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1. 发明授权

US5945161A Apparatus and method for supplying process solution to surface of substrate to be processed 失效
标题翻译：将处理液供给到待处理基板的表面的装置和方法
公开(公告)号：US5945161A
公开(公告)日：1999-08-31
申请号：US993021
申请日：1997-12-18
申请人： Hiroshi Hashimoto , Kiyohisa Tateyama , Kiyomitsu Yamaguchi , Yoshitaka Matsuda , Norio Uchihira , Mitsuhiro Sakai , Fumio Satou
发明人： Hiroshi Hashimoto , Kiyohisa Tateyama , Kiyomitsu Yamaguchi , Yoshitaka Matsuda , Norio Uchihira , Mitsuhiro Sakai , Fumio Satou
IPC分类号： B05C11/08 , B05D1/00 , H01L21/00 , B05D3/12
CPC分类号： H01L21/6715 , B05C11/08 , B05D1/005
摘要： Disclosed is a processing apparatus comprising holding means, support means, process solution supply means, life means, and rotating means. A substrate to be processed is rotatably held by the holding means. An overhanging portion of the substrate extending over an edge of the holding means is supported by the support means to maintain a front surface of the substrate horizontally flat. A process solution is supplied from the process solution supply means onto the front surface of the substrate held by the holding means and supported by the support means. The substrate held by the holding means is vertically moved by the lift means relative to the support means. Further, the substrate moved upward relative to the support means is rotated by the rotating means.
摘要翻译：公开了一种处理装置，包括保持装置，支撑装置，处理液供给装置，寿命装置和旋转装置。待加工的基板被保持装置可旋转地保持。在保持装置的边缘上延伸的衬底的悬伸部分被支撑装置支撑，以使衬底的前表面水平地保持平坦。处理液从处理液供给装置供给到由保持装置保持的基板的前表面上并由支撑装置支撑。由保持装置保持的基板通过提升装置相对于支撑装置垂直移动。此外，相对于支撑装置向上移动的基板由旋转装置旋转。

2. 发明授权

US6159288A Method and apparatus for cleaning treatment 失效
公开(公告)号：US6159288A
公开(公告)日：2000-12-12
申请号：US935917
申请日：1997-09-23
申请人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Kimio Motoda , Yoshitaka Matsuda , Tetsuya Sada , Kiyohisa Tateyama
发明人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Kimio Motoda , Yoshitaka Matsuda , Tetsuya Sada , Kiyohisa Tateyama
IPC分类号： B05C11/08 , B05C9/06 , B05C11/00
CPC分类号： B05C11/08 , Y10S134/902
摘要： An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

3. 发明授权

US06391110B1 Method and apparatus for cleaning treatment 失效
标题翻译：清洁处理方法和装置
公开(公告)号：US06391110B1
公开(公告)日：2002-05-21
申请号：US09686820
申请日：2000-10-12
申请人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Tetsuya Sada , Kiyohisa Tateyama
发明人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Tetsuya Sada , Kiyohisa Tateyama
IPC分类号： B05C1100
CPC分类号： B05C11/08 , Y10S134/902
摘要： An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.
摘要翻译：提供了一种处理装置，该装置包括：用于回收在处理物体时流出或飞出的处理液的容器;清洗装置，用于通过向容器供给清洗液体来清洗容器的内壁表面;以及循环系统，用于当通过清洁装置清洁容器的内壁表面并将回收的液体供应到清洁装置时，回收从容器排出的排出液体。

