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1. 发明申请

US20130062744A1 POWER MODULE PACKAGE 审中-公开
标题翻译：电源模块封装
公开(公告)号：US20130062744A1
公开(公告)日：2013-03-14
申请号：US13316121
申请日：2011-12-09
申请人： Kwang Soo Kim , Jung Eun Kang , Young Ki Lee
发明人： Kwang Soo Kim , Jung Eun Kang , Young Ki Lee
IPC分类号： H01L23/495
CPC分类号： H01L23/3677 , H01L23/36 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19105 , H01L2924/00 , H01L2924/00012
摘要： Disclosed herein is a power module package, including: a first substrate having one surface and the other surface; first vias formed to penetrate from one surface of the first substrate to the other surface thereof; a metal layer formed on one surface of the first substrate; semiconductor devices formed on the metal layer; and a metal plate formed on the other surface of the first substrate.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 形成为从第一基板的一个表面穿透到其另一个表面的第一通孔; 形成在所述第一基板的一个表面上的金属层; 形成在金属层上的半导体器件; 以及形成在所述第一基板的另一个表面上的金属板。

2. 发明申请

US20120067623A1 HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：加热基板及其制造方法
公开(公告)号：US20120067623A1
公开(公告)日：2012-03-22
申请号：US13007414
申请日：2011-01-14
申请人： Sung Keun PARK , Chang Hyun LIM , Seog Moon CHOI , Kwang Soo KIM , Jung Eun KANG
发明人： Sung Keun PARK , Chang Hyun LIM , Seog Moon CHOI , Kwang Soo KIM , Jung Eun KANG
IPC分类号： H05K1/00 , H05K3/02
CPC分类号： H01L23/142 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/291 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01013 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15156 , H01L2924/15747 , H01L2924/181 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer.
摘要翻译：本发明公开了一种散热基板，包括：铜基板; 形成在铜基板一侧的氧化铝层; 形成在氧化铝层上的第一电路层; 以及形成在第一电路层上的第二电路层，其中散热元件安装在第一电路层的第一焊盘或第二电路层的第二焊盘上，或者直接安装在铜的暴露侧在氧化铝层上形成开口后的基板。

3. 发明申请

US20110304990A1 HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：加热基板及其制造方法
公开(公告)号：US20110304990A1
公开(公告)日：2011-12-15
申请号：US12884058
申请日：2010-09-16
申请人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
发明人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
IPC分类号： H05K7/20 , B32B38/04 , B32B38/10 , H05K1/00 , B32B37/02
CPC分类号： H05K1/0203 , H05K1/053 , H05K1/141 , H05K2201/062 , H05K2201/09745 , H05K2201/10166 , Y10T29/49083 , Y10T29/49124 , Y10T29/49155 , Y10T156/10 , Y10T156/1056 , Y10T156/1064
摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.
摘要翻译：这里公开了散热基板及其制造方法。散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热量损坏。浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

4. 发明申请

US20110303437A1 HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：加热基板及其制造方法
公开(公告)号：US20110303437A1
公开(公告)日：2011-12-15
申请号：US12911620
申请日：2010-10-25
申请人： Chang Hyun LIM , Jung Eun KANG , Seog Moon CHOI , Kwang Soo KIM , Joon Seok CHAE , Sung Keun PARK
发明人： Chang Hyun LIM , Jung Eun KANG , Seog Moon CHOI , Kwang Soo KIM , Joon Seok CHAE , Sung Keun PARK
IPC分类号： H05K1/00 , H05B3/00
CPC分类号： H05K1/0203 , H05K1/053 , H05K2201/049 , H05K2201/062 , H05K2201/10166 , H05K2203/0315 , Y10T29/49083
摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element.
摘要翻译：这里公开了散热基板及其制造方法。散热基板包括芯层，芯层包括芯金属层和形成在芯金属层上的芯绝缘层，并分成第一区域和第二区域; 形成在芯层的第一区域中的电路层; 以及形成在芯层的第二区域中并包括积聚绝缘层和积聚电路层的堆积层。发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱元件被发热元件产生的热量损坏。

