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1. 发明授权

US09184301B2 Planar and nanowire field effect transistors 有权
标题翻译：平面和纳米线场效应晶体管
公开(公告)号：US09184301B2
公开(公告)日：2015-11-10
申请号：US13600598
申请日：2012-08-31
申请人： Sarunya Bangsaruntip , Guy M. Cohen , Shreesh Narasimha , Jeffrey W. Sleight
发明人： Sarunya Bangsaruntip , Guy M. Cohen , Shreesh Narasimha , Jeffrey W. Sleight
IPC分类号： H01L29/66 , H01L29/786 , B82Y10/00 , B82Y40/00 , H01L21/84 , H01L27/12 , H01L29/06 , H01L29/423
CPC分类号： H01L29/78696 , B82Y10/00 , B82Y40/00 , H01L21/84 , H01L27/1203 , H01L29/0665 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/66469 , H01L29/66772
摘要： An integrated circuit includes a plurality of gate-all-around (GAA) nanowire field effect transistors (FETs), a plurality of omega-gate nanowire FETs, and a plurality of planar channel FETs, wherein the plurality of GAA FETs, the plurality of omega-gate nanowire FETs, and the plurality of planar channel FETs are disposed on a single wafer.
摘要翻译：集成电路包括多个栅极全能（GAA）纳米线场效应晶体管（FET），多个Ω-栅极纳米线FET和多个平面沟道FET，其中多个GAA FET，多个 ω-门纳米线FET，并且多个平面沟道FET设置在单个晶片上。

2. 发明申请

US20130221328A1 Pad-Less Gate-All Around Semiconductor Nanowire FETs On Bulk Semiconductor Wafers 有权
标题翻译：无衬底栅极 - 全周围半导体纳米线FET在散装半导体晶片上
公开(公告)号：US20130221328A1
公开(公告)日：2013-08-29
申请号：US13405732
申请日：2012-02-27
申请人： Jeffrey W. Sleight , Josephine B. Chang , Isaac Lauer , Shreesh Narasimha
发明人： Jeffrey W. Sleight , Josephine B. Chang , Isaac Lauer , Shreesh Narasimha
IPC分类号： H01L29/775 , H01L21/335
CPC分类号： H01L29/66477 , B82Y10/00 , B82Y40/00 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/775 , H01L29/78696 , Y10S977/762
摘要： A method for forming a nanowire field effect transistor (FET) device, the method includes forming a suspended nanowire over a semiconductor substrate, forming a gate structure around a portion of the nanowire, forming a protective spacer adjacent to sidewalls of the gate and around portions of nanowire extending from the gate, removing exposed portions of the nanowire left unprotected by the spacer structure, and epitaxially growing a doped semiconductor material on exposed cross sections of the nanowire to form a source region and a drain region.
摘要翻译：一种用于形成纳米线场效应晶体管（FET）器件的方法，该方法包括在半导体衬底上形成悬浮的纳米线，在纳米线的一部分周围形成栅极结构，形成邻近栅极的侧壁和周围部分的保护隔离层的纳米线从栅极延伸，去除未被间隔物结构保护的纳米线的暴露部分，以及在纳米线的暴露的横截面上外延生长掺杂的半导体材料，以形成源极区域和漏极区域。

3. 发明申请

US20120319084A1 PLANAR AND NANOWIRE FIELD EFFECT TRANSISTORS 有权
标题翻译：平面和纳米级场效应晶体管
公开(公告)号：US20120319084A1
公开(公告)日：2012-12-20
申请号：US13600598
申请日：2012-08-31
申请人： Sarunya Bangsaruntip , Guy M. Cohen , Shreesh Narasimha , Jeffrey W. Sleight
发明人： Sarunya Bangsaruntip , Guy M. Cohen , Shreesh Narasimha , Jeffrey W. Sleight
IPC分类号： H01L27/088
CPC分类号： H01L29/78696 , B82Y10/00 , B82Y40/00 , H01L21/84 , H01L27/1203 , H01L29/0665 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/66469 , H01L29/66772
摘要： An integrated circuit includes a plurality of gate-all-around (GAA) nanowire field effect transistors (FETs), a plurality of omega-gate nanowire FETs, and a plurality of planar channel FETs, wherein the plurality of GAA FETs, the plurality of omega-gate nanowire FETs, and the plurality of planar channel FETs are disposed on a single wafer.
摘要翻译：集成电路包括多个栅极全能（GAA）纳米线场效应晶体管（FET），多个Ω-栅极纳米线FET和多个平面沟道FET，其中多个GAA FET，多个 ω-门纳米线FET，并且多个平面沟道FET设置在单个晶片上。

