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71. 发明授权

US06969309B2 Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies 失效
标题翻译：微电子衬底组件平面化机器和微电子衬底组件的机械和化学机械平面化的方法
公开(公告)号：US06969309B2
公开(公告)日：2005-11-29
申请号：US10812804
申请日：2004-03-29
申请人： Craig M. Carpenter
发明人： Craig M. Carpenter
IPC分类号： B24B37/12 , B24B37/20 , B24B37/26 , B24D9/08 , B24B49/00
CPC分类号： B24B37/12 , B24B13/012 , B24B37/20 , B24B37/26 , B24D9/08
摘要： Planarizing machines for chemical-mechanical planarization of microelectronic substrate assemblies are disclosed. The planarizing machines for processing microelectronic substrate assemblies generally include a table, a pad support assembly either positioned on or in the table, and a planarizing medium coupled to the pad support assembly. The pad support assembly includes a fluid container and an elastic membrane coupled to the fluid container. The fluid container generally is a basin that is either a separate component that is attached to the table, or a depression in the table itself. The fluid container can also be a bladder attached to the table. The fluid chamber is filled with support fluid to support the elastic membrane over the fluid chamber.
摘要翻译：公开了用于微电子衬底组件的化学机械平面化的平面化机器。用于处理微电子衬底组件的平面化机器通常包括一个桌子，一个定位在桌子上或桌子上的衬垫支撑组件以及耦合到衬垫支撑组件的平面化介质。垫支撑组件包括流体容器和联接到流体容器的弹性膜。流体容器通常是盆地，其是连接到桌子上的单独部件或桌子本身中的凹陷部分。流体容器也可以是附着在桌子上的气囊。流体室填充有支撑流体以将弹性膜支撑在流体室上。

72. 发明授权

US06935932B2 Polishing apparatus and method 失效
公开(公告)号：US06935932B2
公开(公告)日：2005-08-30
申请号：US10784945
申请日：2004-02-25
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
IPC分类号： B24B9/06 , B24B37/12 , B24B37/34 , H01L21/00 , B24B1/00
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

73. 发明授权

US06896586B2 Method and apparatus for heating polishing pad 失效
标题翻译：抛光垫加热方法和装置
公开(公告)号：US06896586B2
公开(公告)日：2005-05-24
申请号：US10112628
申请日：2002-03-29
申请人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
发明人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
IPC分类号： B24B21/10 , B24B37/12 , B24B49/14 , H01L21/304 , B24B49/00
CPC分类号： B24B37/12 , B24B21/10 , B24B49/14
摘要： A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.
摘要翻译：提供了一种用于具有线性抛光带的化学机械平面化（CMP）系统的温度控制系统，能够在线性抛光带上的准备位置上施加基底的载体。温度控制系统包括具有多个区域的压板。温度控制系统还包括配置的温度传感器，其确定在准备位置之后的位置处的线性抛光带的温度。该系统还包括控制器，用于响应于从温度传感器接收到的输出，调节调节温度的流体流到压板的多个区域中的选定区域。

74. 发明授权

US6361417B2 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates 有权
标题翻译：用于在微电子基板的化学机械平面化期间支撑抛光垫的方法和装置
公开(公告)号：US6361417B2
公开(公告)日：2002-03-26
申请号：US79524801
申请日：2001-02-27
申请人： MICRON TECHNOLOGY INC
发明人： WALKER MICHAEL A , ROBINSON KARL M
IPC分类号： B24B21/04 , B24B37/12 , B24B37/26 , B24D11/00 , B24B1/00
CPC分类号： B24B37/26 , B24B21/04 , B24B37/12 , B24D11/00
摘要： A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.
摘要翻译：一种用于平面化微电子衬底的方法和装置。在一个实施例中，该装置可以包括细长的抛光垫，其在平坦化循环之间或期间在压板上移动，以及与抛光垫一起移动的支撑垫。支撑垫可以是在供应辊和卷取辊之间延伸的细长构件，或者可以包括围绕间隔开的辊延伸的连续构件。压板也可以与支撑垫一起移动，并且可以由流体射流，辊或旋转的气囊支撑。清洁装置和/或铣削装置可以处理抛光垫，支撑垫和/或压板的表面，以减少当它们彼此接合时污染物被捕获在这些部件之间的可能性。

