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1. 发明授权

US6062240A Treatment device 失效
标题翻译：治疗装置
公开(公告)号：US6062240A
公开(公告)日：2000-05-16
申请号：US35902
申请日：1998-03-06
申请人： Tetsuya Sada , Norio Uchihira , Mitsuhiro Sakai , Kiyomitsu Yamaguchi
发明人： Tetsuya Sada , Norio Uchihira , Mitsuhiro Sakai , Kiyomitsu Yamaguchi
IPC分类号： B05C11/08 , G03F7/16 , H01L21/00 , H01L21/687 , B08B3/02
CPC分类号： H01L21/6715 , B05C11/08 , G03F7/162 , H01L21/67051 , H01L21/68714 , Y10S134/902
摘要： A treatment device comprising a holding method for holding a substrate such as an LCD substrate; and a treatment solution supply method for supplying a treatment solution on a surface of the substrate wherein the holding method has a substrate-placing portion on which the substrate is disposed, the substrate-placing is made of a synthetic resinous material. Since the holding method has a substrate-placing portion which is made of a synthetic resinous material, the electric charge amount of the substrate can be reduced to prevent various static electricity caused troubles such as the electrostatic destruction of the device formed on the substrate. Further, a discharge noise trouble due to discharge phenomenon from the substrate to a transporting method can be prevented. Further, it is possible to reduce the electric charge amount of the holding method and destaticize the holding method by supplying a destaticizing fluid such as ionized pure water or ionized gas towards above or below the holding method. Thus, it is possible to prevent various static-electricity caused troubles such as the electrostatic destruction of the device formed in the device from occurring and further, possible to prevent noise troubles from occurring because the generation degree of the discharge which occurs between the substrate and the transport method can be reduced further. The electric charge amount of the substrate can be reduced by making the thickness (distance) of the substrate-placing portion formed of a dielectric thick (long).
摘要翻译：一种处理装置，包括用于保持诸如LCD基板的基板的保持方法; 以及一种处理溶液供应方法，用于在基板的表面上提供处理溶液，其中保持方法具有其上设置有基板的基板放置部分，基板放置由合成树脂材料制成。由于保持方法具有由合成树脂材料制成的基板放置部分，所以可以减少基板的电荷量，以防止各种静电引起诸如形成在基板上的装置的静电破坏的麻烦。此外，可以防止由于从基板到输送方法的放电现象引起的放电噪声问题。此外，通过向静电保持方法的上方或下方供给诸如电离纯化水或离子化气体的去静电液体，可以减少保持方法的电荷量并使其保持静电。因此，可以防止各种静电引起的故障，例如装置中形成的装置的静电破坏的发生，并且进一步可以防止由于在基板和基板之间发生的放电的产生程度而发生噪声问题可以进一步降低运输方式。通过使电介质厚（长）形成的基板载置部的厚度（距离）可以减小基板的电荷量。

2. 发明授权

US08222569B2 Heat-treating apparatus, heat-treating method and storage medium 有权
标题翻译：热处理装置，热处理方法和储存介质
公开(公告)号：US08222569B2
公开(公告)日：2012-07-17
申请号：US12244885
申请日：2008-10-03
申请人： Yuichi Sakai , Kiyomitsu Yamaguchi
发明人： Yuichi Sakai , Kiyomitsu Yamaguchi
IPC分类号： F27B5/16 , H01L21/02 , H01L21/324 , B05C11/06
CPC分类号： H01L21/6719 , H01L21/67098 , H01L21/67109 , H01L21/67748 , H01L21/68785
摘要： A heat treating apparatus utilizes a straightening plate provided in its central part with a gas exhaust opening and disposed under a heating plate. A temperature-reducing purge ring is disposed between the face plate and the straightening plate, and is provided in its inner circumference with plural gas jetting holes. A thin gap is formed between the temperature-reducing purge ring and the face plate. When a cooling gas is jetted radially inward through the gas jetting holes, a vacuum is created between the lower surface of the face plate and the upper surface of the temperature-reducing purge ring. Air is sucked into the space between the face plate and the straightening plate and flows together with the cooling gas to rapidly cool the face plate.
摘要翻译：热处理装置利用设置在其中心部分的矫直板和排气口，并设置在加热板的下方。在面板和矫直板之间设置减温清洗环，并且在其内周设置有多个气体喷射孔。在减温清洗环和面板之间形成薄的间隙。当冷却气体径向向内喷射穿过气体喷射孔时，在面板的下表面和减温清洗环的上表面之间产生真空。空气被吸入面板和矫直板之间的空间中并与冷却气体一起流动以快速冷却面板。