4. 发明授权

US08232599B2 Bulk substrate FET integrated on CMOS SOI 有权
标题翻译：集成在CMOS SOI上的散装衬底FET
公开(公告)号：US08232599B2
公开(公告)日：2012-07-31
申请号：US12683456
申请日：2010-01-07
申请人： Anthony I. Chou , Arvind Kumar , Shreesh Narasimha , Ning Su , Huiling Shang
发明人： Anthony I. Chou , Arvind Kumar , Shreesh Narasimha , Ning Su , Huiling Shang
IPC分类号： H01L27/12 , H01L21/86
CPC分类号： H01L27/1207 , H01L21/84
摘要： An integrated circuit is provided that integrates an bulk FET and an SOI FET on the same chip, where the bulk FET includes a gate conductor over a gate oxide formed over a bulk substrate, where the gate dielectric of the bulk FET has the same thickness and is substantially coplanar with the buried insulating layer of the SOI FET. In a preferred embodiment, the bulk FET is formed from an SOI wafer by forming bulk contact trenches through the SOI layer and the buried insulating layer of the SOI wafer adjacent an active region of the SOI layer in a designated bulk device region. The active region of the SOI layer adjacent the bulk contact trenches forms the gate conductor of the bulk FET which overlies a portion of the underlying buried insulating layer, which forms the gate dielectric of the bulk FET.
摘要翻译：提供了一种集成电路，其将同一芯片上的体FET和SOI FET集成在一起，其中，本体FET包括在大块衬底上形成的栅极氧化物上的栅极导体，其中本体FET的栅极电介质具有相同的厚度，与SOI FET的掩埋绝缘层基本共面。在优选实施例中，通过在指定的大容量器件区域中与SOI层的有源区相邻的SOI层和SOI晶片的掩埋绝缘层形成体接触沟槽，从SOI晶片形成本体FET。邻近体接触沟槽的SOI层的有源区域形成体FET的栅极导体，其覆盖形成本体FET的栅极电介质的下层掩埋绝缘层的一部分。

5. 发明申请

US20120187492A1 BULK SUBSTRATE FET INTEGRATED ON CMOS SOI 有权
标题翻译：集成在CMOS SOI上的基极FET
公开(公告)号：US20120187492A1
公开(公告)日：2012-07-26
申请号：US13425681
申请日：2012-03-21
申请人： Anthony I. Chou , Arvind Kumar , Shreesh Narasimha , Ning Su , Huiling Shang
发明人： Anthony I. Chou , Arvind Kumar , Shreesh Narasimha , Ning Su , Huiling Shang
IPC分类号： H01L27/088
CPC分类号： H01L27/1207 , H01L21/84
摘要： An integrated circuit is provided that integrates an bulk FET and an SOI FET on the same chip, where the bulk FET includes a gate conductor over a gate oxide formed over a bulk substrate, where the gate dielectric of the bulk FET has the same thickness and is substantially coplanar with the buried insulating layer of the SOI FET. In a preferred embodiment, the bulk FET is formed from an SOI wafer by forming bulk contact trenches through the SOI layer and the buried insulating layer of the SOI wafer adjacent an active region of the SOI layer in a designated bulk device region. The active region of the SOI layer adjacent the bulk contact trenches forms the gate conductor of the bulk FET which overlies a portion of the underlying buried insulating layer, which forms the gate dielectric of the bulk FET.
摘要翻译：提供了一种集成电路，其将同一芯片上的体FET和SOI FET集成在一起，其中，本体FET包括在大块衬底上形成的栅极氧化物上的栅极导体，其中本体FET的栅极电介质具有相同的厚度，与SOI FET的掩埋绝缘层基本共面。在优选实施例中，通过在指定的大容量器件区域中与SOI层的有源区相邻的SOI层和SOI晶片的掩埋绝缘层形成体接触沟槽，从SOI晶片形成本体FET。邻近体接触沟槽的SOI层的有源区域形成体FET的栅极导体，其覆盖形成本体FET的栅极电介质的下层掩埋绝缘层的一部分。

