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1. 发明授权

US06245649B1 Method for forming a retrograde impurity profile 有权
标题翻译：形成逆行杂质分布的方法
公开(公告)号：US06245649B1
公开(公告)日：2001-06-12
申请号：US09251923
申请日：1999-02-17
申请人： James F. Buller , Jon D. Cheek , Daniel Kadosh , Derick J. Wristers , H. Jim Fulford
发明人： James F. Buller , Jon D. Cheek , Daniel Kadosh , Derick J. Wristers , H. Jim Fulford
IPC分类号： H01L2104
CPC分类号： H01L29/105 , H01L21/2652
摘要： A method for forming a retrograde impurity profile in a semiconducting substrate is provided. The method comprises forming a sacrificial layer having a thickness in the range of about 10 Å to about 150 Å on the surface of a semiconducting substrate. Thereafter, an ion implantation process is performed wherein dopant impurity ions are directed through the sacrificial layer and into the semiconducting substrate under conditions effective to form a retrograde impurity profile in the semiconducting substrate.
摘要翻译：提供了一种在半导体衬底中形成逆向杂质分布的方法。该方法包括在半导体衬底的表面上形成具有在大约至大约的范围内的厚度的牺牲层。此后，进行离子注入工艺，其中掺杂杂质离子在有效地在半导体衬底中形成逆向杂质分布的条件下引导通过牺牲层并进入半导体衬底。

2. 发明授权

US5904534A Transistor formation with local interconnect overetch immunity 有权
标题翻译：晶体管形成与局部互连overetch免疫
公开(公告)号：US5904534A
公开(公告)日：1999-05-18
申请号：US134702
申请日：1998-08-14
申请人： Jon D. Cheek , Derick J. Wristers , H. Jim Fulford
发明人： Jon D. Cheek , Derick J. Wristers , H. Jim Fulford
IPC分类号： H01L21/762 , H01L21/768 , H01L21/336 , H01L21/76
CPC分类号： H01L21/76895 , H01L21/76224
摘要： An integrated circuit transistor and a method for making the same are provided. The transistor is resistant to junction shorts due to the overetch of local interconnect trenches. The transistor includes a source/drain region with a first junction and a second junction that is located deeper than the first junction in the portion of the active area susceptible to the overetch junction short phenomena. The second junction is established by ion implantation through a mask that is patterned to create an opening corresponding to the intersection of the layouts of the active area and the local interconnect trench. Using this method, the second junction is only established where needed to prevent shorting and does not impede transistor performance.
摘要翻译：提供一种集成电路晶体管及其制造方法。晶体管由于局部互连沟槽的过蚀刻而抵抗结短路。该晶体管包括具有第一结的源极/漏极区域和位于有源区域的易于经过过渡接合短路现象的部分中比第一结点更深的第二结点。第二结通过通过掩模的离子注入建立，其被图案化以产生对应于有源区和局部互连沟槽的布局的相交的开口。使用该方法，仅在需要防止短路并且不妨碍晶体管性能的情况下才建立第二结。

3. 发明授权

US06018180A Transistor formation with LI overetch immunity 失效
标题翻译：晶体管形成与LI过滤免疫
公开(公告)号：US06018180A
公开(公告)日：2000-01-25
申请号：US996648
申请日：1997-12-23
申请人： Jon D. Cheek , Derick J. Wristers , H. Jim Fulford
发明人： Jon D. Cheek , Derick J. Wristers , H. Jim Fulford
IPC分类号： H01L21/762 , H01L21/768 , H01L29/76
CPC分类号： H01L21/76895 , H01L21/76224
摘要： An integrated circuit transistor and a method for making the same are provided. The transistor is resistant to junction shorts due to the overetch of local interconnect trenches. The transistor includes a source/drain region with a first junction and a second junction that is located deeper than the first junction in the portion of the active area susceptible to the overetch junction short phenomena. The second junction is established by ion implantation through a mask that is patterned to create an opening corresponding to the intersection of the layouts of the active area and the local interconnect trench. Using this method, the second junction is only established where needed to prevent shorting and does not impede transistor performance.
摘要翻译：提供一种集成电路晶体管及其制造方法。晶体管由于局部互连沟槽的过蚀刻而抵抗结短路。该晶体管包括具有第一结的源极/漏极区域和位于有源区域的易于经过过渡接合短路现象的部分中比第一结点更深的第二结点。第二结通过通过掩模的离子注入建立，其被图案化以产生对应于有源区和局部互连沟槽的布局的交点的开口。使用该方法，仅在需要防止短路并且不妨碍晶体管性能的情况下才建立第二结。

