专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110075374A1 RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US20110075374A1
公开(公告)日：2011-03-31
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
发明人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
IPC分类号： H05K7/20 , H05K1/00 , H05K3/10
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

2. 发明申请

US20130037967A1 SEMICONDUCTOR PACKAGE SUBSTRATE 有权
标题翻译：半导体封装基板
公开(公告)号：US20130037967A1
公开(公告)日：2013-02-14
申请号：US13308441
申请日：2011-11-30
申请人： Jong Man KIM , Young Hoon KWAK , Kyu Hwan OH , Seog Moon CHOI , Tae Hoon KIM
发明人： Jong Man KIM , Young Hoon KWAK , Kyu Hwan OH , Seog Moon CHOI , Tae Hoon KIM
IPC分类号： H01L23/488
CPC分类号： H01L23/36 , H01L21/563 , H01L23/562 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26145 , H01L2224/26175 , H01L2224/29076 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/83385 , H01L2224/834 , H01L2224/83411 , H01L2224/83418 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83466 , H01L2224/83471 , H01L2224/8348 , H01L2224/83484 , H01L2924/15787 , H01L2924/00014 , H01L2924/01014 , H01L2924/014 , H01L2924/0665 , H01L2924/00
摘要： Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.
摘要翻译：本发明公开了一种半导体封装基板，其包括基底基板，安装在基底基板的上部的安装部件和形成在基底基板与安装部件之间的粘合层，其中粘合层包括导热粘合剂和在导热粘合剂的外周形成的韧性粘合剂。

3. 发明申请

US20120001544A1 LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：发光模块及其制造方法
公开(公告)号：US20120001544A1
公开(公告)日：2012-01-05
申请号：US12904512
申请日：2010-10-14
申请人： Tae Hoon KIM , Sang Hyun SHIN , Cheol Ho HEO , Young Ki LEE , Ji Hyun PARK , Ki Ho SEO
发明人： Tae Hoon KIM , Sang Hyun SHIN , Cheol Ho HEO , Young Ki LEE , Ji Hyun PARK , Ki Ho SEO
IPC分类号： H01J7/44 , H01J9/00
CPC分类号： H01L25/167 , H01L27/3276 , H01L27/3288 , H01L33/641 , H01L51/529 , H01L2924/0002 , H05K1/0203 , H05K3/445 , H05K2201/10106 , H05K2201/10128 , H05K2203/0315 , H01L2924/00
摘要： Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component.
摘要翻译：公开了发光模块和制造发光模块的方法。发光模块包括：散热基板，其包括具有通孔的金属基板，沿着通孔的内壁形成的内部绝缘层，以及覆盖金属基板的所有外表面的外部绝缘层; 设置在散热基板的上表面上的发光部件单元; 驱动电路单元，其电连接到所述发光部件单元，并且安装在所述散热基板上以向所述发光部件单元施加驱动信号; 无源部件，其被安装在散热基板上并电连接到驱动电路单元; 以及电路布线层，其分别设置在散热基板的顶部和底部，并且通过形成在通孔上的通孔与散热基板的内部绝缘层相互连接，并且起到电互连的作用驱动电路单元和发光部件单元，或者驱动电路单元和无源部件。

4. 发明申请

US20130026616A1 POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电源设备封装模块及其制造方法
公开(公告)号：US20130026616A1
公开(公告)日：2013-01-31
申请号：US13557834
申请日：2012-07-25
申请人： Suk Ho LEE , Jae Cheon DOH , Young Hoon KWAK , Tae Hoon KIM , Tao Jyun KIM , Young Ki LEE
发明人： Suk Ho LEE , Jae Cheon DOH , Young Hoon KWAK , Tae Hoon KIM , Tao Jyun KIM , Young Ki LEE
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/49575 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L25/18 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2225/1017 , H01L2225/1047 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/1515 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： The present invention relates to a power device package module and a manufacturing method thereof. In one aspect of the present invention, a power device package module includes: a control unit a first lead frame, a control chip and a first coupling portion that are mounted on a first substrate, wherein the first lead frame and the first coupling portion are electrically connected to the control chip, and individually molded; and a power unit including a second lead frame, a power chip and a second coupling portion that are mounted on a second substrate, wherein the second lead frame and the second coupling portion are electrically connected to the power chip, and individually molded, wherein the individually molded control unit and power unit are coupled by the first coupling portion and the second coupling portion.
摘要翻译：功率器件封装模块及其制造方法技术领域本发明涉及功率器件封装模块及其制造方法。在本发明的一个方面，功率器件封装模块包括：控制单元，安装在第一衬底上的第一引线框架，控制芯片和第一耦合部分，其中第一引线框架和第一耦合部分是电连接到控制芯片，并单独模制; 以及功率单元，其包括安装在第二基板上的第二引线框架，功率芯片和第二耦合部分，其中所述第二引线框架和所述第二耦合部分电连接到所述功率芯片，并且分别模制，其中单独模制的控制单元和动力单元通过第一联接部分和第二联接部分联接。