6. 发明申请

US20120180010A1 METHOD OF FABRICATING A DEVICE USING LOW TEMPERATURE ANNEAL PROCESSES, A DEVICE AND DESIGN STRUCTURE 有权
标题翻译：使用低温退火工艺制造器件的方法，器件和设计结构
公开(公告)号：US20120180010A1
公开(公告)日：2012-07-12
申请号：US13421400
申请日：2012-03-15
申请人： Anthony G. DOMENICUCCI , Terence L. Kane , Shreesh Narasimha , Karen A. Nummy , Viorel Ontalus , Yun-Yu Wang
发明人： Anthony G. DOMENICUCCI , Terence L. Kane , Shreesh Narasimha , Karen A. Nummy , Viorel Ontalus , Yun-Yu Wang
IPC分类号： G06F17/50
CPC分类号： H01L21/324 , H01L29/6656 , H01L29/6659 , H01L29/7833 , H01L29/7847
摘要： A method of fabricating a device using a sequence of annealing processes is provided. More particularly, a logic NFET device fabricated using a low temperature anneal to eliminate dislocation defects, method of fabricating the NFET device and design structure is shown and described. The method includes forming a stress liner over a gate structure and subjecting the gate structure and stress liner to a low temperature anneal process to form a stacking force in single crystalline silicon near the gate structure as a way to memorized the stress effort. The method further includes stripping the stress liner from the gate structure and performing an activation anneal at high temperature on device.
摘要翻译：提供了使用退火处理序列制造器件的方法。更具体地，示出并描述了使用低温退火制造以消除位错缺陷的逻辑NFET器件，制造NFET器件的方法和设计结构。该方法包括在栅极结构上形成应力衬垫，并对栅极结构和应力衬垫进行低温退火处理，以在栅极结构附近的单晶硅中形成堆叠力，作为记忆应力的方法。该方法还包括从栅极结构剥离应力衬垫并在器件上在高温下进行激活退火。

