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1. 发明授权

US07762870B2 Polishing pad and cushion layer for polishing pad 有权
标题翻译：抛光垫和抛光垫垫层
公开(公告)号：US07762870B2
公开(公告)日：2010-07-27
申请号：US11366981
申请日：2006-03-02
申请人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
发明人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
IPC分类号： B24D3/32 , B24D11/00
CPC分类号： B24B37/26 , B24B37/22 , B24D3/28 , B24D11/001 , B24D11/008
摘要： A polishing pad includes a polishing layer having abrasive grains dispersed in a resin and is characterized in that the resin is a resin containing ionic groups in the range of 20 to 1500 eq/ton.
摘要翻译：抛光垫包括具有分散在树脂中的磨粒的抛光层，其特征在于该树脂是含有20至1500eq / ton范围内的离子基团的树脂。

2. 发明授权

US07641540B2 Polishing pad and cushion layer for polishing pad 有权
标题翻译：抛光垫和抛光垫垫层
公开(公告)号：US07641540B2
公开(公告)日：2010-01-05
申请号：US11366077
申请日：2006-03-02
申请人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
发明人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
IPC分类号： B24D11/00
CPC分类号： B24B37/26 , B24B37/22 , B24D3/28 , B24D11/001 , B24D11/008
摘要： A polishing pad includes at least a polishing layer and a cushion layer and is characterized in that the difference in hardness in Shore D hardness between the polishing layer and the cushion layer is 3 or more.
摘要翻译：抛光垫至少包括抛光层和缓冲层，其特征在于，抛光层和缓冲层之间的肖氏D硬度的硬度差为3以上。

3. 发明申请

US20060148391A1 Polishing pad and cushion layer for polishing pad 有权
标题翻译：抛光垫和抛光垫垫层
公开(公告)号：US20060148391A1
公开(公告)日：2006-07-06
申请号：US11366077
申请日：2006-03-02
申请人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
发明人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
IPC分类号： B24D11/00
CPC分类号： B24B37/26 , B24B37/22 , B24D3/28 , B24D11/001 , B24D11/008
摘要： A polishing pad includes at least a polishing layer and a cushion layer and is characterized in that the difference in hardness in Shore D hardness between the polishing layer and the cushion layer is 3 or more.
摘要翻译：抛光垫至少包括抛光层和缓冲层，其特征在于，抛光层和缓冲层之间的肖氏D硬度的硬度差为3以上。

4. 发明授权

US07192340B2 Polishing pad, method of producing the same, and cushion layer for polishing pad 有权
标题翻译：抛光垫，其制造方法和抛光垫用缓冲层
公开(公告)号：US07192340B2
公开(公告)日：2007-03-20
申请号：US10432410
申请日：2001-11-28
申请人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
发明人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
IPC分类号： B24D11/00
CPC分类号： B24B37/26 , B24B37/22 , B24D3/28 , B24D11/001 , B24D11/008
摘要： The polishing pad of this invention is a polishing pad effecting stable planarizing processing, at high polishing rate, materials requiring surface flatness at high level, such as a silicon wafer for semiconductor devices, a magnetic disk, an optical lens etc. This invention provides a polishing pad which can be subjected to surface processing to form a sheet or grooves, is excellent in thickness accuracy, attains a high polishing rate, achieves a uniform polishing rate, and also provides a polishing pad which is free of quality variations resulting from an individual variation, easily enables a change the surface patterns, enables fine surface pattern, is compatible with various materials to be polished, is free of burrs upon forming the pattern. This invention provides a polishing pad which can have abrasive grains mixed at very high density without using slurry, and generates few scratches by preventing aggregation of abrasive grains dispersed therein. The polishing pad of this invention has a polishing layer formed from a curing composition to be cured with energy rays, the polishing layer being formed surface pattern thereon by photolithography. The polishing pad of this invention comprises a polishing layer resin having abrasive grains dispersed therein, the resin containing ionic groups in the range of 20 to 1500 eq/ton.
摘要翻译：本发明的研磨垫是在高抛光速度下进行稳定的平坦化处理的抛光垫，例如需要高水平的表面平坦度的材料，例如半导体器件的硅晶片，磁盘，光学透镜等。本发明提供了一种可进行表面处理以形成片材或沟槽的抛光垫具有优异的厚度精度，达到高抛光速率，达到均匀的抛光速率，并且还提供一种抛光垫，该抛光垫没有由个体产生的质量变化变化，容易使表面图案发生变化，使精细表面图案与各种待抛光材料兼容，在形成图案时无毛刺。本发明提供一种抛光垫，其可以在不使用浆料的情况下具有以非常高的密度混合的磨料颗粒，并且通过防止分散在其中的磨料颗粒的聚集而产生少量划痕。本发明的抛光垫具有由能量射线固化的固化组合物形成的抛光层，该抛光层通过光刻形成在其上的表面图案。本发明的抛光垫包括其中分散有磨粒的抛光层树脂，含有离子基团的树脂在20至1500eq / ton的范围内。

