Jong SONG , Byeong-Hoon LEE
IPC分类号： H04W4/00 , H02J5/00 , H01Q7/00 , H04B5/00 , H01Q1/27
CPC分类号： H04W4/80 , H01Q1/273 , H01Q7/00 , H02J5/005 , H02J50/12 , H02J50/70 , H02J50/80 , H04B5/0031 , H04B5/0081
摘要： A wearable electronic device according to example embodiments includes a display panel configured to display an image, a main board including a processor configured to control an operation of the wearable electronic device, a metal frame defining a perimeter of the wearable electronic device, the metal frame including a metal material, the metal frame having first and second terminals, the first terminal being adjacent to the second terminal with a slit therebetween, a loop antenna between the display panel and the main board, the loop antenna configured to connect to the first and second terminals of the metal frame, and a near field communication (NFC) chip configured to connect to the metal frame and the loop antenna, the NFC chip configured to perform a near field communication by transmitting or receiving an NFC signal using the metal frame and the loop antenna.
摘要翻译：根据示例性实施例的可穿戴电子设备包括被配置为显示图像的显示面板，主板，包括被配置为控制可佩戴电子设备的操作的处理器，限定可佩戴电子设备的周边的金属框架，金属框架包括金属材料，所述金属框架具有第一和第二端子，所述第一端子与所述第二端子相邻，在所述第二端子之间具有狭缝，所述显示面板和所述主板之间的环形天线，所述环形天线被配置为连接到所述第一端子和金属框架的第二端子和被配置为连接到金属框架和环形天线的近场通信（NFC）芯片，NFC芯片被配置为通过使用金属框架发送或接收NFC信号来执行近场通信，环形天线。

3. 发明申请

US20160134730A1 HOUSING OF A MOBILE DEVICE, NEAR FIELD COMMUNICATION TRANSCEIVER AND MOBILE DEVICE 有权
标题翻译：移动设备的外壳，近场通信收发器和移动设备
公开(公告)号：US20160134730A1
公开(公告)日：2016-05-12
申请号：US14842938
申请日：2015-09-02
申请人： Young-Ki LEE , Byeong-Taek MOON , Yo-Han JANG , Il-jong SONG , Jae-Suk LEE , Byeong-Hoon LEE
发明人： Young-Ki LEE , Byeong-Taek MOON , Yo-Han JANG , Il-jong SONG , Jae-Suk LEE , Byeong-Hoon LEE
IPC分类号： H04M1/02
CPC分类号： H04M1/026 , H01Q1/00 , H01Q1/243 , H01Q7/005 , H04M1/0249 , H04M1/72575 , H04M2201/08 , H04M2250/04 , H04W88/06
摘要： A housing of a mobile device including a frame defining a perimeter of the mobile device, the frame including a first metal material and configured to operate as a first antenna for a first wireless communication, and a cover configured to cover one surface of the mobile device, the cover including a second metal material, and the cover and at least a portion of the frame configured to operate as a second antenna for a second wireless communication may be provided.
摘要翻译：一种移动设备的壳体，包括限定移动设备的周边的框架，该框架包括第一金属材料并且被配置为作为用于第一无线通信的第一天线进行操作，以及被配置为覆盖移动设备的一个表面的盖可以提供包括第二金属材料的盖，并且可以提供盖和被配置为用作第二无线通信的第二天线的帧的至少一部分。

4. 发明授权

US08911310B2 Arrowhead having expanding blades controlled by gear mechanism 有权
标题翻译：具有由齿轮机构控制的扩张叶片的箭头
公开(公告)号：US08911310B2
公开(公告)日：2014-12-16
申请号：US13900931
申请日：2013-05-23
申请人： Young Ki Lee
发明人： Young Ki Lee
IPC分类号： F42B6/08
CPC分类号： F42B6/08
摘要： Disclosed is an arrowhead in which a plurality of expandable blades can be quickly and reliably retracted or expanded without using an additional means to bundle the expanding blades, thereby enhancing the penetrating capability or killing capability of an arrow. Particularly, a portion of a shaft forming the arrowhead is provided with a rack gear portion installed thereon and a lower end of each of the expanding blades is provided with a pinion gear portion, such that the rack gear portion and the pinion gear portion engage with each other and such a rack-pinion action controls the operation of retracting or expanding the expanding blades.
摘要翻译：公开了一种箭头，其中可以快速且可靠地缩回或扩展多个可扩展叶片，而不需要使用附加装置来捆扎扩张刀片，从而增强箭头的穿透能力或杀伤能力。特别地，形成箭头的轴的一部分设置有安装在其上的齿条部分，并且每个扩展叶片的下端设置有小齿轮部分，使得齿条部分和小齿轮部分与彼此并且这种齿条 - 小齿轮动作控制缩回或扩大扩张刀片的操作。

