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    • 1. 发明授权
    • Transistor structure with minimized parasitics and method of fabricating the same
    • 具有最小化寄生效应的晶体管结构及其制造方法
    • US07642569B2
    • 2010-01-05
    • US12366425
    • 2009-02-05
    • David R. GreenbergShwu-Jen Jeng
    • David R. GreenbergShwu-Jen Jeng
    • H01L29/737
    • H01L29/66287H01L29/0804H01L29/0821H01L29/42308H01L29/66242H01L29/732H01L29/7378
    • A transistor having minimized parasitics is provided including an emitter having a recessed extrinsic emitter portion atop an intrinsic emitter portion; a base including an intrinsic base portion in electrical contact with the intrinsic emitter portion and an extrinsic base portion in electrical contact with the intrinsic base portion and electrically isolated from the recessed extrinsic emitter portion by a set of emitter/base spacers; and a collector in electrical contact with the intrinsic base portion. The transistor may further include extrinsic base having top surfaces entirely silicided to the emitter/base spacer. Additionally, the transistor may include a base window opening within the transistor's active area. Methods of forming the above-described transistor are also provided.
    • 提供了具有最小化寄生效应的晶体管,其包括在本征发射极部分顶部具有凹入的非本征发射极部分的发射极; 包括与本征发射极部分电接触的本征基极部分的基极和与本征基极部分电接触并且通过一组发射极/基底间隔物与凹入的非本征发射极部分电隔离的非本征基极部分; 以及与本征基部电接触的集电体。 晶体管可以进一步包括具有完全硅化到发射极/基极间隔物的顶表面的外在基极。 另外,晶体管可以包括在晶体管的有效区域内的基极窗口。 还提供了形成上述晶体管的方法。
    • 4. 发明授权
    • Transistor structure with minimized parasitics and method of fabricating the same
    • 具有最小化寄生效应的晶体管结构及其制造方法
    • US07491617B2
    • 2009-02-17
    • US11764388
    • 2007-06-18
    • David R. GreenbergShwu-Jen Jeng
    • David R. GreenbergShwu-Jen Jeng
    • H01L21/331
    • H01L29/66287H01L29/0804H01L29/0821H01L29/42308H01L29/66242H01L29/732H01L29/7378
    • A transistor having minimized parasitics is provided including an emitter having a recessed extrinsic emitter portion atop an intrinsic emitter portion; a base including an intrinsic base portion in electrical contact with the intrinsic emitter portion and an extrinsic base portion in electrical contact with the intrinsic base portion and electrically isolated from the recessed extrinsic emitter portion by a set of emitter/base spacers; and a collector in electrical contact with the intrinsic base portion. The transistor may further include extrinsic base having top surfaces entirely silicided to the emitter/base spacer. Additionally, the transistor may include a base window opening within the transistor's active area. Methods of forming the above-described transistor are also provided.
    • 提供了具有最小化寄生效应的晶体管,其包括在本征发射极部分顶部具有凹入的非本征发射极部分的发射极; 包括与本征发射极部分电接触的本征基极部分的基部和与本征基极部分电接触并且通过一组发射极/基底间隔物与凹入的非本征发射极部分电隔离的非本征基极部分; 以及与本征基部电接触的集电体。 晶体管可以进一步包括具有完全硅化到发射极/基极间隔物的顶表面的外在基极。 另外,晶体管可以包括在晶体管的有效区域内的基极窗口。 还提供了形成上述晶体管的方法。
    • 6. 发明授权
    • Transistor structure with minimized parasitics and method of fabricating the same
    • 具有最小化寄生效应的晶体管结构及其制造方法
    • US07253070B2
    • 2007-08-07
    • US11481070
    • 2006-07-05
    • David R. GreenbergShwu-Jen Jeng
    • David R. GreenbergShwu-Jen Jeng
    • H01L21/8222
    • H01L29/66287H01L29/0804H01L29/0821H01L29/42308H01L29/66242H01L29/732H01L29/7378
    • A transistor having minimized parasitics is provided including an emitter having a recessed extrinsic emitter portion atop an intrinsic emitter portion; a base including an intrinsic base portion in electrical contact with the intrinsic emitter portion and an extrinsic base portion in electrical contact with the intrinsic base portion and electrically isolated from the recessed extrinsic emitter portion by a set of emitter/base spacers; and a collector in electrical contact with the intrinsic base portion. The transistor may further include extrinsic base having top surfaces entirely silicided to the emitter/base spacer. Additionally, the transistor may include a base window opening within the transistor's active area. Methods of forming the above-described transistor are also provided.
    • 提供了具有最小化寄生效应的晶体管,其包括在本征发射极部分顶部具有凹入的非本征发射极部分的发射极; 包括与本征发射极部分电接触的本征基极部分的基部和与本征基极部分电接触并且通过一组发射极/基底间隔物与凹入的非本征发射极部分电隔离的非本征基极部分; 以及与本征基部电接触的集电体。 晶体管可以进一步包括具有完全硅化到发射极/基极间隔物的顶表面的外在基极。 另外,晶体管可以包括在晶体管的有效区域内的基极窗口。 还提供了形成上述晶体管的方法。
    • 9. 发明授权
    • Supersonic molecular beam etching of surfaces
    • 表面超音速分子束蚀刻
    • US5423940A
    • 1995-06-13
    • US114710
    • 1993-08-31
    • Lee ChenShwu-Jen JengWesley C. NatzleChienfan Yu
    • Lee ChenShwu-Jen JengWesley C. NatzleChienfan Yu
    • C23F4/02C23F4/00H01L21/302H01L21/311H01J21/00
    • H01L21/31116C23F4/00
    • In supersonic molecular beam etching, the reactivity of the etchant gas and substrate surface is improved by creating etchant gas molecules with high internal energies through chemical reactions of precursor molecules, forming clusters of etchant gas molecules in a reaction chamber, expanding the etchant gas molecules and clusters of etchant gas molecules through a nozzle into a vacuum, and directing the molecules and clusters of molecules onto a substrate. Translational energy of the molecules and clusters of molecules can be improved by seeding with inert gas molecules. The process provides improved controllability, surface purity, etch selectivity and anisotropy. Etchant molecules may also be expanded directly (without reaction in a chamber) to produce clusters whose translational energy can be increased through expansion with a seeding gas.
    • 在超音速分子束蚀刻中,蚀刻剂气体和衬底表面的反应性通过通过前体分子的化学反应产生具有高内能的蚀刻剂气体分子来改善,在反应室中形成蚀刻剂气体分子簇,使蚀刻剂气体分子膨胀, 蚀刻剂气体分子的簇通过喷嘴进入真空,并将分子和分子簇引导到基底上。 可以通过用惰性气体分子进行接种来改善分子和分子团簇的平移能。 该方法提供改进的可控性,表面纯度,蚀刻选择性和各向异性。 蚀刻剂分子也可以直接扩增(在室中没有反应)以产生其平移能量可以通过用接种气体膨胀而增加的簇。