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1. 发明授权

US5658615A Method of forming coating film and apparatus therefor 失效
标题翻译：成膜方法及其设备
公开(公告)号：US5658615A
公开(公告)日：1997-08-19
申请号：US217636
申请日：1994-03-25
申请人： Keizo Hasebe , Akihiro Fujimoto , Hiroichi Inada , Hiroyuki Iino , Shinzi Kitamura , Masatoshi Deguchi , Mitsuhiro Nambu
发明人： Keizo Hasebe , Akihiro Fujimoto , Hiroichi Inada , Hiroyuki Iino , Shinzi Kitamura , Masatoshi Deguchi , Mitsuhiro Nambu
IPC分类号： B05C11/08 , G03F7/16 , B05D3/12
CPC分类号： B05C11/08 , G03F7/162
摘要： An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.
摘要翻译：一种用于形成涂膜的装置，包括：旋转卡盘，用于将一个表面朝上并使基板围绕垂直轴旋转的基板支撑;第一喷嘴，用于在基板上供应涂布溶剂的溶剂;第二喷嘴，将涂布溶液供应到基材的中心部分。第一和第二喷嘴由头部支撑，使得支撑的喷嘴在基板上方的下落位置和偏离基板的等待位置之间移动。通过旋转旋转卡盘，溶剂和涂布溶液沿着基板的表面扩散。

2. 发明授权

US06503003B2 Film forming method and film forming apparatus 失效
标题翻译：成膜方法和成膜装置
公开(公告)号：US06503003B2
公开(公告)日：2003-01-07
申请号：US09816233
申请日：2001-03-26
申请人： Keizo Hasebe , Shuuichi Nishikido , Nobuo Konishi , Takayuki Toshima , Kazutoshi Yoshioka
发明人： Keizo Hasebe , Shuuichi Nishikido , Nobuo Konishi , Takayuki Toshima , Kazutoshi Yoshioka
IPC分类号： G03D504
CPC分类号： G03F7/162 , B05C11/08
摘要： A solvent of a resist solution is dropped from a solvent supply nozzle onto the surface of a semiconductor wafer held by a spin chuck. The semiconductor wafer is rotated by the spin chuck to spread the resist solution over the entire surface of the semiconductor wafer W. Simultaneously, the resist solution is dropped from a resist solution supply nozzle onto the semiconductor wafer and spread following the solvent. During the processing, the processing space is isolated from the outer atmosphere by closing a lid of a processing vessel and a sprayed solvent is supplied into the processing space. The processing space is thus filled with the mist of solvent. In the processing space supplied with the solvent, evaporation of the solvent from the resist solution is suppressed. A film of the resist solution is formed with a uniform film thickness to the edge of the semiconductor wafer W.
摘要翻译：将抗蚀剂溶液的溶剂从溶剂供应喷嘴滴落到由旋转卡盘保持的半导体晶片的表面上。半导体晶片通过旋转卡盘旋转，以将抗蚀剂溶液扩散到半导体晶片W的整个表面上。同时，将抗蚀剂溶液从抗蚀剂溶液供应喷嘴滴落到半导体晶片上并在溶剂之后扩散。在处理过程中，通过关闭处理容器的盖子将处理空间与外部空气隔离，将喷射的溶剂供入处理空间。因此，处理空间被溶剂雾填满。在提供有溶剂的处理空间中，可以抑制溶剂从抗蚀剂溶液中的蒸发。在半导体晶片W的边缘上形成具有均匀膜厚的抗蚀剂溶液膜。

