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1. 发明授权

US09462681B2 Conductive film with networked nano-material 有权
标题翻译：具有网状纳米材料的导电膜
公开(公告)号：US09462681B2
公开(公告)日：2016-10-04
申请号：US14196808
申请日：2014-03-04
申请人： LG Electronics Inc.
发明人： Yangwook Hur , Jeyong Moon
IPC分类号： H05K1/02 , H05K1/09 , H05K3/06 , G06F3/044
CPC分类号： H05K1/0274 , G06F3/044 , G06F2203/04103 , G06F2203/04111 , H05K1/095 , H05K3/06 , H05K2201/0108 , H05K2201/0209 , H05K2201/026 , H05K2203/0773
摘要： A conductive film includes a base film, a primer layer formed on the base film, the primer layer having voids, and a conductive layer formed on the primer layer. The conductive layer includes a conductor that contains a nano-material forming a network structure.
摘要翻译：导电膜包括基膜，形成在基膜上的底漆层，具有空隙的底漆层和形成在底漆层上的导电层。导电层包括含有形成网络结构的纳米材料的导体。

2. 发明申请

US20140290992A1 CONDUCTIVE FILM, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME 有权
标题翻译：导电膜，其制造方法和包括其的电子器件
公开(公告)号：US20140290992A1
公开(公告)日：2014-10-02
申请号：US14196808
申请日：2014-03-04
申请人： Yangwook HUR , Jeyong MOON
发明人： Yangwook HUR , Jeyong MOON
IPC分类号： H05K1/03 , H05K1/02 , H05K1/09 , G06F3/044
CPC分类号： H05K1/0274 , G06F3/044 , G06F2203/04103 , G06F2203/04111 , H05K1/095 , H05K3/06 , H05K2201/0108 , H05K2201/0209 , H05K2201/026 , H05K2203/0773
摘要： A conductive film may be provided that includes a base film, a primer layer formed on the base film, the primer layer having voids, and a conductive layer formed on the primer layer. The conductive layer may include a conductor that contains a nano-material forming a network structure.
摘要翻译：可以提供导电膜，其包括基膜，形成在基膜上的底漆层，具有空隙的底漆层和形成在底漆层上的导电层。导电层可以包括含有形成网络结构的纳米材料的导体。

3. 发明授权

US08745863B2 Method of manufacturing multi-layer printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US08745863B2
公开(公告)日：2014-06-10
申请号：US13169674
申请日：2011-06-27
申请人： Motoo Asai , Dongdong Wang , Takahiro Mori
发明人： Motoo Asai , Dongdong Wang , Takahiro Mori
IPC分类号： H01K3/10
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate.
摘要翻译：制造多层印刷电路板的方法包括以下步骤（A）和（B）。（A）提供穿透开口，其形成为通孔，并且每个具有用于芯基板的小直径，以及（B）提供形成为具有用于芯基板的大直径的通孔的穿透开口。