4. 发明授权

US06180475B2 Transistor formation with local interconnect overetch immunity 有权
标题翻译：晶体管形成与局部互连overetch免疫
公开(公告)号：US06180475B2
公开(公告)日：2001-01-30
申请号：US09134702
申请日：1998-08-14
申请人： Jon D. Cheek , Derick J. Wristers , H. Jim Fulford
发明人： Jon D. Cheek , Derick J. Wristers , H. Jim Fulford
IPC分类号： H01L21336
CPC分类号： H01L21/76895 , H01L21/76224
摘要： An integrated circuit transistor and a method for making the same are provided. The transistor is resistant to junction shorts due to the overetch of local interconnect trenches. The transistor includes a source/drain region with a first junction and a second junction that is located deeper than the first junction in the portion of the active area susceptible to the overetch junction short phenomena. The second junction is established by ion implantation through a mask that is patterned to create an opening corresponding to the intersection of the layouts of the active area and the local interconnect trench. Using this method, the second junction is only established where needed to prevent shorting and does not impede transistor performance.
摘要翻译：提供一种集成电路晶体管及其制造方法。晶体管由于局部互连沟槽的过蚀刻而抵抗结短路。该晶体管包括具有第一结的源极/漏极区域和位于有源区域的易于经过过渡接合短路现象的部分中比第一结点更深的第二结点。第二结通过通过掩模的离子注入建立，其被图案化以产生对应于有源区和局部互连沟槽的布局的相交的开口。使用该方法，仅在需要防止短路并且不妨碍晶体管性能的情况下才建立第二结。

5. 发明授权

US06979878B1 Isolation structure having implanted silicon atoms at the top corner of the isolation trench filling vacancies and interstitial sites 失效
标题翻译：隔离结构在隔离槽的顶角处注入硅原子填充空位和间隙位置
公开(公告)号：US06979878B1
公开(公告)日：2005-12-27
申请号：US09217213
申请日：1998-12-21
申请人： Mark I. Gardner , H. Jim Fulford , Derick J. Wristers
发明人： Mark I. Gardner , H. Jim Fulford , Derick J. Wristers
IPC分类号： H01L21/762 , H01L29/36
CPC分类号： H01L21/76237
摘要： A method for isolating a first active region from a second active region, both of which are configured within a semiconductor substrate. The method comprises forming a dielectric masking layer above a semiconductor substrate. An opening is then formed through the masking layer. A pair of dielectric spacers are formed upon the sidewalls of the masking layer within the opening. A trench is then etched in the semiconductor substrate between the dielectric spacers. A first dielectric layer is then thermally grown on the walls and base of the trench. A CVD oxide is deposited into the trench and processed such that the upper surface of the CVD oxide is commensurate with the substrate surface. Portions of the spacers are also removed such that the thickness of the spacers is between about 0 to 200 Å. Silicon atoms and/or barrier atoms, such as nitrogen atoms, are then implanted ino regions of the active areas in close proximity to the trench isolation structure.
摘要翻译：一种用于将第一有源区与第二有源区隔离的方法，二者均配置在半导体衬底内。该方法包括在半导体衬底上形成电介质掩模层。然后通过掩模层形成开口。在开口内的掩模层的侧壁上形成一对电介质隔离物。然后在电介质间隔物之间的半导体衬底中蚀刻沟槽。然后在沟槽的壁和基底上热生长第一介电层。将CVD氧化物沉积到沟槽中并进行处理，使得CVD氧化物的上表面与衬底表面相当。间隔物的一部分也被去除，使得间隔物的厚度在约0至200埃之间。然后将硅原子和/或势垒原子（例如氮原子）注入非常靠近沟槽隔离结构的有源区的多个区域中。

