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    • 1. 发明授权
    • Liquid coating system
    • 液体涂层系统
    • US5374312A
    • 1994-12-20
    • US144492
    • 1993-11-01
    • Keizo HasebeKiyohisa TateyamaYuji YoshimotoYuji MatsuyamaTetsuro NakaharaYoshio Kimura
    • Keizo HasebeKiyohisa TateyamaYuji YoshimotoYuji MatsuyamaTetsuro NakaharaYoshio Kimura
    • B05C5/00B05C5/02B05C11/08G03F7/16H01L21/20
    • B05C5/001B05C11/08B05C5/0208B05C5/027G03F7/162Y10S134/902
    • A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir. The liquid coating system further comprises an air operation valve disposed in a communication passage between the inlet of the nozzle and the liquid supply source and used to reduce the pressure of the liquid fed under pressure to the liquid reservoir.
    • 根据本发明的液体涂覆系统包括:液体供应源,具有与液体供应源连通的入口和基本上线性的液体排出部分的喷嘴;压力供给单元,用于在液体供应源 通过压缩气体到喷嘴,用于固定地支撑半导体晶片的旋转卡盘,用于使喷嘴的液体排出部分紧密地面对旋转卡盘上的晶片的上下缸体,以及用于 旋转旋转卡盘。 喷嘴包括从液体供应源供应的液体被收集的液体储存器和与液体储存器连通的大量小通道。 液体涂布系统还包括设置在喷嘴入口和液体供应源之间的连通通道中的空气操作阀,用于将在压力下供给的液体的压力降低到液体储存器。
    • 3. 发明授权
    • Resist processing apparatus
    • 抗蚀剂加工设备
    • US6033475A
    • 2000-03-07
    • US579845
    • 1995-12-26
    • Keizo HasebeHiroyuki IinoNorio SembaYoshio Kimura
    • Keizo HasebeHiroyuki IinoNorio SembaYoshio Kimura
    • B01D19/00G03F7/16
    • B01D19/0031G03F7/162
    • The present invention has a resist processing apparatus for supplying a processing solution onto an object to be processed to perform a resist process, including a processing solution supply nozzle for supplying the processing solution onto the object to be processed, a processing solution feeding arrangement for feeding the processing solution to the processing solution supply nozzle, a processing solution flow path arranged to extend between the processing solution feeding arrangement and the processing solution supply nozzle, and a processing solution deaeration mechanism arranged at an intermediate portion of the processing solution flow path to deaerate the processing solution. The processing solution deaeration mechanism includes a closed vessel, an inlet port for introducing the processing solution into the closed vessel, a member arranged in the closed vessel and having a gas-liquid separation function, and an evacuating arrangement for evacuating the interior of the closed vessel to deaerate the processing solution through the member having the gas-liquid separation function. Gaseous components are separated from the processing solution, and an outlet port feeds the processing solution, from which gaseous components are separated by the member having the gas-liquid separation function, to the processing solution supply nozzle.
    • 本发明的抗蚀剂处理装置具有将处理液供给到被处理物上进行抗蚀剂处理的工序,该处理液包括:处理液供给喷嘴,用于将处理液供给到被处理物上;处理液供给装置, 处理溶液供应喷嘴的处理溶液,布置成在处理溶液供给装置和处理溶液供应喷嘴之间延伸的处理溶液流路,以及布置在处理溶液流动路径的中间部分处理溶液脱气机构以脱气 处理方案。 处理液脱气机构包括:封闭容器,用于将处理液引入密闭容器的入口端口,配置在密闭容器中的具有气液分离功能的构件,以及用于抽出封闭容器内部的抽空装置 容器通过具有气液分离功能的构件使加工溶液脱气。 气态组分与处理溶液分离,并且出口将进料气体组分由具有气液分离功能的构件分离的处理溶液供给到处理溶液供应喷嘴。
    • 4. 发明授权
    • Liquid supplying device
    • 液体供应装置
    • US6015066A
    • 2000-01-18
    • US991783
    • 1997-12-16
    • Yoshio KimuraSatoshi MoritaYuji MatsuyamaNorio Semba
    • Yoshio KimuraSatoshi MoritaYuji MatsuyamaNorio Semba
    • G03F7/30B67D5/08
    • G03F7/30Y10T137/3124
    • Disclosed herein is a device for supplying a liquid to a plurality of apparatuses which apply the liquid to substrates to process the substrates. The device comprises a tank containing the liquid, a supply passage for supplying the liquid from the tank to the apparatuses, branch passages connected to the supply passage, for supplying the liquid to liquid-applying members provided in the apparatuses, and valves provided on the branch passages, respectively. The valves are controlled each other, for opening and closing the branch passages such that the liquid-applying member of one apparatus applies the liquid to a substrate while the liquid-applying member of any other apparatus remains to apply the liquid to a substrate.
    • 这里公开了一种用于将液体供应到将液体施加到基板以处理基板的多个装置的装置。 该装置包括容纳液体的容器,用于将液体从罐供给到设备的供给通道,连接到供给通道的分支通道,用于将液体供应到设置在设备中的液体施加部件, 分支通道。 阀被彼此控制,用于打开和关闭分支通道,使得一个设备的液体施加构件将液体施加到基底,同时任何其他设备的液体施加构件保持将液体施加到基底。
    • 8. 发明授权
    • Coating and developing apparatus
    • 涂装显影装置
    • US07793609B2
    • 2010-09-14
    • US11342616
    • 2006-01-31
    • Masami AkimotoShinichi HayashiYasushi HayashidaNobuaki MatsuokaYoshio KimuraIssei UedaHikaru Ito
    • Masami AkimotoShinichi HayashiYasushi HayashidaNobuaki MatsuokaYoshio KimuraIssei UedaHikaru Ito
    • B05C5/02
    • H01L21/67184H01L21/67173H01L21/67178H01L21/67207H01L21/67745
    • Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks. Unit blocks for application which a wafer goes through are determined depending on the layering positional relationship between an antireflective film and a resist film. An exposed wafer goes only through the unit block for development without going through any one of the unit blocks for application.
    • 提供一种由多个单元块组成的涂层显影装置。 第一单位块堆叠和第二单位块堆叠被布置在相对于前后方向的不同位置。 用于显影的单元块,每个包括多个处理单元,包括执行曝光之后的显影处理的显影单元和在处理单元之间传送基板的转印装置布置在最下层。 用于应用或涂布的单元块包括多个处理单元,其包括在曝光之前进行施加处理的涂布单元和在处理单元之间传送基板的转印装置,布置在用于显影的单位块上方。 用于应用的单元块被布置在第一和第二单元块堆叠中。 根据防反射膜和抗蚀剂膜之间的层叠位置关系确定晶片通过的应用单元块。 暴露的晶片仅通过单元块进行开发,而不经过用于应用的单元块中的任何一个。