4. 发明申请

US20130288041A1 EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BODY, LAMINATE AND MULTILAYER LALMINATE 审中-公开
标题翻译：环氧树脂组合物，PREPREG，固化体，片状体模体，层合体和多层乳液
公开(公告)号：US20130288041A1
公开(公告)日：2013-10-31
申请号：US13922606
申请日：2013-06-20
申请人： Sekisui Chemical Co., Ltd.
发明人： Nobuhiro GOTO , Masaru HEISHI , Hidenobu DEGUCHI , Takayuki KOBAYASHI , Junnosuke MURAKAMI
IPC分类号： C08J7/14
CPC分类号： C08J7/14 , B32B3/26 , B32B7/12 , B32B15/08 , B32B15/082 , B32B15/20 , B32B27/04 , B32B27/26 , B32B27/28 , B32B27/302 , B32B27/38 , B32B2260/02 , B32B2260/046 , B32B2307/306 , B32B2307/308 , B32B2307/538 , B32B2307/54 , B32B2307/546 , B32B2307/734 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K9/06 , C08L63/00 , H05K1/0373 , H05K3/181 , H05K3/381 , H05K2201/0209 , H05K2201/0239 , H05K2203/0773 , Y10T428/24355 , Y10T428/259
摘要： Provided is an epoxy resin composition capable of reducing the surface roughness of the surface of a roughening-treated cured body.The epoxy resin composition includes an epoxy resin, a curing agent, and a silica component obtained by performing a surface treatment on silica particles using a silane coupling agent; and the epoxy resin composition does not include a curing accelerator, or includes a curing accelerator at a content equal to or less than 3.5 parts by weight to a total of 100 parts by weight of the epoxy resin and the curing agent. Mean particle diameter of the silica particles is equal to or less than 1 μm. An amount B (g) of the silane coupling agent used for surface treatment, per 1 g of the silica particles in the silica component, is within a range between 10% to 80% with regard to a value C (g) per 1 g of the silica particles, which is calculated by the following formula (X). C (g)/1 g of Silica Particles=[Specific Surface Area of Silica Particles (m2/g)/Minimum Area Coated by Silane Coupling Agent (m2/g)] Formula (X)
摘要翻译：提供能够降低经粗化处理的固化体的表面的表面粗糙度的环氧树脂组合物。环氧树脂组合物包括环氧树脂，固化剂和通过使用硅烷偶联剂对二氧化硅颗粒进行表面处理而获得的二氧化硅组分; 环氧树脂组合物不包含固化促进剂，或者包含相对于总共100重量份的环氧树脂和固化剂为3.5重量份以下的固化促进剂。二氧化硅颗粒的平均粒径等于或小于1μm。用于表面处理的硅烷偶联剂的量B（g）与二氧化硅组分中的每1g二氧化硅颗粒相比，相对于每1g的C（g）值在10％至80％的范围内的二氧化硅颗粒，其通过下式（X）计算。 C（g）/ 1g二氧化硅粒子= [二氧化硅粒子的比表面积（m2 / g）/硅烷偶联剂涂布的最小面积（m2 / g）]式（X）

5. 发明申请

US20110253306A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20110253306A1
公开(公告)日：2011-10-20
申请号：US13169736
申请日：2011-06-27
申请人： Motoo Asai , Dongdong Wang , Takahiro Mori
发明人： Motoo Asai , Dongdong Wang , Takahiro Mori
IPC分类号： H05K3/00 , B32B38/04
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes.
摘要翻译：制造印刷电路板的方法包括以下步骤（A）至（D）。（A）在芯部件的两侧各自层叠树脂绝缘层，形成芯基板，（B）通过施加激光而在芯基板上形成贯通孔，（C）在芯基板上形成粗糙面，和（D）为每个穿透孔提供金属膜以形成通孔。