3. 发明授权

US06391110B1 Method and apparatus for cleaning treatment 失效
标题翻译：清洁处理方法和装置
公开(公告)号：US06391110B1
公开(公告)日：2002-05-21
申请号：US09686820
申请日：2000-10-12
申请人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Tetsuya Sada , Kiyohisa Tateyama
发明人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Tetsuya Sada , Kiyohisa Tateyama
IPC分类号： B05C1100
CPC分类号： B05C11/08 , Y10S134/902
摘要： An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.
摘要翻译：提供了一种处理装置，该装置包括：用于回收在处理物体时流出或飞出的处理液的容器;清洗装置，用于通过向容器供给清洗液体来清洗容器的内壁表面;以及循环系统，用于当通过清洁装置清洁容器的内壁表面并将回收的液体供应到清洁装置时，回收从容器排出的排出液体。

4. 发明申请

US20090098297A1 HEAT-TREATING APPARATUS, HEAT-TREATING METHOD AND STORAGE MEDIUM 有权
标题翻译：热处理设备，热处理方法和储存介质
公开(公告)号：US20090098297A1
公开(公告)日：2009-04-16
申请号：US12244885
申请日：2008-10-03
申请人： Yuichi SAKAI , Kiyomitsu Yamaguchi
发明人： Yuichi SAKAI , Kiyomitsu Yamaguchi
IPC分类号： B05D3/04 , B05C11/06
CPC分类号： H01L21/6719 , H01L21/67098 , H01L21/67109 , H01L21/67748 , H01L21/68785
摘要： A straightening plate provided in its central part with a gas exhaust opening is disposed under a face plate serving as a heating plate. A temperature-reducing purge ring is disposed between the face plate and the straightening plate. The temperature-reducing purge ring has an outside diameter substantially equal to that of the straightening plate and is provided in its inner circumference with plural gas jetting holes. The temperature-reducing purge ring is disposed close to the face plate such that a thin gap is formed between the temperature-reducing purge ring and the face plate. When a cooling gas is jetted radially inward through the gas jetting holes of the temperature-reducing purge ring, a vacuum is created between the lower surface of the face plate and the upper surface of the temperature-reducing purge ring. Consequently, a large amount of air is sucked into the space between the face plate and the straightening plate and flows together with the cooling gas, so that the face plate can be rapidly cooled.
摘要翻译：在其中央部设置有排气口的矫直板设置在作为加热板的面板的下方。在面板和矫正板之间设置减温清洗环。减温清洗环的外径基本上等于矫直板的外径，并且在其内周设有多个气体喷射孔。减温清洗环设置在面板附近，使得在减温清洗环和面板之间形成薄的间隙。当冷却气体径向向内喷射通过减温清洗环的气体喷射孔时，在面板的下表面和减温清洗环的上表面之间产生真空。因此，大量的空气被吸入到面板和矫正板之间的空间中并与冷却气体一起流动，使得面板能够被快速冷却。