6. 发明授权

US06300205B1 Method of making a semiconductor device with self-aligned active, lightly-doped drain, and halo regions 有权
标题翻译：制造具有自对准有源，轻掺杂漏极和卤区的半导体器件的方法
公开(公告)号：US06300205B1
公开(公告)日：2001-10-09
申请号：US09193262
申请日：1998-11-18
申请人： H. Jim Fulford , Jon Cheek , Derick J. Wristers , James Buller
发明人： H. Jim Fulford , Jon Cheek , Derick J. Wristers , James Buller
IPC分类号： H01L21336
CPC分类号： H01L29/6653 , H01L21/26586 , H01L29/1083 , H01L29/6656 , H01L29/6659 , H01L29/7833
摘要： One method of making a semiconductor device includes forming a gate electrode on a substrate and forming a spacer on a sidewall of the gate electrode. An active region is then formed in the substrate and adjacent to the spacer, but spaced apart from the gate electrode, using a first dopant material. A halo region is formed in the substrate under the spacer and adjacent to the active region using a second dopant material of a conductivity type different than the first dopant material. The halo region may be formed by implanting the second dopant region into the substrate at an angle substantially less than 90° relative to a surface of the substrate. A portion of the spacer is then removed and a lightly-doped region is formed in the substrate adjacent to the active region and the gate electrode and shallower than the halo region using a third dopant material of a same conductivity type as the first dopant material.
摘要翻译：制造半导体器件的一种方法包括在衬底上形成栅电极并在栅电极的侧壁上形成间隔物。然后，使用第一掺杂剂材料，在衬底中形成有源区并与间隔物相邻，但与栅电极间隔开。使用不同于第一掺杂剂材料的导电类型的第二掺杂剂材料，在间隔物下方的衬底中形成晕圈区域并与有源区相邻。可以通过相对于衬底的表面以相对小于90°的角度将第二掺杂剂区域注入到衬底中来形成晕圈区域。然后去除间隔物的一部分，并且使用与第一掺杂剂材料相同的导电类型的第三掺杂剂材料，在邻近有源区和栅电极的衬底中形成轻掺杂区域，并且比晕区浅。

7. 发明授权

US06258646B1 CMOS integrated circuit and method for implanting NMOS transistor areas prior to implanting PMOS transistor areas to optimize the thermal diffusivity thereof 有权
标题翻译： CMOS集成电路和用于在注入PMOS晶体管区域之前注入NMOS晶体管区域以优化其热扩散率的方法
公开(公告)号：US06258646B1
公开(公告)日：2001-07-10
申请号：US09149631
申请日：1998-09-08
申请人： H. Jim Fulford, Jr. , Mark I. Gardner , Derick J. Wristers
发明人： H. Jim Fulford, Jr. , Mark I. Gardner , Derick J. Wristers
IPC分类号： H01L218238
CPC分类号： H01L27/092 , H01L21/823814 , Y10S257/90
摘要： A transistor and a transistor fabrication method for forming an LDD structure in which the n-type dopants associated with an n-channel transistor are formed prior to the formation of the p-type dopants is presented. The n-type source/drain and LDD implants generally require higher activation energy (thermal anneal) than the p-type source/drain and LDD implants. The n-type arsenic source/drain implant, which has the lowest diffusivity and requires the highest temperature anneal, is performed first in the LDD process formation. Performing such a high temperature anneal first ensures minimum additional migration of subsequent, more mobile implants. Mobile implants associated with lighter and less dense implant species are prevalent in LDD areas near the channel perimeter. The likelihood of those implants moving into the channel is lessened by tailoring subsequent anneal steps to temperatures less than the source/drain anneal step.
摘要翻译：提出一种用于形成LDD结构的晶体管和晶体管制造方法，其中在形成p型掺杂剂之前形成与n沟道晶体管相关联的n型掺杂剂。 n型源极/漏极和LDD植入物通常需要比p型源极/漏极和LDD植入物更高的活化能（热退火）。首先在LDD工艺形成中执行具有最低扩散率并且需要最高温度退火的n型砷源/漏极注入。首先进行这样的高温退火可确保随后的更多移动式植入物的最小额外迁移。与更轻和较不密集的种植体物种相关的移植植入物在通道周边附近的LDD区域是普遍的。通过将后续退火步骤调整到低于源极/漏极退火步骤的温度，使得这些植入物进入通道的可能性降低。

