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1. 发明授权

US5536921A System for applying microware energy in processing sheet like materials 失效
标题翻译：将微软件的能量应用于加工板材的系统
公开(公告)号：US5536921A
公开(公告)日：1996-07-16
申请号：US548262
申请日：1995-10-25
申请人： Jeffrey C. Hedrick , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Stanley J. Whitehair
发明人： Jeffrey C. Hedrick , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Stanley J. Whitehair
IPC分类号： H05B6/80 , H05B6/62 , H05B6/78
CPC分类号： H05B6/788
摘要： A microwave processing system is provided wherein the material to be processed is in the form of a web type quantity configuration with a thickness that is small in relation to the wavelength of a particular microwave frequency. The material is passed through the field associated with a plurality of microwave standing waves of the particular frequency, each adjacent standing wave being offset 1/4 wavelength along the direction of movement of the web. A carrier gas removes volatile solvents from the material surfaces. Control is provided for the interrelationship of temperature, rate of movement, flow of carrier gas, and microwave power.
摘要翻译：提供了一种微波处理系统，其中待处理的材料是相对于特定微波频率的波长具有较小厚度的幅材类型数量构型的形式。材料通过与特定频率的多个微波驻波相关联的场，每个相邻驻波沿着幅材的移动方向偏移1/4波长。载气从材料表面除去挥发性溶剂。提供温度，运动速率，载气流量和微波功率的相互关系的控制。

2. 发明授权

US5541567A Coaxial vias in an electronic substrate 失效
标题翻译：电子基板中的同轴通孔
公开(公告)号：US5541567A
公开(公告)日：1996-07-30
申请号：US323554
申请日：1994-10-17
申请人： Keith E. Fogel , Jeffrey C. Hedrick , David A. Lewis , Eva E. Simonyi , Alfred Viehbeck , Stanley J. Whitehair
发明人： Keith E. Fogel , Jeffrey C. Hedrick , David A. Lewis , Eva E. Simonyi , Alfred Viehbeck , Stanley J. Whitehair
IPC分类号： H01F17/00 , H05K1/05 , H05K3/40 , H05K3/44 , H01F5/00 , H05K1/16
CPC分类号： H05K3/445 , H01F17/0006 , H05K1/056 , H05K2201/09636 , H05K2201/09881 , H05K2201/10416 , H05K3/4046
摘要： Structures are described having vias with more than one electrical conductor at least one of which is a solid conductor which is formed by inserting the wire into the via in a substrate wherein the wire is attached to an electrically conductive plate which is spaced apart from the substrate by a spacer which leave a space between the substrate and plate. The space is filled with a dielectric material. The space with via between the conductor and via sidewall is filled with a dielectric material. The via is used for making transformers and inductors wherein one of the via conductors is used for inner windings and another of the via conductors is used for outer windings.
摘要翻译：描述了具有多于一个电导体的通孔的结构，其中至少一个电导体是通过将电线插入基板中的通孔而形成的实心导体，其中导线附接到与基板间隔开的导电板通过在基板和板之间留下空隙的间隔件。该空间填充有电介质材料。在导体和通孔侧壁之间具有通孔的空间填充有电介质材料。通孔用于制造变压器和电感器，其中通孔导体之一用于内部绕组，另一个通孔导体用于外部绕组。

3. 发明授权

US5241040A Microwave processing 失效
标题翻译：微波加工
公开(公告)号：US5241040A
公开(公告)日：1993-08-31
申请号：US551716
申请日：1990-07-11
申请人： Jerome J. Cuomo , Jeffrey D. Gelorme , Michael Hatzakis, Jr. , David A. Lewis , Jane M. Shaw , Stanley J. Whitehair
发明人： Jerome J. Cuomo , Jeffrey D. Gelorme , Michael Hatzakis, Jr. , David A. Lewis , Jane M. Shaw , Stanley J. Whitehair
IPC分类号： B01J19/12 , C08G73/10 , G01N22/00 , H01L21/312 , H05B6/68 , H05B6/80 , H05K1/03 , H05K3/46
CPC分类号： H05B6/705 , B01J19/126 , C08G73/1025 , G01N22/00 , H05B6/68 , B01J2219/00191 , B01J2219/1215 , H05K1/0346 , H05K3/4644 , Y02B40/143 , Y10T428/31681 , Y10T428/31721
摘要： A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance.The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material.In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction. Processing time has been reduced thirty fold as compared to conventional thermal methods.

