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    • 1. 发明授权
    • High-voltage CMOS level shifter
    • 高压CMOS电平转换器
    • US5821800A
    • 1998-10-13
    • US799074
    • 1997-02-11
    • Binh Quang LeShoichi KawamuraPau-Ling ChenShane Hollmer
    • Binh Quang LeShoichi KawamuraPau-Ling ChenShane Hollmer
    • H03K5/02H03K3/356H03K17/10H03K19/0185H03K1/175H03K19/003
    • H03K17/102H03K3/356113
    • A high-voltage level shifter includes one or more complementary NMOS/PMOS series intermediate transistor pairs to divide the high-voltage supply range into two or more sub-ranges. The level shifter has a differential structure with complementary NMOS input transistors. Cross-coupled PMOS output transistors provide complementary outputs. The complementary NMOS/PMOS series intermediate transistor pairs separate the NMOS input transistor drains from the PMOS output transistor drains. In order to divide the high voltage range into h subranges, h-1 complementary NMOS/PMOS series intermediate transistor pairs are used each being biased by monotonically increasing fixed intermediate voltages. In a shared-bias embodiment, each complementary NMOS/PMOS series intermediate transistor pair is biased by a single corresponding intermediate voltage. In a split-bias embodiment, each complementary NMOS/PMOS series intermediate transistor pair is biased by a corresponding NMOS bias voltage and a corresponding PMOS bias voltage, in which the NMOS bias voltage is higher than the PMOS bias voltage by the sum or the NMOS threshold voltage and the PMOS threshold voltage. In another aspect, the N-wells of the PMOS transistors are tied to an upwardly vertically adjacent intermediate voltage in the shared-bias embodiments, and are tied to an upwardly vertically adjacent NMOS bias voltage in the split-bias embodiments. In a twin tub embodiment for very high voltage applications, the P-wells of the NMOS transistors are tied to a downwardly vertically adjacent intermediate voltage in the shared-bias embodiments, and are tied to a downwardly vertically adjacent PMOS bias voltage for the split-bias embodiments.
    • 高电压电平移位器包括一个或多个互补的NMOS / PMOS串联中间晶体管对,以将高电压电源范围分成两个或更多个子范围。 电平移位器具有互补NMOS输入晶体管的差分结构。 交叉耦合PMOS输出晶体管提供互补输出。 互补的NMOS / PMOS系列中间晶体管对将NMOS输入晶体管漏极与PMOS输出晶体管漏极分离。 为了将高电压范围划分为h个子范围,使用h-1互补的NMOS / PMOS系列中间晶体管对,通过单调增加固定中间电压来偏置。 在共享偏置实施例中,每个互补NMOS / PMOS系列中间晶体管对由单个对应的中间电压偏置。 在分离偏置实施例中,每个互补NMOS / PMOS串联中间晶体管对由相应的NMOS偏置电压和相应的PMOS偏置电压偏置,其中NMOS偏置电压高于PMOS偏置电压乘以和或NMOS 阈值电压和PMOS阈值电压。 在另一方面,PMOS晶体管的N阱在共享偏压实施例中被连接到向上垂直相邻的中间电压,并且在分离偏压实施例中被连接到向上垂直相邻的NMOS偏置电压。 在用于非常高电压应用的双槽实施例中,NMOS晶体管的P阱在共享偏压实施例中被连接到向下垂直相邻的中间电压,并且被连接到向下垂直相邻的PMOS偏置电压, 偏压实施例。
    • 2. 发明授权
    • High voltage NMOS pass gate for integrated circuit with high voltage
generator
    • 高电压NMOS栅极,用于集成电路与高压发生器
    • US5801579A
    • 1998-09-01
    • US808237
    • 1997-02-28
    • Binh Quang LePau-Ling ChenShane HollmerShoichi KawamuraMichael ChungVincent LeungMasaru Yano
    • Binh Quang LePau-Ling ChenShane HollmerShoichi KawamuraMichael ChungVincent LeungMasaru Yano
    • G11C8/08G11C16/12G05F1/10
    • G11C16/12G11C8/08
    • Two NMOS boost transistors have their sources connected to the high voltage input while their drains and gates are cross-connected. Two coupling capacitors connect two alternate phase clocks to the gates of the two cross-connected boost transistors. An NMOS pass transistor has its gate connected to the drain of one of the NMOS boost transistors, its source connected to the high voltage input, and its drain connected to the output. In an embodiment, two diode-connected regulation transistors connect the gates of the boost transistors to the high voltage input. These connections insure that the gates of the boost transistors and the gate of the pass transistor never reach voltages higher than one threshold voltage above the high voltage input. In another embodiment, two discharge transistors have their drains connected to a decode input, their sources connected to the gates of the boost transistors, and their gates connected to the positive power supply. By setting the decode input at zero volts, the voltages at the gates of the boost transistors and of the pass transistor are held at zero volts, thus disabling them. In the preferred embodiment, both the regulation transistors and the discharge transistors are included in the high voltage pass gate.