4. 发明授权

US6058544A Scrubbing apparatus and scrubbing method 失效
标题翻译：擦洗装置和洗涤方法
公开(公告)号：US6058544A
公开(公告)日：2000-05-09
申请号：US25344
申请日：1998-02-18
申请人： Kimio Motoda , Yoshiharu Ota , Norio Uchihira , Kiyohisa Tateyama
发明人： Kimio Motoda , Yoshiharu Ota , Norio Uchihira , Kiyohisa Tateyama
IPC分类号： G02F1/13 , B08B1/00 , B08B1/04 , B08B3/04 , B08B11/02 , G11B23/50 , H01L21/00 , H01L21/304 , B08B3/10
CPC分类号： H01L21/67051 , B08B1/007 , B08B1/04 , B08B11/02 , H01L21/67046 , G11B23/505
摘要： A scrubbing apparatus comprises a holding member, which holds the outer circumference of the substrate from its back surface and has an opening to expose the back surface of the held substrate toward the bottom side; a supporting member, which supports substantially the center between two opposed sides of the holding member; a scrubbing brush, which comes in contact with the exposed back surface of the substrate from the bottom side; a brush drive mechanism, which transfers the scrubbing brush along the two opposed sides of the holding member; and a rotation drive mechanism, which drives to rotate the holding member together with the supporting member. Thus, a space can be saved, and the back surface of the substrate can be scrubbed.
摘要翻译：洗涤装置包括保持构件，该保持构件从其后表面保持衬底的外周，并具有用于将保持的衬底的后表面朝向底侧露出的开口; 支撑构件，其基本上支撑在所述保持构件的两个相对侧之间的中心; 洗涤刷，其从底侧与衬底的暴露的背面接触; 刷驱动机构，其沿着保持构件的两个相对侧传送洗刷刷; 以及旋转驱动机构，其驱动以使支撑构件与支撑构件一起旋转。因此，可以节省空间，并且可以擦洗衬底的背面。

5. 发明授权

US6090205A Apparatus for processing substrate 失效
标题翻译：基板处理装置
公开(公告)号：US6090205A
公开(公告)日：2000-07-18
申请号：US152340
申请日：1998-09-14
申请人： Mitsuhiro Sakai , Kiyohisa Tateyama
发明人： Mitsuhiro Sakai , Kiyohisa Tateyama
IPC分类号： B05C11/08 , G03F7/30 , G03F7/40 , B05C13/02
CPC分类号： G03F7/40 , G03F7/3021 , B05C11/08
摘要： A method of processing a substrate having the steps of placing a substrate for forming an LCD on a support, mounting a cover on the substrate in such a manner that a clearance is formed from at least either surface of the substrate placed on the support, introducing developer or pure water into the clearance, bringing the developer or pure water into contact with at least either surface of the substrate, processing the substrate with the developer or pure water, removing the cover from the substrate, and discharging the substrate from the support.
摘要翻译：一种处理基板的方法，该方法具有以下步骤：将用于形成LCD的基板放置在支撑体上，将盖安装在基板上，使得从放置在支撑体上的基板的至少任一表面形成间隙，显影剂或纯水进入间隙，使显影剂或纯水与基材的至少任一表面接触，用显影剂或纯水处理基材，从基材上除去盖子，并从载体上排出基材。

6. 发明授权

US06261007B1 Substrate process method and substrate process apparatus 失效
标题翻译：基板工艺方法和基板工艺装置
公开(公告)号：US06261007B1
公开(公告)日：2001-07-17
申请号：US09362860
申请日：1999-07-29
申请人： Hideyuki Takamori , Kiyohisa Tateyama , Kengo Mizosaki , Noriyuki Anai , Mitsuhiro Sakai , Shinobu Tanaka , Yoichi Honda , Yuji Shimomura
发明人： Hideyuki Takamori , Kiyohisa Tateyama , Kengo Mizosaki , Noriyuki Anai , Mitsuhiro Sakai , Shinobu Tanaka , Yoichi Honda , Yuji Shimomura
IPC分类号： G03D500
CPC分类号： H01L21/6715 , G03F7/168 , H01L21/67034
摘要： Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.
摘要翻译：刚刚将抗蚀剂溶液涂覆在基材上之后，其基本处于非加热状态。实际上，惯性气体等从喷头吹送到基板。因此，涂布在基板上的抗蚀剂溶液被干燥。因此，可以防止导致抗蚀剂膜的膜厚度不均匀的转印标记和电路图案的线宽波动。

7. 发明授权

US06451515B2 Substrate treating method 失效
公开(公告)号：US06451515B2
公开(公告)日：2002-09-17
申请号：US09366960
申请日：1999-08-04
申请人： Hideyuki Takamori , Kiyohisa Tateyama , Kengo Mizosaki , Noriyuki Anai , Yoshitaka Matsuda
发明人： Hideyuki Takamori , Kiyohisa Tateyama , Kengo Mizosaki , Noriyuki Anai , Yoshitaka Matsuda
IPC分类号： G03F738
CPC分类号： B05D3/0209 , B05D1/005 , G03F7/168
摘要： A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.