7. 发明申请

US20110225562A1 COMPACT MODEL METHODOLOGY FOR PC LANDING PAD LITHOGRAPHIC ROUNDING IMPACT ON DEVICE PERFORMANCE 有权
标题翻译：用于PC路面平台的简化模型方法对设备性能的影响
公开(公告)号：US20110225562A1
公开(公告)日：2011-09-15
申请号：US13100584
申请日：2011-05-04
申请人： Dureseti Chidambarrao , Gerald M. Davidson , Paul A. Hyde , Judith H. McCullen , Shreesh Narasimha
发明人： Dureseti Chidambarrao , Gerald M. Davidson , Paul A. Hyde , Judith H. McCullen , Shreesh Narasimha
IPC分类号： G06F9/455
CPC分类号： G06F17/5036
摘要： A method and computer program product for modeling a semiconductor transistor device structure having an active device area, a gate structure, and including a conductive line feature connected to the gate structure and disposed above the active device area, the conductive line feature including a conductive landing pad feature disposed near an edge of the active device area in a circuit to be modeled. The method includes determining a distance between an edge defined by the landing pad feature to an edge of the active device area, and, from modeling a lithographic rounding effect of the landing pad feature, determining changes in width of the active device area as a function of the distance between an edge defined by the landing pad feature to an edge of the active device area. From these data, an effective change in active device area width (deltaW adder) is related to the determined distance. Then, transistor model parameter values in a transistor compact model are updated for the transistor device to include deltaW adder values to be added to a built-in deltaW value. A netlist used in a device simulation may then include the deltaW adder values to quantify the influence of the lithographic rounding effect of the landing pad feature.
摘要翻译：一种用于对具有有源器件区域，栅极结构并且包括连接到栅极结构并且设置在有源器件区域上方的导线特征来建模半导体晶体管器件结构的方法和计算机程序产品，所述导电线特征包括导电层衬垫特征设置在待建模的电路中的有源器件区域的边缘附近。该方法包括确定由着陆焊盘特征限定的边缘与有源器件区域的边缘之间的距离，以及通过建模着陆焊盘特征的光刻圆整效应，确定作为功能的有源器件区域的宽度变化由着陆垫特征限定的边缘到活动设备区域的边缘之间的距离。根据这些数据，有源器件区域宽度（deltaW加法器）的有效变化与确定的距离有关。然后，晶体管紧凑型模型中的晶体管模型参数值被更新为晶体管器件，以包括要添加到内置deltaW值的ΔW加法器值。在设备仿真中使用的网表可以包括deltaW加法器值，以量化着陆垫特征的光刻舍入效应的影响。

8. 发明授权

US08017483B2 Method of creating asymmetric field-effect-transistors 有权
标题翻译：制造不对称场效应晶体管的方法
公开(公告)号：US08017483B2
公开(公告)日：2011-09-13
申请号：US12493549
申请日：2009-06-29
申请人： Gregory G. Freeman , Shreesh Narasimha , Ning Su , Hasan M. Nayfeh , Nivo Rovedo , Werner A. Rausch , Jian Yu
发明人： Gregory G. Freeman , Shreesh Narasimha , Ning Su , Hasan M. Nayfeh , Nivo Rovedo , Werner A. Rausch , Jian Yu
IPC分类号： H01L21/336
CPC分类号： H01L21/823425 , H01L21/26586 , H01L21/823412 , H01L29/66492 , H01L29/66659
摘要： The present invention provides a method of forming asymmetric field-effect-transistors. The method includes forming at least a first and a second gate-mask stack on top of a semiconductor substrate, wherein the first and second gate-mask stacks include at least, respectively, a first and a second gate conductor of a first and a second transistor and have, respectively, a top surface, a first side, and a second side with the second side being opposite to the first side; performing a first halo implantation from the first side of the first and second gate-mask stacks at a first angle while applying the first gate-mask stack in preventing the first halo implantation from reaching a first source/drain region of the second transistor, wherein the first angle is equal to or larger than a predetermined value; and performing a second halo implantation from the second side of the first and second gate-mask stacks at a second angle, thereby creating halo implant in a second source/drain region of the second transistor, wherein the first and second angles are measured against a normal to the substrate.
摘要翻译：本发明提供了形成非对称场效应晶体管的方法。该方法包括在半导体衬底的顶部上形成至少第一和第二栅极掩模叠层，其中第一和第二栅极掩模叠层至少分别包括第一和第二栅极掩模叠层的第一和第二栅极导体分别具有顶表面，第一侧和第二侧，第二侧与第一侧相对; 以第一角度从第一和第二栅极掩模叠层的第一侧进行第一光晕注入，同时施加第一栅极掩模叠层以防止第一光晕注入到达第二晶体管的第一源极/漏极区域，其中第一角度等于或大于预定值; 以及以第二角度从所述第一和第二栅极掩模叠层的第二侧执行第二光晕注入，从而在所述第二晶体管的第二源极/漏极区域中产生晕轮注入，其中所述第一和第二角度是针对与基底垂直。