4. 发明授权

US5340914A Microwave processing 失效
公开(公告)号：US5340914A
公开(公告)日：1994-08-23
申请号：US78732
申请日：1993-06-16
申请人： Jerome J. Cuomo , Jeffrey D. Gelorme , Michael Hatzakis, Jr. , David A. Lewis , Jane M. Shaw , Stanley J. Whitehair
发明人： Jerome J. Cuomo , Jeffrey D. Gelorme , Michael Hatzakis, Jr. , David A. Lewis , Jane M. Shaw , Stanley J. Whitehair
IPC分类号： B01J19/12 , C08G73/10 , G01N22/00 , H01L21/312 , H05B6/68 , H05B6/80 , H05K1/03 , H05K3/46 , C08F2/46 , C08G69/26
CPC分类号： H05B6/705 , B01J19/126 , C08G73/1025 , G01N22/00 , H05B6/68 , B01J2219/00191 , B01J2219/1215 , H05K1/0346 , H05K3/4644 , Y02B40/143 , Y10T428/31681 , Y10T428/31721
摘要： A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance.The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material.In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction. Processing time has been reduced thirty fold as compared to conventional thermal methods.

5. 发明授权

US5495397A Three dimensional package and architecture for high performance computer 失效
标题翻译：高性能计算机的三维封装和架构
公开(公告)号：US5495397A
公开(公告)日：1996-02-27
申请号：US54110
申请日：1993-04-27
申请人： Evan E. Davidson , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Janusz S. Wilczynski
发明人： Evan E. Davidson , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Janusz S. Wilczynski
IPC分类号： H05K3/36 , H01L25/065 , H05K1/05 , H05K1/14 , H05K3/34 , H05K3/46 , H05K7/14
CPC分类号： H05K3/4641 , H01L25/0652 , H05K1/145 , H01L2224/48091 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H05K1/053 , H05K1/056 , H05K2201/068 , H05K2201/09309 , H05K2201/09718 , H05K3/3436 , H05K3/4608 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926
摘要： A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection members to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection members can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.
摘要翻译：描述了用于最终高性能计算机的三维封装架构及其制造方法。该封装允许非常密集的多个集成电路芯片的封装，以实现计算机的最小通信距离和最大时钟速度。包装结构由多个子组件形成。每个子组件由至少一个侧面上至少有一个集成电路器件的衬底形成。在相邻的子组件之间设置有第二衬底。存在电互连构件以将子组件上的接触位置电互连到第二衬底上的接触位置。电气互连构件可以是焊料堆，引线接合等。第一基板在电子设备和每个子组件之间提供电信号互通。第二基板提供对多个子组件的接地和功率分配。可选地，结构的外表面可以设置成存储芯片的立方体。

6. 发明授权

US5191182A Tuneable apparatus for microwave processing 失效
标题翻译：用于微波处理的调谐装置
公开(公告)号：US5191182A
公开(公告)日：1993-03-02
申请号：US799376
申请日：1991-11-27
申请人： Jeffrey D. Gelorme , David A. Lewis , Jane M. Shaw
发明人： Jeffrey D. Gelorme , David A. Lewis , Jane M. Shaw
IPC分类号： B01J19/12 , C08G73/10 , G01N22/00 , H05B6/68 , H05B6/80 , H05K1/03 , H05K3/46
CPC分类号： H05B6/705 , B01J19/126 , C08G73/1025 , G01N22/00 , H05B6/68 , B01J2219/00191 , H05K1/0346 , H05K3/4644 , Y02B40/143
摘要： Disclosed is a tuneable microwave apparatus useful in carrying out chemical and physical processes on a sample, particularly including polymerization. The apparatus includes a cavity in which the sample is disposed, a microwave supply, microwave power meter and sensor, means for sensing the temperature in the cavity, means for varying the volume of the chamber within the cavity wherein the sample is disposed, means for measuring microwave reflection from the sample, and computer-controlled means operatively associated with the foregoing to vary the microwave power and the size of the chamber. Openings are provided within the chamber to permit removal of vapor generated during expousre of the sample to the microwave radiation.
摘要翻译：公开了可用于对样品进行化学和物理过程的可调谐微波装置，特别是包括聚合。该装置包括其中设置样品的空腔，微波供应，微波功率计和传感器，用于感测空腔中的温度的装置，用于改变腔体内体积的装置，其中设置样品，测量来自样品的微波反射，以及与上述操作相关联的计算机控制装置，以改变微波功率和室的尺寸。在室内提供开口以允许将在样品暴露期间产生的蒸气除去到微波辐射。