5. 发明授权

US08744232B2 Method for controlling video recorder, and video recorder adopting the method 有权
标题翻译：录像机控制方法及采用该方法的录像机
公开(公告)号：US08744232B2
公开(公告)日：2014-06-03
申请号：US12709164
申请日：2010-02-19
申请人： Young-ki Lee
发明人： Young-ki Lee
IPC分类号： H04N5/77
CPC分类号： G11B5/09 , H04L67/025 , H04N5/76 , H04N5/765 , H04N5/77 , H04N5/775 , H04N5/781 , H04N21/2187 , H04N21/23406 , H04N21/2747
摘要： A video recorder connected to a plurality of cameras and a plurality of client devices and a method of controlling the video recorder are provided. The method includes: setting a plurality of buffers, in a memory of the video recorder, corresponding to the plurality of cameras, respectively, and setting a plurality of positions in at least one buffer of the buffers for loading image data input from a corresponding camera of the plurality of cameras; loading, in the at least one buffer, the image data on given positions of the plurality of positions; and transmitting the loaded image data to the plurality of client devices so that each of the plurality of client devices receives the image data input from a same corresponding camera.
摘要翻译：提供了连接到多个摄像机的视频记录器和多个客户端设备以及控制录像机的方法。该方法包括：在视频记录器的存储器中分别对应于多个摄像机设置多个缓冲器，并在缓冲器的至少一个缓冲器中设置多个位置，以加载从相应摄像机输入的图像数据的多个相机; 在所述至少一个缓冲器中加载所述多个位置的给定位置上的图像数据; 以及将所加载的图像数据发送到所述多个客户端设备，使得所述多个客户端设备中的每一个接收从相同对应的相机输入的图像数据。

6. 发明授权

US08686295B2 Heat-dissipating substrate and fabricating method thereof 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US08686295B2
公开(公告)日：2014-04-01
申请号：US12614407
申请日：2009-11-07
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Young Ki Lee , Sung Keun Park
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Young Ki Lee , Sung Keun Park
IPC分类号： H05K1/00 , H05K1/03 , H05K1/09 , H05K7/20
CPC分类号： H05K3/02 , H05K1/0201 , H05K1/053 , H05K3/0061 , H05K2201/062 , H05K2201/09881 , H05K2201/09972 , H05K2203/0315
摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
摘要翻译：这里公开了散热基板及其制造方法。散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。在形成在金属板的上表面上的阳极氧化层上形成电路层。散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

7. 发明授权

US08610146B2 Light emitting diode package and method of manufacturing the same 失效
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08610146B2
公开(公告)日：2013-12-17
申请号：US12238663
申请日：2008-09-26
申请人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
发明人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/647 , H01L2224/16225 , H01L2224/45139 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2224/48091 , H01L2924/00 , H01L2224/0401
摘要： Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.
摘要翻译：本发明提供一种LED封装体，其具有形成有一个以上的通孔的金属基板; 绝缘层，其形成在包括所述通孔的内表面的所述金属基板的表面上; 多个金属图案，形成在绝缘层上并且彼此电隔离; 以及安装在多个金属图案中的金属图案上的LED芯片。

8. 发明授权

US08599710B2 Mobile apparatus supporting context monitoring, method of monitoring context using the same and context monitoring system having the same 失效
标题翻译：支持上下文监控的移动设备，使用相同的上下文监视系统的监视方法
公开(公告)号：US08599710B2
公开(公告)日：2013-12-03
申请号：US13036521
申请日：2011-02-28
申请人： June-Hwa Song , Yun-Seok Rhee , Young-Ki Lee , Chul-Hong Min , Young-Hyun Ju , Tai-Woo Park , Jin-Won Lee , Seung-Woo Kang
发明人： June-Hwa Song , Yun-Seok Rhee , Young-Ki Lee , Chul-Hong Min , Young-Hyun Ju , Tai-Woo Park , Jin-Won Lee , Seung-Woo Kang
IPC分类号： H04L12/26
CPC分类号： H04W84/18 , G06F9/50
摘要： A mobile apparatus includes a processing planner and a plan processor. The processing planner generates a plurality of resource use plans in response to a context monitoring query (CMQ) of an application, and selects a final plan satisfying a request of the CMQ among the resource use plans. The plan processor executes the final plan. Accordingly, the mobile apparatus may support resource-efficient context monitoring.
摘要翻译：移动装置包括处理计划器和计划处理器。处理计划器响应于应用的上下文监视查询（CMQ）生成多个资源使用计划，并且在资源使用计划中选择满足CMQ的请求的最终计划。计划处理器执行最终计划。因此，移动装置可以支持资源有效的上下文监控。

9. 发明授权

US08586128B2 Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof 有权
公开(公告)号：US08586128B2
公开(公告)日：2013-11-19
申请号：US12467513
申请日：2009-05-18
申请人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
发明人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
IPC分类号： B05D5/12
CPC分类号： H01L33/483 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2924/00014
摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

10. 发明授权

US08502374B2 Power module package and method for manufacturing the same 失效
标题翻译：电源模块封装及其制造方法
公开(公告)号：US08502374B2
公开(公告)日：2013-08-06
申请号：US13281285
申请日：2011-10-25
申请人： Kwang Soo Kim , Young Ki Lee , Sung Keun Park , Seog Moon Choi , Chang Hyun Lim
发明人： Kwang Soo Kim , Young Ki Lee , Sung Keun Park , Seog Moon Choi , Chang Hyun Lim
IPC分类号： H01L23/34
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3142 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.
摘要翻译：这里公开了功率模块封装及其制造方法。功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式