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1. 发明授权

US06896586B2 Method and apparatus for heating polishing pad 失效
标题翻译：抛光垫加热方法和装置
公开(公告)号：US06896586B2
公开(公告)日：2005-05-24
申请号：US10112628
申请日：2002-03-29
申请人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
发明人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
IPC分类号： B24B21/10 , B24B37/12 , B24B49/14 , H01L21/304 , B24B49/00
CPC分类号： B24B37/12 , B24B21/10 , B24B49/14
摘要： A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.
摘要翻译：提供了一种用于具有线性抛光带的化学机械平面化（CMP）系统的温度控制系统，能够在线性抛光带上的准备位置上施加基底的载体。温度控制系统包括具有多个区域的压板。温度控制系统还包括配置的温度传感器，其确定在准备位置之后的位置处的线性抛光带的温度。该系统还包括控制器，用于响应于从温度传感器接收到的输出，调节调节温度的流体流到压板的多个区域中的选定区域。

2. 发明申请

US20080236620A1 Methodology for cleaning of surface metal contamination from electrode assemblies 有权
标题翻译：清洁电极组件表面金属污染的方法
公开(公告)号：US20080236620A1
公开(公告)日：2008-10-02
申请号：US11730300
申请日：2007-03-30
申请人： Hong Shih , Yaobo Yin , Shun Jackson Wu , Armen Avoyan , John E. Daugherty , Linda Jiang
发明人： Hong Shih , Yaobo Yin , Shun Jackson Wu , Armen Avoyan , John E. Daugherty , Linda Jiang
IPC分类号： B08B3/04
CPC分类号： B08B3/08 , B08B3/12 , H01J37/32862 , H01L21/67051 , H01L21/67069
摘要： Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications and manufacturing yields are enhanced. Pre-cleaning of tools used in the cleaning process helps prevent contamination of the electrode being cleaned.
摘要翻译：系统和有效的清洁电容耦合等离子体反应堆电极的方法，并降低表面粗糙度，从而提高清洁电极满足表面污染规格和制造产量。对清洁过程中使用的工具进行预清洁有助于防止被清洁电极的污染。

3. 发明授权

US06277203B1 Method and apparatus for cleaning low K dielectric and metal wafer surfaces 有权
标题翻译：用于清洁低K电介质和金属晶片表面的方法和设备
公开(公告)号：US06277203B1
公开(公告)日：2001-08-21
申请号：US09197348
申请日：1998-11-20
申请人： Linda Jiang , Diane J. Hymes
发明人： Linda Jiang , Diane J. Hymes
IPC分类号： C23G102
CPC分类号： H01L21/0206 , B08B1/04 , B08B3/08 , H01L21/02063 , H01L21/02074 , H01L21/67046 , Y10S134/902
摘要： Provided is a method for cleaning hydrophobic surfaces, such as low K dielectric organic or inorganic surfaces as well as metallization surfaces of a semiconductor wafer. The method includes: (a) applying a surfactant solution to the surface; (c) scrubbing the surface; and (c) spin-rinsing the surface of the substrate using de-ionized water to complete a removal of any contaminants from the surface. If needed, the surfactant solution can be mixed with a chemical enhancer, and the scrubbing can be performed in a brush system. The brush system may be configured to apply DI water using a through the brush (TTB) technique. The surfactant solution can be applied either using a drip technique or using the TTB technique.
摘要翻译：提供了用于清洁疏水性表面的方法，例如低K介电有机或无机表面以及半导体晶片的金属化表面。该方法包括：（a）将表面活性剂溶液施用于表面; （c）擦洗表面; 和（c）使用去离子水旋转漂洗基材的表面以完成从表面去除任何污染物。如果需要，表面活性剂溶液可以与化学增强剂混合，并且洗刷可以在刷系统中进行。刷系统可以被配置为使用通过刷（TTB）技术来施加去离子水。表面活性剂溶液可以使用滴灌技术或使用TTB技术来应用。

4. 发明授权

US07578889B2 Methodology for cleaning of surface metal contamination from electrode assemblies 有权
标题翻译：清洁电极组件表面金属污染的方法
公开(公告)号：US07578889B2
公开(公告)日：2009-08-25
申请号：US11730300
申请日：2007-03-30
申请人： Hong Shih , Yaobo Yin , Shun Jackson Wu , Armen Avoyan , John E. Daugherty , Linda Jiang
发明人： Hong Shih , Yaobo Yin , Shun Jackson Wu , Armen Avoyan , John E. Daugherty , Linda Jiang
IPC分类号： B08B3/04
CPC分类号： B08B3/08 , B08B3/12 , H01J37/32862 , H01L21/67051 , H01L21/67069
摘要： Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications and manufacturing yields are enhanced. Pre-cleaning of tools used in the cleaning process helps prevent contamination of the electrode being cleaned.
摘要翻译：系统和有效的清洁电容耦合等离子体反应堆电极的方法，并降低表面粗糙度，从而提高清洁电极满足表面污染规格和制造产量。对清洁过程中使用的工具进行预清洁有助于防止被清洁电极的污染。

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