75. 发明授权

US6074277A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US6074277A
公开(公告)日：2000-06-13
申请号：US260403
申请日：1999-03-01
申请人： Hatsuyuki Arai
发明人： Hatsuyuki Arai
IPC分类号： B24B37/12 , B24B49/12 , B24B49/00
CPC分类号： B24B37/105 , B24B37/12 , B24B49/12
摘要： A polishing apparatus prevents uneven wear of the platen and improves the operating rate of the apparatus. The polishing apparatus provided with a platen 1 divided into an inner peripheral platen portion 11 and an outer peripheral platen portion 13 and with a carrier 5, wherein by making the inner peripheral platen portion 11 and the outer peripheral platen portion 13 rotate in opposite directions and setting the rotational speeds of the inner peripheral platen portion 11 and the outer peripheral platen portion 13 so that the mean relative speed of a wafer 200 and the inner peripheral platen portion 11 and the mean relative speed of the wafer 200 and the outer peripheral platen portion 13 become substantially equal, it becomes possible to make the amount of wear of the polishing pad 11a of the inner peripheral platen portion 11 and the amount of wear of the polishing pad 13a of the outer peripheral platen portion 13 substantially equal. Preferably, the wafer 200 is made to oscillate so that the wafer 200 overhangs from the inner edge of the inner peripheral platen portion 11 and the outer edge of the outer peripheral platen portion 13.
摘要翻译：抛光装置防止压板的不均匀磨损并提高装置的操作速度。抛光装置设置有分隔成内周压板部分11和外周压板部分13以及载体5的压板1，其中通过使内周压板部分11和外周压板部分13沿相反方向旋转，设定内周压板部11和外周压板部13的旋转速度，使得晶片200和内周压板部11的平均相对速度以及晶片200和外周压板部的平均相对速度 13变得基本相等，可以使内周压板部分11的抛光垫11a的磨损量和外周压板部分13的抛光垫13a的磨损量基本相等。优选地，使晶片200振荡，使得晶片200从内周压板部分11的内边缘和外周压板部分13的外边缘突出。

76. 发明授权

US6066230A Planarization method, workpiece measuring method, and surface planarization apparatus having a measuring device 失效
标题翻译：平面化方法，工件测量方法和具有测量装置的表面平面化装置
公开(公告)号：US6066230A
公开(公告)日：2000-05-23
申请号：US26706
申请日：1998-02-20
申请人： Hatsuyuki Arai
发明人： Hatsuyuki Arai
IPC分类号： B24B37/12 , B24B49/04 , B24D7/14 , B24B5/00
CPC分类号： B24B37/16 , B24B37/245 , B24B49/04 , B24D7/14
摘要： A [work] workpiece processing apparatus and a [work] workpiece measuring method are provided in which a [work] workpiece can be processed or planarized without decreasing a processing rate and/or an operating rate of the apparatus. The apparatus can be reduced in size, and can measure the state of planarization of the [work] workpiece at a high degree of accuracy. The apparatus includes a rotatable surface plate, and a carrier 6 for swinging or oscillating a [work] workpiece 200 in a radial direction of the surface plate 1 while pressing the [work] workpiece 200 against the surface plate 1. The surface plate 1 is divided into an inner surface plate member 11, an intermediate surface plate member 12, and an outer surface plate member 13 which are all disposed in a concentric relation and rotatable independently of each other. The intermediate surface plate member 12 is disposed between the inner and outer surface plate members 11 and 13.
摘要翻译：提供[工件]工件加工装置和[工件]工件测量方法，其中可以在不降低加工速度和/或加工速度的情况下对[工件]工件进行加工或平面化。该装置的尺寸可以减小，并且可以高精度地测量[工件]工件的平坦化状态。该装置包括可旋转的表面板和用于在将工件200压靠在表面板1上的同时使工件200沿着表面板1的径向摆动或摆动的载体6.表面板1是分为内表面板构件11，中间面板构件12和外表面板构件13，它们全部以同心关系设置并且彼此独立地旋转。中间表面板构件12设置在内表面板构件11和外表面板构件13之间。

77. 发明授权

US5931719A Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing 失效
标题翻译：通过抛光垫使用压差的方法和装置，以提高化学机械抛光的性能
公开(公告)号：US5931719A
公开(公告)日：1999-08-03
申请号：US918846
申请日：1997-08-25
申请人： Ronald J. Nagahara , Dawn M. Lee
发明人： Ronald J. Nagahara , Dawn M. Lee
IPC分类号： B24B37/12 , B24B37/20 , B24D13/14 , B24B1/00
CPC分类号： B24B37/20 , B24B37/12
摘要： Methods and apparatus for planarizing the surface of a semiconductor wafer by applying non-uniform pressure distributions to a polishing pad are disclosed. According to one aspect of the present invention, a chemical mechanical polishing apparatus for polishing a surface of a semiconductor wafer includes a polishing pad with a first surface and a second surface. The first surface of the polishing pad is arranged to contact the surface of the semiconductor wafer in order to polish the surface of the semiconductor wafer. The apparatus also includes a mechanism which is used to apply a non-uniform pressure distribution over the second surface of the polishing pad, wherein applying the non-uniform pressure distribution to the polishing pad facilitates evenly polishing the surface of the semiconductor wafer. In one embodiment, the mechanism for applying the non-uniform pressure distribution to the polishing pad is an air bladder arrangement.
摘要翻译：公开了通过对抛光垫施加不均匀的压力分布来平坦化半导体晶片的表面的方法和装置。根据本发明的一个方面，用于抛光半导体晶片的表面的化学机械抛光装置包括具有第一表面和第二表面的抛光垫。抛光垫的第一表面布置成接触半导体晶片的表面以抛光半导体晶片的表面。该装置还包括用于在抛光垫的第二表面上施加不均匀压力分布的机构，其中将不均匀的压力分布施加到抛光垫有助于均匀地抛光半导体晶片的表面。在一个实施例中，将不均匀压力分布施加到抛光垫的机构是气囊装置。