8. 发明授权

US06188114B1 Method of forming an insulated-gate field-effect transistor with metal spacers 有权
标题翻译：用金属间隔物形成绝缘栅场效应晶体管的方法
公开(公告)号：US06188114B1
公开(公告)日：2001-02-13
申请号：US09204016
申请日：1998-12-01
申请人： Mark I. Gardner , Robert Dawson , H. Jim Fulford, Jr. , Frederick N. Hause , Mark W. Michael , Bradley T. Moore , Derick J. Wristers
发明人： Mark I. Gardner , Robert Dawson , H. Jim Fulford, Jr. , Frederick N. Hause , Mark W. Michael , Bradley T. Moore , Derick J. Wristers
IPC分类号： H01L31119
CPC分类号： H01L29/41783 , H01L29/41775 , H01L29/66575 , H01L29/6659
摘要： An IGFET with metal spacers is disclosed. The IGFET includes a gate electrode on a gate insulator on a semiconductor substrate. Sidewall insulators are adjacent to opposing vertical edges of the gate electrode, and metal spacers are formed on the substrate and adjacent to the sidewall insulators. The metal spacers are electrically isolated from the gate electrode but contact portions of the drain and the source. Preferably, the metal spacers are adjacent to edges of the gate insulator beneath the sidewall insulators. The metal spacers are formed by depositing a metal layer over the substrate then applying an anisotropic etch. In one embodiment, the metal spacers contact lightly and heavily doped drain and source regions, thereby increasing the conductivity between the heavily doped drain and source regions and the channel underlying the gate electrode. The metal spacers can also provide low resistance drain and source contacts.
摘要翻译：公开了具有金属间隔物的IGFET。 IGFET在半导体衬底上的栅极绝缘体上包括栅电极。侧壁绝缘体与栅电极的相对的垂直边缘相邻，并且金属间隔件形成在衬底上并且与侧壁绝缘体相邻。金属间隔物与栅电极电绝缘，但是漏极和源极的接触部分。优选地，金属间隔件邻近侧壁绝缘体之下的栅极绝缘体的边缘。通过在衬底上沉积金属层然后施加各向异性蚀刻来形成金属间隔物。在一个实施例中，金属间隔物接触轻掺杂和重掺杂的漏极和源极区域，从而增加重掺杂漏极和源极区域之间的导电性以及栅电极下面的沟道。金属间隔物还可以提供低电阻漏极和源极触点。