7. 发明授权

US5317081A Microwave processing 失效
标题翻译：微波处理
公开(公告)号：US5317081A
公开(公告)日：1994-05-31
申请号：US799378
申请日：1991-11-27
申请人： Jeffrey D. Gelorme , David A. Lewis , Jane M. Shaw
发明人： Jeffrey D. Gelorme , David A. Lewis , Jane M. Shaw
IPC分类号： B01J19/12 , C08G73/10 , G01N22/00 , H01L21/312 , H05B6/68 , H05B6/80 , H05K1/03 , H05K3/46 , C08G69/26 , B05D5/12
CPC分类号： H05B6/705 , B01J19/126 , C08G73/1025 , G01N22/00 , H05B6/68 , B01J2219/00191 , B01J2219/1215 , H05K1/0346 , H05K3/4644 , Y02B40/143 , Y10T428/31681 , Y10T428/31721
摘要： A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance.The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material.In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction. Processing time has been reduced thirty fold as compared to conventional thermal methods.
摘要翻译：公开了一种用于通过将含有挥发性物质的材料暴露于微波辐射进行物理过程和化学反应的方法和装置，其中当暴露于这种辐射时所述材料的形态将改变。随着材料的形态发生变化，随着时间的推移调整所述辐射的功率以最大化辐射的影响，以便在基本上不含所述挥发性物质的最小时间内产生产物。该方法和装置也可用于对不含挥发性物质的材料进行这种处理或反应。在一个实施方案中，公开了一种用于通过在可调谐的微波谐振腔中将前体暴露于微波辐射中的溶剂中的前体制造聚酰亚胺的方法和装置，其在亚胺化期间被调谐以实现系统的临界耦合。控制微波功率以除去溶剂并获得所需的反应水平。与常规热法相比，处理时间减少了三十倍。

8. 发明授权

US5519193A Method and apparatus for stressing, burning in and reducing leakage current of electronic devices using microwave radiation 失效
标题翻译：使用微波辐射强化，燃烧和减少电子设备泄漏电流的方法和装置
公开(公告)号：US5519193A
公开(公告)日：1996-05-21
申请号：US966960
申请日：1992-10-27
申请人： Peter E. Freiermuth , Kathleen S. Ginn , Jeffrey A. Haley , Susan J. Lamaire , David A. Lewis , Gavin T. Mills , Timothy A. Redmond , Yuk L. Tsang , Joseph J. Van Horn , Alfred Viehbeck , George F. Walker , Jer-Ming Yang , Clarence S. Long
发明人： Peter E. Freiermuth , Kathleen S. Ginn , Jeffrey A. Haley , Susan J. Lamaire , David A. Lewis , Gavin T. Mills , Timothy A. Redmond , Yuk L. Tsang , Joseph J. Van Horn , Alfred Viehbeck , George F. Walker , Jer-Ming Yang , Clarence S. Long
IPC分类号： G01R31/26 , G01R31/28 , G01R31/311 , H01L21/265 , H01L21/268 , H01L21/326 , H01L21/329 , H05B6/80
CPC分类号： G01R31/2881 , G01R31/311 , Y10S148/071
摘要： The described invention is directed to microwave methods for burning-in, electrical stressing, thermal stressing and reducing rectifying junction leakage current in fully processed semiconductor chips individually and at wafer level, as well as burning in and stressing semiconductor chip packaging substrates and the combination of a semiconductor chip mounted onto a semiconductor chip packaging substrate. Microwaves burn-in devices in a substantially shorter period of time than conventional burn-in techniques and avoid the need for special workpiece holders which are required by conventional stress and burn-in techniques. Additionally, microwave methods are described for reducing the leakage current of recitfying junctions, such as PN junctions and Schottky barrier diode junctions of semiconductor devices on fully processed semiconductor chips and wafers.
摘要翻译：所描述的发明涉及在半导体芯片单独和晶圆级别的烧结，电应力，热应力和减少整流结漏电流的微波方法，以及对半导体芯片封装衬底的燃烧和应力的组合安装在半导体芯片封装基板上的半导体芯片。微波老化装置在比传统的老化技术更短的时间内，并且避免了对于常规应力和老化技术所要求的特殊工件支架的需要。此外，描述了微波方法，用于减少重新连接的漏电流，例如半导体器件在完全处理的半导体芯片和晶片上的PN结和肖特基势垒二极管接头。