9. 发明授权

US07814454B2 Selectable device options for characterizing semiconductor devices 有权
标题翻译：用于表征半导体器件的可选择的器件选项
公开(公告)号：US07814454B2
公开(公告)日：2010-10-12
申请号：US11770303
申请日：2007-06-28
申请人： Anthony I. Chou , James S. Dunn , Brian M. Dufrene , Christopher H. Lumbra , Shreesh Narasimha , Christopher S. Putnam , BethAnn Rainey , Christopher M. Schnabel
发明人： Anthony I. Chou , James S. Dunn , Brian M. Dufrene , Christopher H. Lumbra , Shreesh Narasimha , Christopher S. Putnam , BethAnn Rainey , Christopher M. Schnabel
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , G06F2217/14 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： A system, method and program product that allows multiple devices to be placed between pads such that a Back End Of Line (BEOL) mask change can be used to select different device options. A system is disclosed for implementing a testsite for characterizing devices in an integrated circuit technology, and includes: a system for designing a plurality of device options for a set of chip pads; a system for designing a pseudo wiring layout for each of the plurality of device options; a system for selecting one of the device options; a system for mapping the pseudo wiring layout for a selected device option to a predetermined design level; and a system for outputting a configured mask design at the predetermined design level having a wiring layout mapped for the selected device option.
摘要翻译：一种允许多个设备放置在焊盘之间的系统，方法和程序产品，使得后端（BEOL）掩模更改可用于选择不同的设备选项。公开了一种用于实现用于表征集成电路技术中的器件的测试现场的系统，并且包括：用于为一组芯片焊盘设计多个器件选项的系统; 用于为所述多个设备选项中的每一个设计伪布线布局的系统; 用于选择所述设备选项之一的系统; 用于将所选择的设备选项的伪布线布局映射到预定设计级的系统; 以及用于在具有针对所选择的设备选项映射的布线布局的预定设计级别处输出配置的掩模设计的系统。

10. 发明授权

US07713807B2 High-performance CMOS SOI devices on hybrid crystal-oriented substrates 失效
标题翻译：高性能CMOS SOI器件在混合晶体取向衬底上
公开(公告)号：US07713807B2
公开(公告)日：2010-05-11
申请号：US11958877
申请日：2007-12-18
申请人： Bruce B. Doris , Kathryn W. Guarini , Meikei Ieong , Shreesh Narasimha , Kern Rim , Jeffrey W. Sleight , Min Yang
发明人： Bruce B. Doris , Kathryn W. Guarini , Meikei Ieong , Shreesh Narasimha , Kern Rim , Jeffrey W. Sleight , Min Yang
IPC分类号： H01L21/8238
CPC分类号： H01L21/76275 , H01L21/823807 , H01L21/84
摘要： An integrated semiconductor structure containing at least one device formed upon a first crystallographic surface that is optimal for that device, while another device is formed upon a second different crystallographic surface that is optimal for the other device is provided. The method of forming the integrated structure includes providing a bonded substrate including at least a first semiconductor layer of a first crystallographic orientation and a second semiconductor layer of a second different crystallographic orientation. A portion of the bonded substrate is protected to define a first device area, while another portion of the bonded substrate is unprotected. The unprotected portion of the bonded substrate is then etched to expose a surface of the second semiconductor layer and a semiconductor material is regrown on the exposed surface. Following planarization, a first semiconductor device is formed in the first device region and a second semiconductor device is formed on the regrown material.
摘要翻译：提供包含至少一个器件的集成半导体结构，所述器件形成在对于该器件最佳的第一晶体表面上，而另一器件形成在对于另一器件最佳的第二不同晶体表面上。形成集成结构的方法包括提供包括至少第一晶体取向的第一半导体层和第二不同晶体取向的第二半导体层的键合衬底。键合衬底的一部分被保护以限定第一器件区域，而键合衬底的另一部分是未受保护的。然后蚀刻键合衬底的未保护部分以暴露第二半导体层的表面，并将半导体材料重新生长在暴露表面上。在平坦化之后，在第一器件区域中形成第一半导体器件，并且在再生长材料上形成第二半导体器件。

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