5. 发明申请

US20160160122A1 FLUORIDE PHOSPHOR COMPOSITE, METHOD OF MANUFACTURING FLUORIDE PHOSPHOR COMPOSITE, WHITE LIGHT EMITTING APPARATUS, DISPLAY APPARATUS, LIGHTING DEVICE, AND ELECTRONIC DEVICE 有权
标题翻译：氟化磷复合材料，制造氟化磷复合材料的方法，白光发光装置，显示装置，照明装置和电子装置
公开(公告)号：US20160160122A1
公开(公告)日：2016-06-09
申请号：US14963268
申请日：2015-12-09
申请人： Ji Ho YOU , In Hyung LEE , Tae Hoon KIM , Jong Won PARK , Chul Soo YOON , Chi Woo LEE
发明人： Ji Ho YOU , In Hyung LEE , Tae Hoon KIM , Jong Won PARK , Chul Soo YOON , Chi Woo LEE
IPC分类号： C09K11/61 , C09K11/02
CPC分类号： C09K11/617 , C09K11/025 , C09K11/57 , C09K11/61 , Y02B20/181
摘要： There is provided a fluoride phosphor composite including: fluoride phosphor core particles that may be expressed by the empirical formula AxMFy:Mn4+, wherein A may be at least one selected from the group consisting of Li, Na, K, Rb, and Cs, M may be at least one selected from the group consisting of Si, Ti, Zr, Hf, Ge, and Sn, the composition ratio (x) of A may satisfy 2≦x≦3, the composition ratio (y) of F may satisfy 4≦y≦7, each fluoride phosphor composite particle may be coated with a Mn-free fluoride coating. The Mn-free fluoride coating may have a thickness less than or equal to 35% of the size of each fluoride phosphor composite particle.
摘要翻译：提供了一种氟化物荧光体复合体，其包括：可以由经验式AxMFy：Mn4 +表示的氟化物荧光体核心颗粒，其中A可以是选自Li，Na，K，Rb和Cs，M 可以是选自由Si，Ti，Zr，Hf，Ge和Sn组成的组中的至少一种，A的组成比（x）可以满足2＆nlE; x＆nlE; 3，F的组成比（y）可以满足 4＆nlE; y＆nlE; 7，每个氟化物荧光体复合颗粒可以涂覆无Mn的氟化物涂层。不含Mn的氟化物涂层可以具有小于或等于每个氟化物荧光体复合颗粒尺寸的35％的厚度。

6. 发明申请

US20120287069A1 METHOD OF CONTROLLING TOUCH PANEL DISPLAY DEVICE AND TOUCH PANEL DISPLAY DEVICE USING THE SAME 有权
标题翻译：控制面板显示装置的方法和使用其的触摸屏显示装置
公开(公告)号：US20120287069A1
公开(公告)日：2012-11-15
申请号：US13478418
申请日：2012-05-23
申请人： Tae Hoon KIM
发明人： Tae Hoon KIM
IPC分类号： G06F3/041
CPC分类号： G06F3/0416 , G06F3/0488 , G06F2203/04806 , G06F2203/04808
摘要： A method of controlling a touch panel display device, and which includes displaying a first display screen on the display device; receiving, via a controller of the touch panel display device and a touching signal indicating a touching action at a specific point on the first display screen; magnifying, via the controller, a predetermined area surrounding the specific point on the first display screen; displaying a second display screen including the magnified predetermined area with the specific point located at a center of the magnified predetermined area; receiving, via the controller, a selection signal indicating a selection of release touch icon displayed on the display device; and displaying the first display screen in response to the received selection signal.
摘要翻译：一种控制触摸面板显示装置的方法，包括在所述显示装置上显示第一显示画面; 经由所述触摸面板显示装置的控制器接收指示所述第一显示画面上的特定点的触摸动作的触摸信号; 经由所述控制器放大围绕所述第一显示屏上的所述特定点的预定区域; 显示包括放大的预定区域的第二显示屏幕，其特定点位于放大的预定区域的中心; 经由控制器接收指示显示在显示装置上的释放触摸图标的选择的选择信号; 以及响应于所接收的选择信号显示第一显示屏幕。