3. 发明授权

US6033475A Resist processing apparatus 失效
标题翻译：抗蚀剂加工设备
公开(公告)号：US6033475A
公开(公告)日：2000-03-07
申请号：US579845
申请日：1995-12-26
申请人： Keizo Hasebe , Hiroyuki Iino , Norio Semba , Yoshio Kimura
发明人： Keizo Hasebe , Hiroyuki Iino , Norio Semba , Yoshio Kimura
IPC分类号： B01D19/00 , G03F7/16
CPC分类号： B01D19/0031 , G03F7/162
摘要： The present invention has a resist processing apparatus for supplying a processing solution onto an object to be processed to perform a resist process, including a processing solution supply nozzle for supplying the processing solution onto the object to be processed, a processing solution feeding arrangement for feeding the processing solution to the processing solution supply nozzle, a processing solution flow path arranged to extend between the processing solution feeding arrangement and the processing solution supply nozzle, and a processing solution deaeration mechanism arranged at an intermediate portion of the processing solution flow path to deaerate the processing solution. The processing solution deaeration mechanism includes a closed vessel, an inlet port for introducing the processing solution into the closed vessel, a member arranged in the closed vessel and having a gas-liquid separation function, and an evacuating arrangement for evacuating the interior of the closed vessel to deaerate the processing solution through the member having the gas-liquid separation function. Gaseous components are separated from the processing solution, and an outlet port feeds the processing solution, from which gaseous components are separated by the member having the gas-liquid separation function, to the processing solution supply nozzle.
摘要翻译：本发明的抗蚀剂处理装置具有将处理液供给到被处理物上进行抗蚀剂处理的工序，该处理液包括：处理液供给喷嘴，用于将处理液供给到被处理物上;处理液供给装置，处理溶液供应喷嘴的处理溶液，布置成在处理溶液供给装置和处理溶液供应喷嘴之间延伸的处理溶液流路，以及布置在处理溶液流动路径的中间部分处理溶液脱气机构以脱气处理方案。处理液脱气机构包括：封闭容器，用于将处理液引入密闭容器的入口端口，配置在密闭容器中的具有气液分离功能的构件，以及用于抽出封闭容器内部的抽空装置容器通过具有气液分离功能的构件使加工溶液脱气。气态组分与处理溶液分离，并且出口将进料气体组分由具有气液分离功能的构件分离的处理溶液供给到处理溶液供应喷嘴。

4. 发明授权

US5866307A Resist processing method and resist processing system 失效
标题翻译：抗蚀剂加工方法和抗蚀剂加工系统
公开(公告)号：US5866307A
公开(公告)日：1999-02-02
申请号：US927418
申请日：1997-09-11
申请人： Yukio Kiba , Norio Semba , Keizo Hasebe
发明人： Yukio Kiba , Norio Semba , Keizo Hasebe
IPC分类号： B05D1/00 , B05D3/00 , G03F7/16 , G03F7/30 , G03C5/29
CPC分类号： G03F7/3021 , B05D1/005 , B05D3/002 , G03F7/16
摘要： A resist processing method for introducing a pressurized gas into a vessel storing a solution, sending the solution from the vessel to a nozzle by way of a supply line by means of the pressurized gas, and supplying the solution from the nozzle to a substrate.
摘要翻译：一种抗蚀剂加工方法，用于将加压气体引入到储存溶液的容器中，通过加压气体将溶液从供应管路从容器送到喷嘴，并将溶液从喷嘴供给到基底。

5. 发明授权

US5374312A Liquid coating system 失效
标题翻译：液体涂层系统
公开(公告)号：US5374312A
公开(公告)日：1994-12-20
申请号：US144492
申请日：1993-11-01
申请人： Keizo Hasebe , Kiyohisa Tateyama , Yuji Yoshimoto , Yuji Matsuyama , Tetsuro Nakahara , Yoshio Kimura
发明人： Keizo Hasebe , Kiyohisa Tateyama , Yuji Yoshimoto , Yuji Matsuyama , Tetsuro Nakahara , Yoshio Kimura
IPC分类号： B05C5/00 , B05C5/02 , B05C11/08 , G03F7/16 , H01L21/20
CPC分类号： B05C5/001 , B05C11/08 , B05C5/0208 , B05C5/027 , G03F7/162 , Y10S134/902
摘要： A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir. The liquid coating system further comprises an air operation valve disposed in a communication passage between the inlet of the nozzle and the liquid supply source and used to reduce the pressure of the liquid fed under pressure to the liquid reservoir.
摘要翻译：根据本发明的液体涂覆系统包括：液体供应源，具有与液体供应源连通的入口和基本上线性的液体排出部分的喷嘴;压力供给单元，用于在液体供应源通过压缩气体到喷嘴，用于固定地支撑半导体晶片的旋转卡盘，用于使喷嘴的液体排出部分紧密地面对旋转卡盘上的晶片的上下缸体，以及用于旋转旋转卡盘。喷嘴包括从液体供应源供应的液体被收集的液体储存器和与液体储存器连通的大量小通道。液体涂布系统还包括设置在喷嘴入口和液体供应源之间的连通通道中的空气操作阀，用于将在压力下供给的液体的压力降低到液体储存器。

