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    • 5. 发明申请
    • METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING LAYERS
    • 制造化学机械抛光层的方法
    • US20150231758A1
    • 2015-08-20
    • US14184286
    • 2014-02-19
    • Rohm and Haas Electronic Materials CMP Holdings, Inc.
    • George McClainAlan SaikinDavid KolesarAaron SarafinasRobert L. Post
    • B24B37/24B24D3/32B24D18/00
    • B24B37/24B24D3/32B24D18/0009
    • A method of making a polishing layer for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided, comprising: providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a carbon dioxide atmosphere for an exposure period to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin ≦24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.
    • 提供了制造用于抛光选自磁性基板,光学基板和半导体基板中的至少一个的基板的抛光层的方法,包括:提供液体预聚物材料; 提供多个中空微球; 将多个中空微球暴露于二氧化碳气氛中曝光期以形成多个经处理的中空微球; 将液体预聚物材料与多个经处理的中空微球组合以形成可固化混合物; 允许可固化混合物经历反应以形成固化材料,其中允许反应在形成多个处理的中空微球后24小时开始; 并从所述固化材料得到至少一个抛光层; 其中所述至少一个抛光层具有适于抛光所述基底的抛光表面。