78. 发明授权

US5873769A Temperature compensated chemical mechanical polishing to achieve uniform removal rates 失效
标题翻译：温度补偿化学机械抛光达到均匀的去除率
公开(公告)号：US5873769A
公开(公告)日：1999-02-23
申请号：US866797
申请日：1997-05-30
申请人： Hung-Wen Chiou , Lai-Juh Chen
发明人： Hung-Wen Chiou , Lai-Juh Chen
IPC分类号： B24B37/015 , B24B37/12 , B24B49/14 , H01L21/306 , B24B49/00 , B24B1/00
CPC分类号： H01L21/02024 , B24B37/015 , B24B37/12 , B24B49/14
摘要： A method and apparatus are described for Chemical Mechanical Polishing of wafers which achieves a constant removal rate of material from the wafer over the entire surface of the wafer. The wafer is held in a wafer carrier rotating at a wafer carrier angular velocity and is polished using a platen rotating at a platen angular velocity. The pressure exerted on the wafer by the wafer carrier is the largest at the wafer edge and smallest at the center of the wafer. The wafer carrier is divided into a number of wafer carrier circular segments so that the temperature of each wafer carrier circular segment can be controlled. The platen is divided into a number of platen circular segments so that the temperature of each platen circular segment can be controlled. The temperatures of the wafer carrier circular segments and the platen circular segments are then adjusted to provide a removal rate of material from the wafer which is uniform across the surface of the wafer.
摘要翻译：描述了用于在晶片的整个表面上实现来自晶片的材料的恒定去除速率的晶片的化学机械抛光的方法和装置。将晶片保持在以晶片载体角速度旋转的晶片载体中，并使用以压板角速度旋转的压板进行抛光。由晶片载体施加在晶片上的压力在晶片边缘处最大，在晶片中心处最小。晶片载体被分成多个晶片载体圆形段，从而可以控制每个晶片载体圆形段的温度。压板被分成多个压板圆形段，从而可以控制每个压板圆形段的温度。然后调整晶片载体圆形段和压板圆形段的温度以提供从晶片的材料的去除速率，其在晶片的表面上是均匀的。

79. 发明授权

US5730642A System for real-time control of semiconductor wafer polishing including optical montoring 失效
标题翻译：用于半导体晶圆抛光的实时控制系统，包括光学蒙太奇
公开(公告)号：US5730642A
公开(公告)日：1998-03-24
申请号：US791312
申请日：1997-01-30
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/10 , B24B37/12 , B24B37/20 , B24B49/00 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B49/14 , B24B57/02 , G05B19/404
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system delivering a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly; and an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, wherein drying of the wafer is avoided while the measurements are taken.
摘要翻译：一种用于抛光半导体晶片的系统，所述系统包括用于以抛光速率抛光半导体晶片的表面和抛光均匀性的晶片抛光组件，所述晶片抛光组件包括限定抛光区域的压板子组件，递送抛光区域的浆料，以及选择性地支撑半导体晶片并保持半导体晶片与压板组件接触的面的研磨头; 以及光学测量系统，当晶片在液体下方时，在晶片表面上的多个不同位置处测量膜厚度，其中在进行测量时避免了晶片的干燥。

80. 发明授权

US5664986A Apparatus for polishing a dielectric layer formed on a substrate 失效
标题翻译：用于抛光形成在基底上的介电层的设备
公开(公告)号：US5664986A
公开(公告)日：1997-09-09
申请号：US563170
申请日：1995-11-27
申请人： Jae-Woo Roh
发明人： Jae-Woo Roh
IPC分类号： H01L21/31 , B24B37/015 , B24B37/04 , B24B37/07 , B24B37/12 , B24B37/30 , B24B47/20 , B24B49/14 , H01L21/304 , B24B49/00
CPC分类号： B24B37/015 , B24B47/20
摘要： An apparatus for polishing a dielectric layer deposited on a top surface of a semiconductor substrate includes a table, a semiconductor substrate, a carrier, a pipe, a nozzle and an actuator assembly provided with a base, a power source, a cavity and a thermally expanding material. The actuator assembly controls the vertical position of the table by supplying a current to the thermally expanding material.
摘要翻译：用于抛光沉积在半导体衬底的顶表面上的电介质层的设备包括工作台，半导体衬底，载体，管，喷嘴和具有基座，电源，腔和热的致动器组件膨胀材料。致动器组件通过向热膨胀材料提供电流来控制工作台的垂直位置。

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