5. 发明授权

US08338714B2 Heat-radiating substrate and manufacturing method thereof 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US08338714B2
公开(公告)日：2012-12-25
申请号：US12852323
申请日：2010-08-06
申请人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
发明人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
IPC分类号： H05K1/00
CPC分类号： H05K3/445 , H01L2924/0002 , H05K3/4608 , H05K3/465 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T29/49128 , H01L2924/00
摘要： Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.
摘要翻译：本文公开了一种散热基板。散热基板包括：金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层，具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层，其被嵌入在所述第一绝缘层中，填充在所述多孔层的第二孔中，并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。此外，在本实施方式的散热基板中，第一电路层部分地填充在第二孔中，第二绝缘层填充在第二孔中，以使第一绝缘层成为平面。此外，公开了制造散热基板的方法。

6. 发明授权

US08315056B2 Heat-radiating substrate and method of manufacturing the same 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US08315056B2
公开(公告)日：2012-11-20
申请号：US12884058
申请日：2010-09-16
申请人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
发明人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
IPC分类号： H05K7/20 , H05K1/03
CPC分类号： H05K1/0203 , H05K1/053 , H05K1/141 , H05K2201/062 , H05K2201/09745 , H05K2201/10166 , Y10T29/49083 , Y10T29/49124 , Y10T29/49155 , Y10T156/10 , Y10T156/1056 , Y10T156/1064
摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.
摘要翻译：这里公开了散热基板及其制造方法。散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热量损坏。浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

7. 发明申请

US20120073863A1 ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：阳极加热基板及其制造方法
公开(公告)号：US20120073863A1
公开(公告)日：2012-03-29
申请号：US13007464
申请日：2011-01-14
申请人： Jung Eun KANG , Kwang Soo KIM , Seog Moon CHOI , Sung Keun PARK , Chang Hyun LIM
发明人： Jung Eun KANG , Kwang Soo KIM , Seog Moon CHOI , Sung Keun PARK , Chang Hyun LIM
IPC分类号： H05K1/00 , H05K3/44
CPC分类号： H05K1/053 , H05K3/445 , Y10T29/49147
摘要： Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member.
摘要翻译：本文公开了一种阳极氧化散热基板。阳极氧化的散热基板的优点在于它具有良好的辐射特性，因为在金属层的整个表面上形成阳极氧化的氧化物层。并且，阳极氧化散热基板的优点在于它具有高密度/高的积聚特性，因为它通过使用连接件形成多层结构。

8. 发明申请

US20120000697A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120000697A1
公开(公告)日：2012-01-05
申请号：US12954416
申请日：2010-11-24
申请人： Jung Eun Kang , Seog Moon Choi , Sung Keun Park , Chang Hyun Lim , Kwang Soo Kim
发明人： Jung Eun Kang , Seog Moon Choi , Sung Keun Park , Chang Hyun Lim , Kwang Soo Kim
IPC分类号： H05K1/03 , H05K3/02 , H05K1/02
CPC分类号： H05K1/053 , H01L23/13 , H01L23/142 , H01L23/498 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K3/107 , H05K3/108 , H05K2201/10166 , H05K2203/0315 , H05K2203/0369 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer.
摘要翻译：本文公开了一种印刷电路板，包括：其中形成有腔的基板; 通过阳极氧化所述基板形成的阳极氧化层; 以及形成在空腔中的电路层。印刷电路板的优点在于，由于电路层形成在基板的空腔中，所以可以容易地形成具有实现大功率半导体封装所需的厚度的电路层，并且难以供应和要求可以克服厚膜电镀抗蚀剂的原料。此外，印刷电路板的优点在于，可以防止在形成厚电路层时发生的电短路和蚀刻后残留的化合物产生的电短路，从而提高电路层的电可靠性和稳定性。

9. 发明申请

US20110075374A1 RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US20110075374A1
公开(公告)日：2011-03-31
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
发明人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
IPC分类号： H05K7/20 , H05K1/00 , H05K3/10
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

10. 发明授权

US08198543B2 Rigid-flexible circuit board and method of manufacturing the same 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US08198543B2
公开(公告)日：2012-06-12
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun Kang , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Chang Hyun Lim
发明人： Jung Eun Kang , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Chang Hyun Lim
IPC分类号： H05K1/00
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

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