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1. 发明授权

US5495397A Three dimensional package and architecture for high performance computer 失效
标题翻译：高性能计算机的三维封装和架构
公开(公告)号：US5495397A
公开(公告)日：1996-02-27
申请号：US54110
申请日：1993-04-27
申请人： Evan E. Davidson , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Janusz S. Wilczynski
发明人： Evan E. Davidson , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Janusz S. Wilczynski
IPC分类号： H05K3/36 , H01L25/065 , H05K1/05 , H05K1/14 , H05K3/34 , H05K3/46 , H05K7/14
CPC分类号： H05K3/4641 , H01L25/0652 , H05K1/145 , H01L2224/48091 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H05K1/053 , H05K1/056 , H05K2201/068 , H05K2201/09309 , H05K2201/09718 , H05K3/3436 , H05K3/4608 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926
摘要： A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection members to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection members can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.
摘要翻译：描述了用于最终高性能计算机的三维封装架构及其制造方法。该封装允许非常密集的多个集成电路芯片的封装，以实现计算机的最小通信距离和最大时钟速度。包装结构由多个子组件形成。每个子组件由至少一个侧面上至少有一个集成电路器件的衬底形成。在相邻的子组件之间设置有第二衬底。存在电互连构件以将子组件上的接触位置电互连到第二衬底上的接触位置。电气互连构件可以是焊料堆，引线接合等。第一基板在电子设备和每个子组件之间提供电信号互通。第二基板提供对多个子组件的接地和功率分配。可选地，结构的外表面可以设置成存储芯片的立方体。

2. 发明授权

US5536921A System for applying microware energy in processing sheet like materials 失效
标题翻译：将微软件的能量应用于加工板材的系统
公开(公告)号：US5536921A
公开(公告)日：1996-07-16
申请号：US548262
申请日：1995-10-25
申请人： Jeffrey C. Hedrick , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Stanley J. Whitehair
发明人： Jeffrey C. Hedrick , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Stanley J. Whitehair
IPC分类号： H05B6/80 , H05B6/62 , H05B6/78
CPC分类号： H05B6/788
摘要： A microwave processing system is provided wherein the material to be processed is in the form of a web type quantity configuration with a thickness that is small in relation to the wavelength of a particular microwave frequency. The material is passed through the field associated with a plurality of microwave standing waves of the particular frequency, each adjacent standing wave being offset 1/4 wavelength along the direction of movement of the web. A carrier gas removes volatile solvents from the material surfaces. Control is provided for the interrelationship of temperature, rate of movement, flow of carrier gas, and microwave power.
摘要翻译：提供了一种微波处理系统，其中待处理的材料是相对于特定微波频率的波长具有较小厚度的幅材类型数量构型的形式。材料通过与特定频率的多个微波驻波相关联的场，每个相邻驻波沿着幅材的移动方向偏移1/4波长。载气从材料表面除去挥发性溶剂。提供温度，运动速率，载气流量和微波功率的相互关系的控制。

3. 发明授权

US5258236A Multi-layer thin film structure and parallel processing method for fabricating same 失效
标题翻译：多层薄膜结构及其制造方法
公开(公告)号：US5258236A
公开(公告)日：1993-11-02
申请号：US695368
申请日：1991-05-03
申请人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
发明人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
IPC分类号： B23K26/00 , B32B37/00 , H01L21/68 , H01L23/12 , H01L23/15 , H05K3/00 , H05K3/46 , B32B15/04 , H01L29/12
CPC分类号： H01L21/6835 , H01L2221/68345 , H01L2221/68359 , H05K3/0011 , H05K3/46 , Y10T156/1158 , Y10T428/12528 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611
摘要： A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
摘要翻译：一种用于从衬底释放工件的方法和装置，包括提供对预定波长的电磁辐射是透明的衬底; 在衬底上形成响应于预定辐射而降解的分离层; 在分离层上提供工件; 并且通过透明基板将分离层处的预定辐射引导，以使分离层退化并将工件与基板分离。