9. 发明授权

US06177975B1 Precision alignment of plates 失效
标题翻译：板的精确对准
公开(公告)号：US06177975B1
公开(公告)日：2001-01-23
申请号：US09559958
申请日：2000-04-27
申请人： Stephen L. Buchwalter , David A. Lewis , Shui-Chih Alan Lien , Sampath Purushothaman , John J. Ritsko
发明人： Stephen L. Buchwalter , David A. Lewis , Shui-Chih Alan Lien , Sampath Purushothaman , John J. Ritsko
IPC分类号： G02F113
CPC分类号： G02F1/1333 , G02F2001/133354
摘要： A system for aligning two plates, in accordance with the present invention, includes a first plate having a lithographically patterned structure formed on a first surface. A second plate also has a lithographically patterned structure formed on a second surface, the first and second surfaces being disposed to face each other. The patterned structures of the plates have corresponding and opposing edges to provide an interference fit between the patterned structures of the first and second plates wherein self-alignment between the first and second plates is realized by engaging the corresponding and opposing edges in the interference fit. A method for aligning two plates includes the steps of providing the system described above, coarsely aligning the plates in a first state which includes an interference between the patterned structures, adjusting at least one of plates to provide a second state having a clearance fit between the patterned structures and moving the plates together and returning to the first state to align the plates relative to each other.
摘要翻译：根据本发明的用于对准两个板的系统包括形成在第一表面上的具有光刻图案化结构的第一板。第二板还具有形成在第二表面上的光刻图案结构，第一和第二表面被设置为彼此面对。板的图案化结构具有对应的和相对的边缘，以在第一和第二板的图案化结构之间提供过盈配合，其中第一和第二板之间的自对准是通过在干涉配合中接合相应和相对的边缘来实现的。一种用于对准两个板的方法包括以下步骤：提供上述系统，在第一状态下将板粗略对准，该第一状态包括图案化结构之间的干涉，调节板中的至少一个以提供第二状态，图案化结构并将板移动到一起并返回到第一状态以使板相对于彼此对准。

10. 发明授权

US5790406A Hierarchical system of the simple modification of process steps for a manufacturing tool 失效
标题翻译：制造工具的工艺步骤的简单修改的分层系统
公开(公告)号：US5790406A
公开(公告)日：1998-08-04
申请号：US546364
申请日：1995-10-20
申请人： John P. Dunn , David A. Lewis
发明人： John P. Dunn , David A. Lewis
IPC分类号： G05B19/418 , G06F9/00 , G06F11/00
CPC分类号： G05B19/41835 , Y02P90/12 , Y02P90/26
摘要： A system and method for controlling an apparatus, in particular an apparatus for performing manufacturing operations on a work piece is described. The system uses a hierarchical series of levels of functional operations. The system has a highest level and a series of lower levels. There is a means for initiating an instruction in the highest level which results in executing of instructions in the series of lower levels until an instruction is executed to control the apparatus. A particular example consists of four levels all written as sample programming language files which are fully editable and modifiable by end users: A manufacturing operations consists of a cell or cluster of manufacturing the operations of which are controlled by the system of the invention which enables on-line tool diagnostics and simulations that can predict the effects of proposed process changes, thereby reducing the time normally required to make alterations to a process.
摘要翻译：描述了用于控制装置的系统和方法，特别是用于在工件上执行制造操作的装置。该系统使用层次化的功能操作级别。该系统具有最高级别和一系列较低级别。存在用于启动最高级别的指令的装置，其导致执行下一系列级别的指令，直到执行指令以控制该装置。一个特定的例子包括四个层次，所有这些层面都是作为最终用户完全可编辑和修改的示例编程语言文件编写的：制造操作包括由本发明的系统控制的制造单元或集群，可以预测所提出的过程变化的影响的线工具诊断和模拟，从而减少对过程进行更改所需的时间。

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