7. 发明申请

US20110309684A1 APPARATUS AND METHOD FOR THE ANTI-ISLANDING OF POWER CONDITIONING SYSTEM 有权
标题翻译：电力调节系统防雷装置及方法
公开(公告)号：US20110309684A1
公开(公告)日：2011-12-22
申请号：US12950534
申请日：2010-11-19
申请人： Doo Young SONG , Tae Hoon KIM , Tae Won LEE , Don Sik KIM , Jin Wook KIM , Jae Hyung KIM , Jun Gu KIM , Yong Hyok JI , Chung Yuen WON , Byoung Kuk LEE
发明人： Doo Young SONG , Tae Hoon KIM , Tae Won LEE , Don Sik KIM , Jin Wook KIM , Jae Hyung KIM , Jun Gu KIM , Yong Hyok JI , Chung Yuen WON , Byoung Kuk LEE
IPC分类号： H02J3/08
CPC分类号： H02J3/00 , H02J3/08 , H02J3/383 , H02J2003/388 , Y02E10/563 , Y10T307/735 , Y10T307/826 , Y10T307/852 , Y10T307/858
摘要： There is provided an apparatus for the anti-islanding of a power conditioning system. The apparatus for the anti-islanding of a power conditioning system according to the present invention is applied to a power conditioning system including a DC/DC converter and a DC/AC inverter in order to transfer power from a solar cell array to a grid. The apparatus for the anti-islanding of a power conditioning system may include an injection signal generator generating an injection signal, an adder generating a final fundamental wave command value, a main controller performing the power control according to the final fundamental wave command value and stopping the operation of the power conditioning system when the level of the detected injection signal has reached the predetermined reference level or more, and an injection signal detector detecting the injection signal included in voltage and providing them to the main controller.
摘要翻译：提供了用于电力调节系统的防孤岛的装置。根据本发明的用于电力调节系统的防孤岛的装置应用于包括DC / DC转换器和DC / AC逆变器的功率调节系统，以便将功率从太阳能电池阵列传送到电网。用于电力调节系统的防孤岛的装置可以包括产生喷射信号的喷射信号发生器，产生最终基波指令值的加法器，根据最终基波指令值执行功率控制的主控制器和停止当检测到的喷射信号的电平达到预定的参考水平或更高时，功率调节系统的操作;以及喷射信号检测器，检测包括在电压中的喷射信号并将其提供给主控制器。

8. 发明申请

US20110108995A1 SPIRAL STAIRCASE SHAPED STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：螺旋形平台堆叠式半导体封装及其制造方法
公开(公告)号：US20110108995A1
公开(公告)日：2011-05-12
申请号：US12819279
申请日：2010-06-21
申请人： Da Un NAH , Jae Myun KIM , Tae Hoon KIM , Jung Tae JEONG , Bok Gyu MIN , Ki Bum KIM
发明人： Da Un NAH , Jae Myun KIM , Tae Hoon KIM , Jung Tae JEONG , Bok Gyu MIN , Ki Bum KIM
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L24/73 , H01L23/481 , H01L24/16 , H01L24/48 , H01L25/0657 , H01L2224/05554 , H01L2224/13025 , H01L2224/13099 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48108 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A spiral staircase shaped stacked semiconductor package is presented. The package includes a semiconductor chip module, a substrate and connection members. The semiconductor chip module includes at least two semiconductor chips which have chip selection pads and through-electrodes. The semiconductor chips are stacked such that the chip selection pads are exposed and the through-electrodes of the stacked semiconductor chips are electrically connected to one another. The substrate has the semiconductor chip module mounted thereto and has connection pads. The connection members electrically connect the chip selection pads to respective connection pads.
摘要翻译：提出了一种螺旋状梯形堆叠半导体封装。封装包括半导体芯片模块，基板和连接构件。半导体芯片模块包括具有芯片选择焊盘和贯通电极的至少两个半导体芯片。堆叠半导体芯片，使得芯片选择焊盘被暴露，并且堆叠的半导体芯片的贯通电极彼此电连接。基板具有安装在其上的半导体芯片模块并具有连接焊盘。连接构件将芯片选择焊盘电连接到相应的连接焊盘。