4. 发明授权

US5534094A Method for fabricating multi-layer thin film structure having a separation layer 失效
标题翻译：具有分离层的多层薄膜结构的制造方法
公开(公告)号：US5534094A
公开(公告)日：1996-07-09
申请号：US314789
申请日：1994-09-29
申请人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
发明人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
IPC分类号： B23K26/00 , B32B37/00 , H01L21/68 , H01L23/12 , H01L23/15 , H05K3/00 , H05K3/46 , B32B31/28
CPC分类号： H01L21/6835 , H01L2221/68345 , H01L2221/68359 , H05K3/0011 , H05K3/46 , Y10T156/1158 , Y10T428/12528 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611
摘要： A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
摘要翻译：一种用于从衬底释放工件的方法和装置，包括提供对预定波长的电磁辐射是透明的衬底; 在衬底上形成响应于预定辐射而降解的分离层; 在分离层上提供工件; 并且通过透明基板将分离层处的预定辐射引导，以使分离层退化并将工件与基板分离。

5. 发明授权

US5599611A Prepreg and cured laminate fabricated from a toughened polycyanurate 失效
标题翻译：由增韧的聚氰酸酯制成的预浸料和固化层压板
公开(公告)号：US5599611A
公开(公告)日：1997-02-04
申请号：US344479
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B7/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A prepreg comprising a reinforcing material impregnated with a curable material. The curable material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译：一种预浸料，其包含浸渍有可固化材料的增强材料。可固化材料包括含氟氰酸酯和含氟亚芳基醚聚合物的共混物。氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，并且含氟亚芳基醚聚合物具有X-R- [R 1] m -X的结构，X是任何能够与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。固化状态的材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。热塑性聚合物相具有亚微米尺寸。

6. 发明授权

US5582858A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5582858A
公开(公告)日：1996-12-10
申请号：US474985
申请日：1995-06-07
申请人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , B05D5/10
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络嵌入在陶瓷和/或聚合物基材内。在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

7. 发明授权

US5556899A Fluorinated carbon polymer composites 失效
标题翻译：氟化碳聚合物复合材料
公开(公告)号：US5556899A
公开(公告)日：1996-09-17
申请号：US346766
申请日：1994-11-30
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , C08J5/18
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.
摘要翻译：公开了通过基于2-60重量份的分散体形成复合材料来实现聚酰亚胺材料的介电常数和热膨胀系数的变化的方法。％的氟化颗粒碳材料和聚酰亚胺或聚酰亚胺前体，并将分散体在65℃-200℃/秒加热至约400℃。

8. 发明授权

US5527838A Toughened polycyanurate resins containing particulates 失效
标题翻译：含有微粒的增韧聚氰脲酸酯树脂
公开(公告)号：US5527838A
公开(公告)日：1996-06-18
申请号：US344478
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , C08K7/16
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A curable material comprising a particulate filler and a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.
摘要翻译：一种包含颗粒填料和含氟氰酸酯和含氟亚芳基醚聚合物的共混物的可固化材料。氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，含氟亚芳基醚聚合物具有结构X-R- [R 1] m -X，其中X是可与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100; 固化状态的材料包括含氟聚氰化酸盐网络，其中分散有所述含氟热塑性聚合物的多个离散相，其中所述热塑性聚合物相具有亚微米尺寸。

9. 发明授权

US5571852A Fluorinated carbon polymer composites 失效
公开(公告)号：US5571852A
公开(公告)日：1996-11-05
申请号：US472120
申请日：1995-06-07
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , C08J3/28
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.

10. 发明授权

US5529836A Multilayer article comprising a toughened polycyanurate 失效
标题翻译：包含增韧的聚氰化油酸酯的多层制品
公开(公告)号：US5529836A
公开(公告)日：1996-06-25
申请号：US344476
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B7/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A laminate comprising a layer of conductive metal and a plurality of layers of a cured prepreg is disclosed. The prepreg comprises a reinforcing material impregnated with a curable material. The curable material is a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.ident.C--O--R--[R.sup.1 ].sub.n --O--C.ident.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.ident.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译：公开了一种包含导电金属层和多层固化预浸料的层压体。预浸料包括浸渍有可固化材料的增强材料。可固化材料是含氟氰酸酯和含氟亚芳基醚聚合物的共混物。氰酸酯是具有结构N = C-O-R- [R 1] n -O-C = N的单体，含氟亚芳基醚聚合物具有结构X-R- [R 1] m -X，其中X是能够与-C = N基团反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。固化状态的材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。热塑性聚合物相具有亚微米尺寸。

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