6. 发明授权

US5252137A System and method for applying a liquid 失效
标题翻译：用于施加液体的系统和方法
公开(公告)号：US5252137A
公开(公告)日：1993-10-12
申请号：US758128
申请日：1991-09-12
申请人： Kiyohisa Tateyama , Keizo Hasebe
发明人： Kiyohisa Tateyama , Keizo Hasebe
IPC分类号： G03F7/30 , B05C5/00 , H01L21/00 , H01L21/027 , H01L21/30 , B08B3/00
CPC分类号： H01L21/67173 , B05C5/005 , H01L21/6715
摘要： A liquid applying system according to the present invention comprises a liquid supply source and a nozzle communicating with the liquid supply source. The nozzle comprises a liquid storing portion for storing a liquid supplied from the liquid supply source, a number of small passages communicating with the liquid storing portion, each of the small passages having a transverse section which is smaller than that of the liquid storing portion, and a slit-like passage communicating with the small passages, in which liquids from the small passages flow together and from which the liquids are continuously discharged like a curtain toward a semiconductor wafer.
摘要翻译：根据本发明的液体施加系统包括液体供应源和与液体供应源连通的喷嘴。喷嘴包括用于储存从液体供应源供应的液体的液体存储部分，与液体存储部分连通的多个小通道，每个小通道具有小于液体存储部分的横截面，以及与小通道连通的狭缝状通道，其中来自小通道的液体流动在一起，并且液体从窗口连续排出到半导体晶片。

7. 发明授权

US06217657B1 Resist processing system having process solution deaeration mechanism 有权
标题翻译：具有工艺溶液脱气机构的抗蚀加工系统
公开(公告)号：US06217657B1
公开(公告)日：2001-04-17
申请号：US09175963
申请日：1998-10-21
申请人： Yukio Kiba , Norio Semba , Keizo Hasebe
发明人： Yukio Kiba , Norio Semba , Keizo Hasebe
IPC分类号： B05C502
CPC分类号： G03F7/3021 , B05D1/005 , B05D3/002 , G03F7/16
摘要： A resist processing system includes a sensor connected for detecting the surface level of the processing solution contained in an intermediate tank, and a controller connected for controlling the fluid pressure on the basis of the surface level detected by the sensor.
摘要翻译：抗蚀剂处理系统包括连接用于检测包含在中间罐中的处理溶液的表面水平的传感器和连接用于基于由传感器检测到的表面水平来控制流体压力的控制器。

8. 发明授权

US5942035A Solvent and resist spin coating apparatus 失效
标题翻译：溶剂和抗旋涂装置
公开(公告)号：US5942035A
公开(公告)日：1999-08-24
申请号：US686910
申请日：1996-07-26
申请人： Keizo Hasebe , Akihiro Fujimoto , Hiroichi Inada , Hiroyuki Iino , Shinzi Kitamura , Masatoshi Deguchi , Mitsuhiro Nambu
发明人： Keizo Hasebe , Akihiro Fujimoto , Hiroichi Inada , Hiroyuki Iino , Shinzi Kitamura , Masatoshi Deguchi , Mitsuhiro Nambu
IPC分类号： B05C11/08 , G03F7/16 , B05C5/00
CPC分类号： B05C11/08 , G03F7/162
摘要： An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.
摘要翻译：一种用于形成涂膜的装置，包括：旋转卡盘，用于将一个表面朝上并使基板围绕垂直轴旋转的基板支撑;第一喷嘴，用于在基板上供应涂布溶剂的溶剂;第二喷嘴，将涂布溶液供应到基材的中心部分。第一和第二喷嘴由头部支撑，使得支撑的喷嘴在基板上方的下落位置和偏离基板的等待位置之间移动。通过旋转旋转卡盘，溶剂和涂布溶液沿着基板的表面扩散。