5. 发明申请

US20060148393A1 Polishing pad and cushion layer for polishing pad 有权
标题翻译：抛光垫和抛光垫垫层
公开(公告)号：US20060148393A1
公开(公告)日：2006-07-06
申请号：US11366981
申请日：2006-03-02
申请人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
发明人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
IPC分类号： B24D11/00
CPC分类号： B24B37/26 , B24B37/22 , B24D3/28 , B24D11/001 , B24D11/008
摘要： A polishing pad includes a polishing layer having abrasive grains dispersed in a resin and is characterized in that the resin is a resin containing ionic groups in the range of 20 to 1500 eq/ton.
摘要翻译：抛光垫包括具有分散在树脂中的磨粒的抛光层，其特征在于该树脂是含有20至1500eq / ton范围内的离子基团的树脂。

6. 发明授权

US07329170B2 Method of producing polishing pad 有权
标题翻译：抛光垫的生产方法
公开(公告)号：US07329170B2
公开(公告)日：2008-02-12
申请号：US11366238
申请日：2006-03-02
申请人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
发明人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
IPC分类号： B24B1/00
CPC分类号： B24B37/26 , B24B37/22 , B24D3/28 , B24D11/001 , B24D11/008
摘要： A method of producing a polishing pad having a polishing layer is characterized in that the polishing layer is produced by a photolithographic method including: forming a sheet molding from a curing composition containing at least an initiator and an energy ray-reactive compound to be cured with energy rays; exposing the sheet molding to energy rays to induce modification thereof, to change the solubility of the sheet molding in a solvent; and developing the sheet molding after irradiation with energy rays, to partially remove the curing composition with a solvent thereby forming a concave and convex pattern at least one surface.
摘要翻译：一种制造具有抛光层的抛光垫的方法的特征在于，抛光层通过光刻法制造，包括：由至少含有引发剂和能量射线反应性化合物的固化组合物形成片状模制品，以使其固化能量射线将片材模制物暴露于能量射线以引起其修饰，以改变片材模制品在溶剂中的溶解度; 并且在用能量射线照射之后显影片材成型体，用溶剂部分地除去固化组合物，从而在至少一个表面上形成凹凸图案。

7. 发明申请

US20060148392A1 Method of producing polishing pad 有权
标题翻译：抛光垫的生产方法
公开(公告)号：US20060148392A1
公开(公告)日：2006-07-06
申请号：US11366238
申请日：2006-03-02
申请人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
发明人： Koichi Ono , Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Masayuki Tsutsumi
IPC分类号： B24D11/00
CPC分类号： B24B37/26 , B24B37/22 , B24D3/28 , B24D11/001 , B24D11/008
摘要： A method of producing a polishing pad having a polishing layer is characterized in that the polishing layer is produced by a photolithographic method including: forming a sheet molding from a curing composition containing at least an initiator and an energy ray-reactive compound to be cured with energy rays; exposing the sheet molding to energy rays to induce modification thereof, to change the solubility of the sheet molding in a solvent; and developing the sheet molding after irradiation with energy rays, to partially remove the curing composition with a solvent thereby forming a concave and convex pattern at least one surface.
摘要翻译：一种制造具有抛光层的抛光垫的方法的特征在于，抛光层通过光刻法制造，包括：由至少含有引发剂和能量射线反应性化合物的固化组合物形成片状模制品，以使其固化能量射线将片材模制物暴露于能量射线以引起其修饰，以改变片材模制品在溶剂中的溶解度; 并且在用能量射线照射之后显影片材成型体，用溶剂部分地除去固化组合物，从而在至少一个表面上形成凹凸图案。

8. 发明授权

US07651761B2 Grinding pad and method of producing the same 有权
标题翻译：研磨垫及其制造方法
公开(公告)号：US07651761B2
公开(公告)日：2010-01-26
申请号：US10494249
申请日：2002-10-03
申请人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura , Hiroshi Seyanagi
发明人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura , Hiroshi Seyanagi
IPC分类号： B32B3/26 , B32B3/00
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译：本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光，可平坦化，抛光效率高。本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。提供了可以使平面性改善和划痕减少兼容的抛光垫。

9. 发明申请

US20050064709A1 Grinding pad and method of producing the same 有权
标题翻译：研磨垫及其制造方法
公开(公告)号：US20050064709A1
公开(公告)日：2005-03-24
申请号：US10494249
申请日：2002-10-03
申请人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura , Hiroshi Seyanagi
发明人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura , Hiroshi Seyanagi
IPC分类号： B24B37/24 , B24D3/30 , C08G18/00 , C08G18/10 , C08G18/12 , C08G18/66 , C08G18/72 , H01L21/306 , H01L21/302 , H01L21/461
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译：本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光，可平坦化，抛光效率高。本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。提供了可以使平面性改善和划痕减少兼容的抛光垫。

10. 发明授权

US08318825B2 Polishing pad and method of producing the same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US08318825B2
公开(公告)日：2012-11-27
申请号：US11466878
申请日：2006-08-24
申请人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura
发明人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Takashi Masui , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura
IPC分类号： C08G18/28
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译：本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光，可平坦化，抛光效率高。本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。提供了可以使平面性改善和划痕减少兼容的抛光垫。

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