5. 发明授权

US5945161A Apparatus and method for supplying process solution to surface of substrate to be processed 失效
标题翻译：将处理液供给到待处理基板的表面的装置和方法
公开(公告)号：US5945161A
公开(公告)日：1999-08-31
申请号：US993021
申请日：1997-12-18
申请人： Hiroshi Hashimoto , Kiyohisa Tateyama , Kiyomitsu Yamaguchi , Yoshitaka Matsuda , Norio Uchihira , Mitsuhiro Sakai , Fumio Satou
发明人： Hiroshi Hashimoto , Kiyohisa Tateyama , Kiyomitsu Yamaguchi , Yoshitaka Matsuda , Norio Uchihira , Mitsuhiro Sakai , Fumio Satou
IPC分类号： B05C11/08 , B05D1/00 , H01L21/00 , B05D3/12
CPC分类号： H01L21/6715 , B05C11/08 , B05D1/005
摘要： Disclosed is a processing apparatus comprising holding means, support means, process solution supply means, life means, and rotating means. A substrate to be processed is rotatably held by the holding means. An overhanging portion of the substrate extending over an edge of the holding means is supported by the support means to maintain a front surface of the substrate horizontally flat. A process solution is supplied from the process solution supply means onto the front surface of the substrate held by the holding means and supported by the support means. The substrate held by the holding means is vertically moved by the lift means relative to the support means. Further, the substrate moved upward relative to the support means is rotated by the rotating means.
摘要翻译：公开了一种处理装置，包括保持装置，支撑装置，处理液供给装置，寿命装置和旋转装置。待加工的基板被保持装置可旋转地保持。在保持装置的边缘上延伸的衬底的悬伸部分被支撑装置支撑，以使衬底的前表面水平地保持平坦。处理液从处理液供给装置供给到由保持装置保持的基板的前表面上并由支撑装置支撑。由保持装置保持的基板通过提升装置相对于支撑装置垂直移动。此外，相对于支撑装置向上移动的基板由旋转装置旋转。

6. 发明授权

US5906860A Apparatus for treating a substrate with resist and resist-treating method 失效
标题翻译：用抗蚀剂和抗蚀剂处理方法处理基材的设备
公开(公告)号：US5906860A
公开(公告)日：1999-05-25
申请号：US832816
申请日：1997-04-04
申请人： Kimio Motoda , Kiyomitsu Yamaguchi , Yoshitaka Matsuda , Tetsu Kawasaki
发明人： Kimio Motoda , Kiyomitsu Yamaguchi , Yoshitaka Matsuda , Tetsu Kawasaki
IPC分类号： B05C11/08 , G03F7/16 , H01L21/00 , H01L21/683 , B05D3/12 , B05C11/02
CPC分类号： H01L21/6715 , B05C11/08 , G03F7/162 , H01L21/6838
摘要： The invention provides an apparatus for treating a substrate with resist, comprising a spin chuck for horizontally holding a substrate, a first motor for variably rotating the spin chuck, a nozzle for applying resist solution onto the upper surface of the substrate held on the spin chuck, a cup having an upper opening through which the substrate is put in or taken out of the cup and a lower opening through which extends the driving shaft of the spin chuck, the cup positioned to surround the substrate held on the spin chuck to receive liquid centrifugally separated from the substrate which is rotated about its axis, a lid to close the upper opening of the cup to define a space around the substrate, a second motor for variably rotating the cup independently of the spin chuck rotation, a liftable cylinder for relatively moving at least one of the spin chuck and cup, which are positioned apart from each other, toward each other to achieve mutual contact, and an O-ring for hermetically sealing the mutual contact portion between the cup and spin chuck when these cup and spin chuck are brought into mutual contact by the liftable cylinder. When the cup and spin chuck are brought into mutual contact by the liftable cylinder, the lower opening of the cup is closed by the spin chuck to form a hermetic space. The spin chuck and cup are rotated in synchronism by first and second motors while the chamber is kept hermetically closed.
摘要翻译：本发明提供了一种用抗蚀剂处理基板的装置，包括用于水平地保持基板的旋转卡盘，用于可变地旋转旋转卡盘的第一马达，用于将抗蚀剂溶液施加到保持在旋转卡盘上的基板的上表面上的喷嘴具有上部开口的杯子，衬底通过该开口被放入或从杯子中取出，以及下部开口，其通过旋转卡盘的驱动轴延伸，杯子定位成围绕保持在旋转卡盘上的衬底以接收液体与围绕其轴线旋转的基板离心分离，盖以封闭杯的上部开口以限定基板周围的空间，用于独立于旋转卡盘旋转可变地旋转杯的第二马达，用于相对地将彼此分开定位的旋转卡盘和杯中的至少一个彼此移动以实现相互接触，以及用于气密密封的O形环当这些杯和旋转卡盘通过可升降缸相互接触时，杯和旋转卡盘之间的相互接触部分。当杯和旋转卡盘通过可升降缸相互接触时，杯的下开口被旋转卡盘封闭以形成密封空间。旋转卡盘和杯子由第一和第二马达同步旋转，同时气室保持密闭。