    • 两个NMOS升压晶体管的源极连接到高压输入端,而它们的漏极和栅极交叉连接。 两个耦合电容器将两个交替相位时钟连接到两个交叉连接的升压晶体管的栅极。 NMOS传输晶体管的栅极连接到一个NMOS升压晶体管的漏极,其源极连接到高压输入,其漏极连接到输出。 在一个实施例中,两个二极管连接的调节晶体管将升压晶体管的栅极连接到高电压输入。 这些连接确保升压晶体管的栅极和传输晶体管的栅极不会达到高于高电压输入以上的一个阈值电压的电压。 在另一个实施例中,两个放电晶体管的漏极连接到解码输入,其源极连接到升压晶体管的栅极,并且其栅极连接到正电源。 通过将解码输入设置为零伏特,升压晶体管和传输晶体管的栅极处的电压保持在零伏特,从而禁止它们。 在优选实施例中,调节晶体管和放电晶体管都包括在高压通栅中。
    • 5. 发明授权
    • High voltage NMOS pass gate for integrated circuit with high voltage
generator and flash non-volatile memory device having the pass gate
    • 具有高电压发生器的集成电路的高电压NMOS通过栅极和具有通过栅极的闪存非易失性存储器件
    • US5852576A
    • 1998-12-22
    • US944904
    • 1997-10-06
    • Binh Quang LePau-Ling ChenShane Charles HollmerShoichi KawamuraMichael Shingche ChungVincent C. LeungMasaru Yano
    • Binh Quang LePau-Ling ChenShane Charles HollmerShoichi KawamuraMichael Shingche ChungVincent C. LeungMasaru Yano
    • G11C16/06G11C8/08G11C16/12G11C13/00
    • G11C16/12G11C8/08
    • Two NMOS boost transistors have their sources connected to the high voltage input while their drains and gates are cross-connected. Two coupling capacitors connect two alternate phase clocks to the gates of the two cross-connected boost transistors. An NMOS pass transistor has its gate connected to the drain of one of the NMOS boost transistors, its source connected to the high voltage input, and its drain connected to the output. In an embodiment, two diode-connected regulation transistors connect the gates of the boost transistors to the high voltage input. These connections insure that the gates of the boost transistors and the gate of the pass transistor never reach voltages higher than one threshold voltage above the high voltage input. In another embodiment, two discharge transistors have their drains connected to a decode input, their sources connected to the gates of the boost transistors, and their gates connected to the positive power supply. By setting the decode input at zero volts, the voltages at the gates of the boost transistors and of the pass transistor are held at zero volts, thus disabling them. In the preferred embodiment, both the regulation transistors and the discharge transistors are included in the high voltage pass gate.
    • 两个NMOS升压晶体管的源极连接到高压输入端,而它们的漏极和栅极交叉连接。 两个耦合电容器将两个交替相位时钟连接到两个交叉连接的升压晶体管的栅极。 NMOS传输晶体管的栅极连接到一个NMOS升压晶体管的漏极,其源极连接到高压输入,其漏极连接到输出。 在一个实施例中,两个二极管连接的调节晶体管将升压晶体管的栅极连接到高电压输入。 这些连接确保升压晶体管的栅极和传输晶体管的栅极不会达到高于高电压输入以上的一个阈值电压的电压。 在另一个实施例中,两个放电晶体管的漏极连接到解码输入,其源极连接到升压晶体管的栅极,并且其栅极连接到正电源。 通过将解码输入设置为零伏特,升压晶体管和传输晶体管的栅极处的电压保持在零伏特,从而禁止它们。 在优选实施例中,调节晶体管和放电晶体管都包括在高压通栅中。
    • 7. 发明授权
    • Dual source side polysilicon select gate structure and programming method utilizing single tunnel oxide for nand array flash memory
    • 双源多晶硅选择门结构和编程方法,利用单隧道氧化物进行阵列闪存存储
    • US06266275B1
    • 2001-07-24
    • US09410512
    • 1999-09-30
    • Paul-Ling ChenMike Van BuskirkShane Charles HollmerBinh Quang LeShoichi KawamuraChung-You HuYu SunSameer HaddadChi Chang
    • Paul-Ling ChenMike Van BuskirkShane Charles HollmerBinh Quang LeShoichi KawamuraChung-You HuYu SunSameer HaddadChi Chang
    • G11C700
    • G11C16/0483
    • A series select transistor and a source select transistor are connected in series at the end of a NAND string of floating gate data storage transistors. The floating gates, the series select gate, and the source select gate are all preferably formed of polysilicon. The same tunnel oxide layer is used as gate oxide for the series select transistor and source select transistor as well as for the floating gate data storage transistors. Two layers of polysilicon in the series select gate and the source select gates are tied together. The series select transistor is tied to the last transistor in the NAND string. The source select transistor is tied to the array Vss supply. In order to program inhibit a specific NAND cell during the programming of another NAND cell, the gate of the series select transistor is raised to Vcc, while the gate of the source select transistor is held to ground. The two transistors in series are able to withstand a much higher voltage at the end of the NAND string without causing gated-diode junction or oxide breakdown in either the series or the source select transistor.