6. 发明申请

US20110189432A1 EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BODY, LAMINATE AND MULTILAYER LAMINATE 审中-公开
标题翻译：环氧树脂组合物，PREPREG，固化体，片状模体，层压板和多层层压板
公开(公告)号：US20110189432A1
公开(公告)日：2011-08-04
申请号：US13056392
申请日：2009-07-29
申请人： Nobuhiro Goto , Masaru Heishi , Hidenobu Deguchi , Takayuki Kobayashi , Junnosuke Murakami
发明人： Nobuhiro Goto , Masaru Heishi , Hidenobu Deguchi , Takayuki Kobayashi , Junnosuke Murakami
IPC分类号： B32B3/00 , C08L63/00 , C08K9/06
CPC分类号： C08J7/14 , B32B3/26 , B32B7/12 , B32B15/08 , B32B15/082 , B32B15/20 , B32B27/04 , B32B27/26 , B32B27/28 , B32B27/302 , B32B27/38 , B32B2260/02 , B32B2260/046 , B32B2307/306 , B32B2307/308 , B32B2307/538 , B32B2307/54 , B32B2307/546 , B32B2307/734 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K9/06 , C08L63/00 , H05K1/0373 , H05K3/181 , H05K3/381 , H05K2201/0209 , H05K2201/0239 , H05K2203/0773 , Y10T428/24355 , Y10T428/259
摘要： Provided is an epoxy resin composition capable of reducing the surface roughness of the surface of a roughening-treated cured body.The epoxy resin composition includes an epoxy resin, a curing agent, and a silica component obtained by performing a surface treatment on silica particles using a silane coupling agent; and the epoxy resin composition does not include a curing accelerator, or includes a curing accelerator at a content equal to or less than 3.5 parts by weight to a total of 100 parts by weight of the epoxy resin and the curing agent. Mean particle diameter of the silica particles is equal to or less than 1 μm. An amount B (g) of the silane coupling agent used for surface treatment, per 1 g of the silica particles in the silica component, is within a range between 10% to 80% with regard to a value C (g) per 1 g of the silica particles, which is calculated by the following formula (X). C (g)/1 g of Silica Particles=[Specific Surface Area of Silica Particles (m2/g)/Minimum Area Coated by Silane Coupling Agent (m2/g)] Formula (X)
摘要翻译：提供能够降低经粗化处理的固化体的表面的表面粗糙度的环氧树脂组合物。环氧树脂组合物包括环氧树脂，固化剂和通过使用硅烷偶联剂对二氧化硅颗粒进行表面处理而获得的二氧化硅组分; 环氧树脂组合物不包含固化促进剂，或者包含相对于总共100重量份的环氧树脂和固化剂为3.5重量份以下的固化促进剂。二氧化硅颗粒的平均粒径等于或小于1μm。用于表面处理的硅烷偶联剂的量B（g）与二氧化硅组分中的每1g二氧化硅颗粒相比，相对于每1g的C（g）值在10％至80％的范围内的二氧化硅颗粒，其通过下式（X）计算。 C（g）/ 1g二氧化硅粒子= [二氧化硅粒子的比表面积（m2 / g）/硅烷偶联剂涂布的最小面积（m2 / g）]式（X）

7. 发明申请

US20090242109A1 MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PARTIALLY CURED EPOXY FILLERS 有权
标题翻译：铜部分金属化到电介质部分固化环氧填料的机械粘合
公开(公告)号：US20090242109A1
公开(公告)日：2009-10-01
申请号：US12059031
申请日：2008-03-31
申请人： Ravi Nalla , Omar Behir , Houssain Jomas
发明人： Ravi Nalla , Omar Behir , Houssain Jomas
IPC分类号： B32B38/04 , B32B5/16 , B32B7/12
CPC分类号： H01L23/53238 , C08J5/18 , C08J2363/00 , H01L24/26 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0298 , H05K3/181 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0796 , Y10T156/1052 , Y10T428/249921 , Y10T428/254 , Y10T428/268 , H01L2924/00
摘要： In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施方案中，提出了铜金属化与具有部分固化的环氧树脂填料的电介质的改进的机械粘附。在这方面，引入具有环氧树脂材料和多个环氧微球的衬底累积膜，其中微球的内部未完全固化。还公开并要求保护其他实施例。

8. 发明申请

US20090029506A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：US20090029506A1
公开(公告)日：2009-01-29
申请号：US12026856
申请日：2008-02-06
申请人： Tomoharu Fujii , Yuichiro Shimizu
发明人： Tomoharu Fujii , Yuichiro Shimizu
IPC分类号： H01L21/56
CPC分类号： H05K1/0218 , H01L23/3121 , H01L23/552 , H01L24/48 , H01L24/97 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2203/0773 , H01L2224/85 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a method of manufacturing a semiconductor device 10 including a wiring board 11 having a ground terminal 38, a semiconductor chip 12 and passive components 14 and 15 which are electronic components mounted on the wiring board 11, and a sealing resin 19 containing a silica filler for sealing the semiconductor chip 12 and the passive components 14 and 15, the silica filler present on a surface of the sealing resin 19 is dissolved with a hydrogen fluoride solution, and a shield layer 21 which is electrically connected to the ground terminal 38 is then formed on the surface of the sealing resin 19 by a plating method.
摘要翻译：在制造半导体器件10的方法中，包括具有接地端子38的布线板11，作为安装在布线板11上的电子部件的半导体芯片12和无源部件14和15以及包含二氧化硅填料的密封树脂19 为了密封半导体芯片12和被动元件14和15，存在于密封树脂19的表面上的二氧化硅填料用氟化氢溶液溶解，然后电连接到接地端子38的屏蔽层21 通过电镀法在密封树脂19的表面上形成。