9. 发明授权

US06228561B1 Film forming method and film forming apparatus 失效
标题翻译：成膜方法和成膜装置
公开(公告)号：US06228561B1
公开(公告)日：2001-05-08
申请号：US08791618
申请日：1997-01-31
申请人： Keizo Hasebe , Shuuichi Nishikido , Nobuo Konishi , Takayuki Toshima , Kazutoshi Yoshioka
发明人： Keizo Hasebe , Shuuichi Nishikido , Nobuo Konishi , Takayuki Toshima , Kazutoshi Yoshioka
IPC分类号： G03F716
CPC分类号： G03F7/162 , B05C11/08
摘要： A solvent of a resist solution is dropped from a solvent supply nozzle onto the surface of a semiconductor wafer held by a spin chuck. The semiconductor wafer is rotated by the spin chuck to spread the resist solution over the entire surface of the semiconductor wafer W. Simultaneously, the resist solution is dropped from a resist solution supply nozzle onto the semiconductor wafer and spread following the solvent. During the processing, the processing space is isolated from the outer atmosphere by closing a lid of a processing vessel and a sprayed solvent is supplied into the processing space. The processing space is thus filled with the mist of solvent. In the processing space supplied with the solvent, evaporation of the solvent from the resist solution is suppressed. A film of the resist solution is formed with a uniform film thickness to the edge of the semiconductor wafer W.
摘要翻译：将抗蚀剂溶液的溶剂从溶剂供应喷嘴滴落到由旋转卡盘保持的半导体晶片的表面上。半导体晶片通过旋转卡盘旋转，以将抗蚀剂溶液扩散到半导体晶片W的整个表面上。同时，将抗蚀剂溶液从抗蚀剂溶液供应喷嘴滴落到半导体晶片上并在溶剂之后扩散。在处理过程中，通过关闭处理容器的盖子将处理空间与外部空气隔离，将喷射的溶剂供入处理空间。因此，处理空间被溶剂雾填满。在提供有溶剂的处理空间中，可以抑制溶剂从抗蚀剂溶液中的蒸发。在半导体晶片W的边缘上形成具有均匀膜厚的抗蚀剂溶液膜。

10. 发明授权

US5826129A Substrate processing system 失效
标题翻译：基板加工系统
公开(公告)号：US5826129A
公开(公告)日：1998-10-20
申请号：US496319
申请日：1995-06-29
申请人： Keizo Hasebe , Shinji Nagashima , Norio Semba , Masami Akimoto , Yoshio Kimura , Naruaki Iida , Kouji Harada , Issei Ueda , Nobuo Konishi
发明人： Keizo Hasebe , Shinji Nagashima , Norio Semba , Masami Akimoto , Yoshio Kimura , Naruaki Iida , Kouji Harada , Issei Ueda , Nobuo Konishi
IPC分类号： H01L21/00 , G03D5/00
CPC分类号： H01L21/67173 , H01L21/67178 , H01L21/67184
摘要： This invention provides a substrate processing system including a cassette station on which at least one cassette containing a plurality of objects is placed, a process station including a plurality of process chambers for performing processing for the objects, and an object conveying unit for loading the objects into the process chambers and unloading the objects from the process chambers, a first object transfer unit for transferring the objects between the cassette station and the process station, and an interface section including an object waiting region where the objects wait, and a second object transfer unit for transferring the objects to the process station, wherein the process chambers in the process station are arranged around the object conveying unit, and the object conveying unit has a rotating shaft almost parallel to the vertical direction and can move up and down in the vertical direction along the rotating shaft and rotate about the rotating shaft.
摘要翻译：本发明提供了一种基板处理系统，其包括：盒站，其上放置有至少一个包含多个物体的盒;处理站，包括用于对物体进行处理的多个处理室;以及物体传送单元，用于装载物体进入处理室并从处理室卸载物体，第一物体传送单元，用于在物体站和处理站之间传送物体，以及接口部分，其包括物体等待的对象等待区域，以及第二物体传送用于将物体传送到处理站的单元，其中处理站中的处理室围绕物体传送单元布置，物体传送单元具有几乎平行于垂直方向的旋转轴，并且可以在竖直方向上上下移动沿着旋转轴的方向旋转并围绕旋转轴旋转。

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