8. 发明授权

US06443641B2 Substrate process method and substrate process apparatus 失效
标题翻译：基板工艺方法和基板工艺装置
公开(公告)号：US06443641B2
公开(公告)日：2002-09-03
申请号：US09874259
申请日：2001-06-06
申请人： Hideyuki Takamori , Kiyohisa Tateyama , Kengo Mizosaki , Noriyuki Anai , Mitsuhiro Sakai , Shinobu Tanaka , Yoichi Honda , Yuji Shimomura
发明人： Hideyuki Takamori , Kiyohisa Tateyama , Kengo Mizosaki , Noriyuki Anai , Mitsuhiro Sakai , Shinobu Tanaka , Yoichi Honda , Yuji Shimomura
IPC分类号： G03D500
CPC分类号： H01L21/6715 , G03F7/168 , H01L21/67034
摘要： Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.
摘要翻译：刚刚将抗蚀剂溶液涂覆在基材上之后，其基本处于非加热状态。实际上，惯性气体等从喷头吹送到基板。因此，涂布在基板上的抗蚀剂溶液被干燥。因此，可以防止导致抗蚀剂膜的膜厚度不均匀的转印标记和电路图案的线宽波动。

9. 发明授权

US06168665A Substrate processing apparatus 失效
标题翻译：基板加工装置
公开(公告)号：US06168665A
公开(公告)日：2001-01-02
申请号：US09185503
申请日：1998-11-04
申请人： Mitsuhiro Sakai , Kiyohisa Tateyama , Kimio Motoda
发明人： Mitsuhiro Sakai , Kiyohisa Tateyama , Kimio Motoda
IPC分类号： B05C2100
CPC分类号： H01L21/67017 , B05C11/08
摘要： A substrate processing apparatus comprising a substrate mounting table, a cup having an upper opening and surrounding the substrate mounting table, a lid for opening/closing the upper opening of the cup, a support arm for supporting the lid, a first lifting mechanism having a first piston for supporting the support arm directly or indirectly and a first cylinder for guiding the first piston in an up-and-down motion, a second lifting mechanism having a second piston for supporting the support arm directly or indirectly and a second cylinder for guiding the second piston in up-and -down motion, a driving circuit for supplying the pressurized fluid to the first and second cylinders, independently and exhausting the pressurized fluid from the first and second cylinders, independently, and a control mechanism for controlling operations of the driving circuit.
摘要翻译：一种基板处理装置，包括基板安装台，具有上开口并围绕基板安装台的杯，用于打开/关闭杯的上开口的盖，用于支撑盖的支撑臂，具有第一提升机构，用于直接或间接地支撑支撑臂的第一活塞和用于上下运动地引导第一活塞的第一气缸，具有用于直接或间接地支撑支撑臂的第二活塞的第二提升机构和用于引导的第二气缸所述第二活塞是上下运动的驱动电路，用于独立地将加压流体供应到第一和第二气缸的驱动电路独立地从第一和第二气缸排出加压流体;以及控制机构，用于控制驱动电路。

10. 发明授权

US5853961A Method of processing substrate and apparatus for processing substrate 失效
标题翻译：基板处理方法及基板处理装置
公开(公告)号：US5853961A
公开(公告)日：1998-12-29
申请号：US635874
申请日：1996-04-18
申请人： Mitsuhiro Sakai , Kiyohisa Tateyama
发明人： Mitsuhiro Sakai , Kiyohisa Tateyama
IPC分类号： B05C11/08 , G03F7/30 , G03F7/40 , G03C5/00 , G03D5/00
CPC分类号： G03F7/40 , G03F7/3021 , B05C11/08
摘要： A method of processing a substrate having the steps of placing a substrate for forming an LCD on a support, mounting a cover on the substrate in such a manner that a clearance is formed from at least either surface of the substrate placed on the support, introducing developer or pure water into the clearance, bringing the developer or pure water into contact with at least either surface of the substrate, processing the substrate with the developer or pure water, removing the cover from the substrate, and discharging the substrate from the support.
摘要翻译：一种处理基板的方法，该方法具有以下步骤：将用于形成LCD的基板放置在支撑体上，将盖安装在基板上，使得从放置在支撑体上的基板的至少任一表面形成间隙，显影剂或纯水进入间隙，使显影剂或纯水与基材的至少任一表面接触，用显影剂或纯水处理基材，从基材上除去盖子，并从载体上排出基材。

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