    • 串联选择晶体管和源选择晶体管串联连接在浮动数据存储晶体管的NAND串的末端。 浮置栅极,串联选择栅极和源选择栅极都优选由多晶硅形成。 相同的隧道氧化物层用作串联选择晶体管和源极选择晶体管以及浮动栅极数据存储晶体管的栅极氧化物。 串联选择栅极和源极选择栅极中的两层多晶硅结合在一起。 串联选择晶体管连接到NAND串中的最后一个晶体管。 源选择晶体管连接到阵列Vss电源。 为了在另一NAND单元的编程期间编程禁止特定NAND单元,串联选择晶体管的栅极升高到Vcc,同时源极选择晶体管的栅极保持接地。 串联的两个晶体管能够在NAND串的末端承受高得多的电压,而不会在串联或源极选择晶体管中产生门极二极管结或氧化物击穿。
    • 8. 发明授权
    • Nonvolatile memory device
    • 非易失性存储器件
    • US08040730B2
    • 2011-10-18
    • US12625723
    • 2009-11-25
    • Masahito TakeharaShoichi Kawamura
    • Masahito TakeharaShoichi Kawamura
    • G11C11/34G11C16/04
    • G11C16/10G11C11/5628G11C16/3454G11C2211/5621
    • A nonvolatile semiconductor memory device includes a memory cell array and a control circuit configured to control reading and programming operations for reading data from and inputting data to the memory cell array, respectively. The control circuit includes first and second units. The first unit is configured to count a number of bits having logic 0 or a number of bits having logic 1, to set a logic where the counted number is greater than n/2 as an initial state to regenerate programming data, and to perform a programming operation based on the regenerated data, when simultaneously programming the programming data of n bits input for a designated address. The second unit is configured to program a recognition bit for recognizing which of the logic 0 and the logic 1 the initial state of the memory cell of the designated address is in, when the programming operation is performed.
    • 非易失性半导体存储器件包括存储单元阵列和控制电路,该控制电路被配置为分别控制从存储单元阵列读取数据和向存储单元阵列输入数据的读取和编程操作。 控制电路包括第一和第二单元。 第一单元被配置为对具有逻辑0或具有逻辑1的位数的位数进行计数,以将计数数大于n / 2的逻辑设置为初始状态,以重新生成编程数据,并且执行 当对指定地址进行n位输入的编程数据同时编程时,基于再生数据进行编程操作。 第二单元被配置为在执行编程操作时对识别位进行编程以识别逻辑0和逻辑1中的哪一个指定地址的存储单元的初始状态。
    • 9. 发明申请
    • NONVOLATILE MEMORY DEVICE
    • 非易失性存储器件
    • US20100135081A1
    • 2010-06-03
    • US12625723
    • 2009-11-25
    • Shoichi KawamuraMasahito Takehara
    • Shoichi KawamuraMasahito Takehara
    • G11C7/00G11C16/10G11C16/26
    • G11C16/10G11C11/5628G11C16/3454G11C2211/5621
    • A nonvolatile semiconductor memory device includes a memory cell array and a control circuit configured to control reading and programming operations for reading data from and inputting data to the memory cell array, respectively. The control circuit includes first and second units. The first unit is configured to count a number of bits having logic 0 or a number of bits having logic 1, to set a logic where the counted number is greater than n/2 as an initial state to regenerate programming data, and to perform a programming operation based on the regenerated data, when simultaneously programming the programming data of n bits input for a designated address. The second unit is configured to program a recognition bit for recognizing which of the logic 0 and the logic 1 the initial state of the memory cell of the designated address is in, when the programming operation is performed.
    • 非易失性半导体存储器件包括存储单元阵列和控制电路,该控制电路被配置为分别控制从存储单元阵列读取数据和向存储单元阵列输入数据的读取和编程操作。 控制电路包括第一和第二单元。 第一单元被配置为对具有逻辑0或具有逻辑1的位数的位数进行计数,以将计数数大于n / 2的逻辑设置为初始状态,以重新生成编程数据,并且执行 当对指定地址进行n位输入的编程数据同时编程时,基于再生数据进行编程操作。 第二单元被配置为在执行编程操作时对识别位进行编程以识别逻辑0和逻辑1中的哪一个指定地址的存储单元的初始状态。