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    • 5. 发明申请
    • PLANAR LIQUID FILM FORMING METHOD AND PLANAR LIQUID FILM FORMING APPARATUS
    • US20230095269A1
    • 2023-03-30
    • US17910098
    • 2021-03-01
    • MUSASHI ENGINEERING, INC.
    • Kazumasa IKUSHIMA
    • B05C5/02B05D1/26B05C11/10
    • Problem: To provide a technology for forming a planar liquid film having less surface unevenness than ever before using a jet-type discharge device.
      Solution: Provided is a planar liquid film forming method of forming a planar liquid film on an application target using a jet-type discharge device having a plurality of discharge ports, and an apparatus for implementing the method. In the method, the plurality of discharge ports are arranged on a straight nozzle arrangement line 140, and are arranged with such a distance from one another that globs of a liquid material having landed on the application target can join together to form a linear liquid film. The method includes: a unitary linear liquid film forming step of forming a unitary linear liquid film 404 by discharging the liquid material such that a plurality of liquid globs simultaneously discharged from the plurality of discharge ports have no contact with one another before landing on the application target, and by letting globs of the liquid material having landed join together on the application target; and a specific planar liquid film forming step of forming a specific planar liquid film 405 from a plurality of unitary linear liquid films 404 by successively executing the unitary linear liquid film forming steps while moving the jet-type discharge device and the application target relative to each other in a direction perpendicular to the nozzle arrangement line 140 so that the plurality of unitary linear liquid films 404 join together.