9. 发明申请

US20100062256A1 Method and Appartus for Making Composite Solid Surface Article and Composite Solid Surface Article Containing Large Particles 有权
标题翻译：制备复合固体表面物品和复合固体表面物品的方法和应用包含大颗粒
公开(公告)号：US20100062256A1
公开(公告)日：2010-03-11
申请号：US12619787
申请日：2009-11-17
申请人： Do Choon RHA , Tae Hoon KIM , Mi Gon KIM , Gwang Ho JUNG
发明人： Do Choon RHA , Tae Hoon KIM , Mi Gon KIM , Gwang Ho JUNG
IPC分类号： B32B5/16 , B27N1/02 , B28B5/02 , B29B7/90
CPC分类号： B01F3/14 , B01F3/1221 , B01F7/00708 , B01F7/086 , B01F15/0251 , B29C67/243 , C04B26/06 , C04B2111/545 , C08K3/32 , Y10T428/2998 , Y10T428/31504 , C04B14/285 , C04B14/303 , C04B20/0076
摘要： A method and apparatus for producing a composite solid surface article are disclosed. The method includes feeding a first composition toward a mixing point and feeding solid particles toward the mixing point. The method further includes mixing at the mixing point the first composition and the solid particles fed to the mixing point to form a second composition, and transferring the second composition away from the mixing point. The method further comprises polymerizing the polymerizable compound in the second compound so as to form a curable composition comprising the solid particles. The apparatus includes a solid particle feeder, a slurry feeder and a blender configured to blend and transfer a mixture of the solid surface forming slurry and solid particles away from the blending area. The composite solid surface article produced using the method and apparatus contain particles with a size greater than 5 mm.
摘要翻译：公开了一种用于制备复合固体表面制品的方法和装置。该方法包括将第一组合物朝向混合点进料并将固体颗粒送入混合点。该方法还包括在混合点将第一组合物和进料到混合点的固体颗粒混合以形成第二组合物，并将第二组合物从混合点转移出来。该方法还包括在第二化合物中聚合可聚合化合物，以形成包含固体颗粒的可固化组合物。该设备包括固体颗粒进料器，浆料进料器和混合器，其构造成将固体表面形成浆料和固体颗粒的混合物与混合区域混合并转移。使用该方法和装置制备的复合固体表面制品包含尺寸大于5mm的颗粒。

10. 发明申请

US20140003093A1 MULTI-LEVEL CONVERTER, AND INVERTER HAVING THE SAME AND SOLAR POWER SUPPLY APPARATUS HAVING THE SAME 审中-公开
标题翻译：多电平转换器及具有该电平变换器的逆变器及具有该电容器的太阳能电源装置
公开(公告)号：US20140003093A1
公开(公告)日：2014-01-02
申请号：US13620478
申请日：2012-09-14
申请人： Doo Young SONG , Sung Jun PARK , Min Ho HEO , Tae Hoon KIM , Tae Won LEE
发明人： Doo Young SONG , Sung Jun PARK , Min Ho HEO , Tae Hoon KIM , Tae Won LEE
IPC分类号： H02M7/42 , G05F1/46
CPC分类号： H02M7/483 , H02M2001/007 , H02M2001/348 , Y02E10/56
摘要： There are provided a multi-level converter capable of outputting power having various voltage levels with respect to a single input power supply by using a simple circuit, an inverter having the same, and a solar power supply apparatus having the same. The multi-level converter includes a first buck-boost unit having a first power switch switching an input power supply and outputting a first power having a voltage level varied according to switching of the first power switch; a bypass unit outputting a second power having a voltage level of the input power supply; and a second buck-boost unit having a second power switch switching the input power supply and outputting a third power having a voltage level varied according to switching of the second power switch.
摘要翻译：提供一种多电平转换器，其能够通过使用简单的电路输出具有相对于单个输入电源的各种电压电平的电力，具有该电力的逆变器和具有该电力的太阳能供电装置。多电平转换器包括第一降压 - 升压单元，其具有切换输入电源的第一电源开关并输出具有根据第一电力开关的切换而变化的电压电平的第一功率; 输出具有所述输入电源的电压电平的第二电力的旁路单元; 以及第二降压 - 升压单元，其具有切换所述输入电源并输出具有根据所述第二电力开关的切换而变化的电压电平的第三功率的第二电源开关。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式