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    • 1. 发明授权
    • Stress-generating structure for semiconductor-on-insulator devices
    • 绝缘体上半导体器件的应力产生结构
    • US08629501B2
    • 2014-01-14
    • US13370898
    • 2012-02-10
    • Huilong ZhuBrian J. GreeneDureseti ChidambarraoGregory G. Freeman
    • Huilong ZhuBrian J. GreeneDureseti ChidambarraoGregory G. Freeman
    • H01L27/12
    • H01L29/0603H01L21/76224H01L29/1025H01L29/1054H01L29/84
    • A stack pad layers including a first pad oxide layer, a pad nitride layer, and a second pad oxide layer are formed on a semiconductor-on-insulator (SOI) substrate. A deep trench extending below a top surface or a bottom surface of a buried insulator layer of the SOI substrate and enclosing at least one top semiconductor region is formed by lithographic methods and etching. A stress-generating insulator material is deposited in the deep trench and recessed below a top surface of the SOI substrate to form a stress-generating buried insulator plug in the deep trench. A silicon oxide material is deposited in the deep trench, planarized, and recessed. The stack of pad layer is removed to expose substantially coplanar top surfaces of the top semiconductor layer and of silicon oxide plugs. The stress-generating buried insulator plug encloses, and generates a stress to, the at least one top semiconductor region.
    • 在绝缘体上半导体(SOI)基板上形成包括第一衬垫氧化物层,衬垫氮化物层和第二焊盘氧化物层的叠层焊盘层。 通过光刻方法和蚀刻形成在SOI衬底的掩埋绝缘体层的顶表面或底表面之下延伸并包围至少一个顶部半导体区域的深沟槽。 应力产生绝缘体材料沉积在深沟槽中并凹陷在SOI衬底的顶表面下方,以在深沟槽中形成应力产生的埋入绝缘体插头。 氧化硅材料沉积在深沟槽中,平坦化和凹陷。 去除衬垫层的堆以暴露顶部半导体层和氧化硅插塞的基本上共面的顶表面。 应力产生埋层绝缘体塞封闭并产生至少一个顶部半导体区域的应力。
    • 2. 发明申请
    • METHOD OF CREATING ASYMMETRIC FIELD-EFFECT-TRANSISTORS
    • 创建不对称场效应晶体管的方法
    • US20100330763A1
    • 2010-12-30
    • US12493549
    • 2009-06-29
    • Gregory G. FreemanShreesh NarasimhaNing SuHasan M. NayfehNivo RovedoWerner A. RauschJian Yu
    • Gregory G. FreemanShreesh NarasimhaNing SuHasan M. NayfehNivo RovedoWerner A. RauschJian Yu
    • H01L21/336
    • H01L21/823425H01L21/26586H01L21/823412H01L29/66492H01L29/66659
    • The present invention provides a method of forming asymmetric field-effect-transistors. The method includes forming at least a first and a second gate-mask stack on top of a semiconductor substrate, wherein the first and second gate-mask stacks include at least, respectively, a first and a second gate conductor of a first and a second transistor and have, respectively, a top surface, a first side, and a second side with the second side being opposite to the first side; performing a first halo implantation from the first side of the first and second gate-mask stacks at a first angle while applying the first gate-mask stack in preventing the first halo implantation from reaching a first source/drain region of the second transistor, wherein the first angle is equal to or larger than a predetermined value; and performing a second halo implantation from the second side of the first and second gate-mask stacks at a second angle, thereby creating halo implant in a second source/drain region of the second transistor, wherein the first and second angles are measured against a normal to the substrate.