9. 发明授权

US6166354A System and apparatus for in situ monitoring and control of annealing in semiconductor fabrication 失效
标题翻译：用于半导体制造中退火的原位监测和控制的系统和装置
公开(公告)号：US6166354A
公开(公告)日：2000-12-26
申请号：US876381
申请日：1997-06-16
申请人： Frederick N. Hause , Robert Dawson , H. Jim Fulford, Jr. , Mark I. Gardner , Mark W. Michael , Bradley T. Moore , Derick J. Wristers
发明人： Frederick N. Hause , Robert Dawson , H. Jim Fulford, Jr. , Mark I. Gardner , Mark W. Michael , Bradley T. Moore , Derick J. Wristers
IPC分类号： C30B31/12 , C30B31/18 , F27B5/14
CPC分类号： C30B31/18 , C30B31/12
摘要： An optical monitoring of electrical characteristics of devices in a semiconductor is performed during an anneal step to detect the time annealing is complete and activation occurs. A surface photovoltage measurement is made during annealing to monitor the charge state on the surface of a substrate wafer to determine when the substrate is fully annealed. The surface photovoltage measurement is monitored, the time of annealing is detected, and a selected over-anneal is controlled. The surface photovoltage (SPV) measurement is performed to determine a point at which a dopant or impurity such as boron or phosphorus is annealed in a silicon lattice. In some embodiments, the point of detection is used as a feedback signal in an RTA annealing system to adjust a bank of annealing lamps for annealing and activation uniformity control. The point of detection is also used to terminate the annealing process to minimize D.sub.t.
摘要翻译：在退火步骤期间执行半导体器件的电特性的光学监测，以检测时间退火完成并发生激活。在退火期间进行表面光电压测量以监测衬底晶片的表面上的电荷状态，以确定衬底何时完全退火。监测表面光电压测量，检测退火时间，并控制所选择的过退火。执行表面光电压（SPV）测量以确定在硅晶格中退火掺杂剂或杂质如硼或磷的点。在一些实施例中，将检测点用作RTA退火系统中的反馈信号，以调整用于退火和激活均匀性控制的退火灯组。检测点也用于终止退火过程以最小化Dt。

10. 发明授权

US6162688A Method of fabricating a transistor with a dielectric underlayer and device incorporating same 有权
标题翻译：制造具有电介质底层的晶体管的方法和结合其的器件
公开(公告)号：US6162688A
公开(公告)日：2000-12-19
申请号：US231427
申请日：1999-01-14
申请人： Mark I. Gardner , H. Jim Fulford , Derick J. Wristers
发明人： Mark I. Gardner , H. Jim Fulford , Derick J. Wristers
IPC分类号： H01L21/266 , H01L21/28 , H01L21/336 , H01L21/8238 , H01L27/06 , H01L29/49 , H01L29/51 , H01L29/786 , H01L21/00
CPC分类号： H01L21/28194 , H01L21/266 , H01L21/268 , H01L21/28158 , H01L21/28202 , H01L21/823842 , H01L27/0688 , H01L29/4908 , H01L29/51 , H01L29/517 , H01L29/518 , H01L29/66537 , H01L29/66545 , H01L29/66757 , H01L29/78636
摘要： A method is provided for fabricating a transistor, the method including forming a dielectric layer above a structure, forming a first polysilicon layer above the dielectric layer and forming a sacrificial region above the first polysilicon layer. The method also includes forming a second polysilicon layer above the first polysilicon layer and adjacent the sacrificial region. The method further includes removing the sacrificial region to form an opening in the second polysilicon layer, the opening having sidewalls, and forming dielectric spacers on the sidewalls of the opening. In addition, the method includes forming a gate dielectric within the opening above the first polysilicon layer and forming a gate conductor above the gate dielectric.
摘要翻译：提供了一种用于制造晶体管的方法，所述方法包括在结构之上形成电介质层，在电介质层上方形成第一多晶硅层，并在第一多晶硅层上方形成牺牲区域。该方法还包括在第一多晶硅层上形成第二多晶硅层并且邻近牺牲区。该方法还包括去除牺牲区域以在第二多晶硅层中形成开口，该开口具有侧壁，并在开口的侧壁上形成电介质间隔物。此外，该方法包括在第一多晶硅层上方的开口内形成栅极电介质，并在栅极电介质上方形成栅极导体。

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