9. 发明申请

US20020076539A1 Process for producing a multi-layer printer wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US20020076539A1
公开(公告)日：2002-06-20
申请号：US10080408
申请日：2002-02-25
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B003/00
CPC分类号： H05K3/4655 , C08L63/00 , H05K3/4652 , H05K3/4661 , H05K3/4676 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/066 , H05K2203/0773 , Y10S428/901 , Y10T428/24917 , Y10T428/287
摘要： The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition. This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive.
摘要翻译：本发明涉及一种层间粘合剂组合物，其包含液体环氧树脂，软化点高于粘合剂的层压温度和分子内具有两个或更多个环氧基的多官能环氧树脂; 和潜在的环氧固化剂在高于层压温度的温度下引发反应。粘合剂组合物任选地含有液体环氧树脂和/或有机溶剂以外的液体树脂，液体树脂包括液体环氧树脂，有机溶剂或两者构成组合物的10至55重量％。这种层间粘合剂组合物允许制备多层印刷线路板。提供了制备多层印刷线路板的方法。所得到的本发明的多层印刷电路板在内层电路中具有优异的嵌入性能，优异的表面平滑性，并且可以在使用本粘合剂的建筑工艺中以高生产率提供。

10. 发明申请

US20010000518A1 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof 失效
标题翻译：可固化树脂组合物，使用该组合物制造的多层印刷电路板及其制造方法
公开(公告)号：US20010000518A1
公开(公告)日：2001-04-26
申请号：US09729211
申请日：2000-12-05
发明人： Akio Sekimoto , Shinichi Yamada
IPC分类号： C08F008/00
CPC分类号： H05K3/4661 , C08G59/226 , C08G59/38 , C08L9/00 , C08L17/00 , C08L63/00 , H05K2201/0133 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0783 , H05K2203/0793 , H05K2203/0796 , Y10S428/901 , Y10T156/1056 , C08L2666/08
摘要： A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer. The curable resin composition comprises (A) epoxy resins and (B) an epoxy resin curing agent as essential components thereof and optionally contains a rubber component and a filler capable of being decomposed or dissolved by a coarsening agent. This composition contains in combination a bisphenol A type epoxy resin having an epoxy equivalent of not less than 400 and an epoxy resin having an epoxy equivalent of less then 400.
摘要翻译：公开了一种多层印刷电路板，其具有树脂绝缘层和导体层，交替地重叠在电路板上，具有足够的粘合强度，其制备方法和用于形成树脂绝缘层的固化树脂组合物。多层印刷电路板的制造通过将可固化树脂组合物施加到电路板的导体层的表面上，热固化所施加的层，从而形成树脂绝缘层，然后在电路板中钻孔，处理具有粗化剂的树脂绝缘层由此赋予波浪粗化表面，随后通过化学镀将导体层涂覆树脂绝缘层的表面和通孔的内表面，然后在其中形成规定的电路图案导体层。可固化树脂组合物包含（A）环氧树脂和（B）环氧树脂固化剂作为其主要组分，并且任选地包含能够被粗化剂分解或溶解的橡胶组分和填料。该组合物组合含有环氧当量不小于400的双酚A型环氧树脂和环氧当量小于400的环氧树脂。

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