7. 发明授权

US06770149B2 Method and apparatus for cleaning treatment 失效
标题翻译：清洁处理方法和装置
公开(公告)号：US06770149B2
公开(公告)日：2004-08-03
申请号：US10127756
申请日：2002-04-23
申请人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi
发明人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi
IPC分类号： B08B304
CPC分类号： B05C11/08 , Y10S134/902
摘要： A method for a cleaning treatment including a step of forming, in a coating mechanism, a coating film on a substrate provided within a cup. The method further includes dissolving, in an edge cleaning mechanism, a portion of the coating film on the substrate using a cleaning liquid, and recovering at least a portion of used cleaning liquid from the edge cleaning mechanism. The recovered cleaning liquid is stored and a level of the stored cleaning liquid is detected. The method also includes supplementing a fresh cleaning liquid to the stored cleaning liquid when a detected level of the stored cleaning liquid is lower than a predetermined level, and using a mixture of the supplemented fresh cleaning liquid and the stored cleaning liquid to clean the cup of the coating mechanism.
摘要翻译：一种清洁处理方法，包括在涂布机构中形成设置在杯内的基板上的涂膜的步骤。该方法还包括使用清洁液将边缘清洁机构中的涂膜的一部分溶解在基板上，并从边缘清洁机构回收至少一部分使用过的清洗液体。回收的清洗液被储存，并且检测出存储的清洗液的水平。该方法还包括当检测到的存储的清洁液体的水平低于预定水平时，将新鲜的清洁液体补充到所储存的清洁液体，并且使用补充的新鲜清洁液体和所储存的清洁液体的混合物来清洁涂层机理。

8. 发明授权

US06398879B1 Method and apparatus for cleaning treatment 失效
公开(公告)号：US06398879B1
公开(公告)日：2002-06-04
申请号：US09686823
申请日：2000-10-12
申请人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Kimio Motoda , Yoshitaka Matsuda
发明人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Kimio Motoda , Yoshitaka Matsuda
IPC分类号： B08B302
CPC分类号： B05C11/08 , Y10S134/902
摘要： An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

9. 发明授权

US6159288A Method and apparatus for cleaning treatment 失效
公开(公告)号：US6159288A
公开(公告)日：2000-12-12
申请号：US935917
申请日：1997-09-23
申请人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Kimio Motoda , Yoshitaka Matsuda , Tetsuya Sada , Kiyohisa Tateyama
发明人： Fumio Satou , Mitsuhiro Sakai , Takeshi Tsukamoto , Yoichi Honda , Kiyomitsu Yamaguchi , Kimio Motoda , Yoshitaka Matsuda , Tetsuya Sada , Kiyohisa Tateyama
IPC分类号： B05C11/08 , B05C9/06 , B05C11/00
CPC分类号： B05C11/08 , Y10S134/902
摘要： An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

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