    • 本发明提供了形成非对称场效应晶体管的方法。 该方法包括在半导体衬底的顶部上形成至少第一和第二栅极掩模叠层,其中第一和第二栅极掩模叠层至少分别包括第一和第二栅极掩模叠层的第一和第二栅极导体 分别具有顶表面,第一侧和第二侧,第二侧与第一侧相对; 以第一角度从第一和第二栅极掩模叠层的第一侧进行第一光晕注入,同时施加第一栅极掩模叠层以防止第一光晕注入到达第二晶体管的第一源极/漏极区域,其中 第一角度等于或大于预定值; 以及以第二角度从所述第一和第二栅极掩模叠层的第二侧执行第二光晕注入,从而在所述第二晶体管的第二源极/漏极区域中产生晕轮注入,其中所述第一和第二角度是针对 与基底垂直。
    • 4. 发明授权
    • Bipolar transistor self-alignment with raised extrinsic base extension and methods of forming same
    • 双极晶体管自对准具有凸起的外在基极延伸及其形成方法
    • US07611954B2
    • 2009-11-03
    • US11150894
    • 2005-06-13
    • Gregory G. FreemanMarwan H. KhaterFrancois Pagette
    • Gregory G. FreemanMarwan H. KhaterFrancois Pagette
    • H01L21/8222
    • H01L29/66287H01L29/1004H01L29/732
    • A self-aligned bipolar transistor structure having a raised extrinsic base comprising an outer region and an inner region of different doping concentrations and methods of fabricating the transistor are disclosed. More specifically, the self-alignment of the extrinsic base to the emitter is accomplished by forming the extrinsic base in two regions. First, a first material of silicon or polysilicon having a first doping concentration is provided to form an outer extrinsic base region. Then a first opening is formed in the first material layer by lithography within which a dummy emitter pedestal is formed, which results in forming a trench between the sidewall of the first opening and the dummy pedestal. A second material of a second doping concentration is then provided inside the trench forming a distinct inner extrinsic base extension region to self-align the raised extrinsic base edge to the dummy pedestal edge. Since the emitter is formed where the dummy pedestal existed, the extrinsic base is also self-aligned to the emitter. The silicon or polysilicon forming the inner extrinsic base extension region can also be grown in the trench with selective or non-selective epitaxy.
    • 公开了具有包括外部区域和不同掺杂浓度的内部区域的升高的外部基极的自对准双极晶体管结构和制造晶体管的方法。 更具体地说,外部碱基与发射体的自对准是通过在两个区域中形成外部碱基来实现的。 首先,提供具有第一掺杂浓度的硅或多晶硅的第一材料以形成外部外在基极区域。 然后通过光刻形成在第一材料层中的第一开口,在该第一材料层内形成有虚拟发射极基座,这导致在第一开口的侧壁和虚拟基座之间形成沟槽。 然后在沟槽的内部提供第二掺杂浓度的第二材料,形成不同的内部非本征基本延伸区域,以将凸起的本征基底边缘自对准到虚拟基座边缘。 由于发射极形成在存在虚拟基座的位置,所以外部基极也与发射极自对准。 形成内部非本征基极延伸区域的硅或多晶硅也可以在具有选择性或非选择性外延的沟槽中生长。
    • 6. 发明授权
    • Bipolar transistor self-alignment with raised extrinsic base extension and methods of forming same
    • 双极晶体管自对准具有凸起的外在基极延伸及其形成方法
    • US06960820B2
    • 2005-11-01
    • US10604212
    • 2003-07-01
    • Gregory G. FreemanMarwan H. KhaterFrancois Pagette
    • Gregory G. FreemanMarwan H. KhaterFrancois Pagette
    • H01L29/737H01L21/331H01L21/8222H01L29/10H01L29/732H01L27/082H01L27/102H01L29/70H01L31/11
    • H01L29/66287H01L29/1004H01L29/732
    • A self-aligned bipolar transistor structure having a raised extrinsic base comprising an outer region and an inner region of different doping concentrations and methods of fabricating the transistor are disclosed. More specifically, the self-alignment of the extrinsic base to the emitter is accomplished by forming the extrinsic base in two regions. First, a first material of silicon or polysilicon having a first doping concentration is provided to form an outer extrinsic base region. Then a first opening is formed in the first material layer by lithography within which a dummy emitter pedestal is formed, which results in forming a trench between the sidewall of the first opening and the dummy pedestal. A second material of a second doping concentration is then provided inside the trench forming a distinct inner extrinsic base extension region to self-align the raised extrinsic base edge to the dummy pedestal edge. Since the emitter is formed where the dummy pedestal existed, the extrinsic base is also self-aligned to the emitter. The silicon or polysilicon forming the inner extrinsic base extension region can also be grown in the trench with selective or non-selective epitaxy.
    • 公开了具有包括外部区域和不同掺杂浓度的内部区域的升高的外部基极的自对准双极晶体管结构和制造晶体管的方法。 更具体地说,外部碱基与发射体的自对准是通过在两个区域中形成外部碱基来实现的。 首先,提供具有第一掺杂浓度的硅或多晶硅的第一材料以形成外部外在基极区域。 然后通过光刻形成在第一材料层中的第一开口,在该第一材料层内形成有虚拟发射极基座,这导致在第一开口的侧壁和虚拟基座之间形成沟槽。 然后在沟槽内部设置第二掺杂浓度的第二材料,形成不同的内部非本征基本延伸区域,以将凸起的本征基底边缘自对准到虚拟基座边缘。 由于发射极形成在存在虚拟基座的位置,所以外部基极也与发射极自对准。 形成内部非本征基极延伸区域的硅或多晶硅也可以在具有选择性或非选择性外延的沟槽中生长。