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1. 发明申请

US20030073384A1 System for real-time control of semiconductor wafer polishing 失效
公开(公告)号：US20030073384A1
公开(公告)日：2003-04-17
申请号：US10299271
申请日：2002-11-19
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B24B049/00 , B24B051/00 , B24B005/00
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

2. 发明授权

US06306009B1 System for real-time control of semiconductor wafer polishing 有权
公开(公告)号：US06306009B1
公开(公告)日：2001-10-23
申请号：US09444022
申请日：1999-11-19
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B24B4902
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

3. 发明授权

US5762537A System for real-time control of semiconductor wafer polishing including heater 失效
公开(公告)号：US5762537A
公开(公告)日：1998-06-09
申请号：US821936
申请日：1997-03-21
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/10 , B24B37/12 , B24B37/20 , B24B49/00 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B49/14 , B24B57/02 , G05B19/404 , B24B29/00
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a platen subassembly defining a polishing area; a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and means for heating the wafer while the wafer face is being polished.

4. 发明授权

US4857694A Method and apparatus for automatic vapor cooling when shape melting a component 失效
标题翻译：形状熔化部件时自动蒸发冷却的方法和装置
公开(公告)号：US4857694A
公开(公告)日：1989-08-15
申请号：US190791
申请日：1988-05-06
申请人： Thomas E. Doyle , Patrick M. Ryan
发明人： Thomas E. Doyle , Patrick M. Ryan
IPC分类号： B23K9/04 , B23K37/00 , B23Q11/10 , B29C67/00 , C21D9/50
CPC分类号： B29C67/0074 , B23K37/003 , B23Q11/10 , G05B2219/49015 , G05B2219/49052 , G05B2219/50214
摘要： A method and apparatus for automatically cooling a workpiece being manufactured by shape melting whereby a gas/liquid coolant mixture is pumped onto the external surface of the part to be cooled. Temperature and pressure data is fed to a computer control system which regulates the flow of the gas and liquid coolant mixtures. A suction device which enshrouds the spray head extracts the heated and vaporized fluid from the vicinity of the surface. The apparatus may be provided with multiple spray heads which comprise the cooling head and have the ability to control the total rate at which coolant flows through the device by individually controlling coolant and gas flow through each of the multiple spray heads. If more cooling is desired, the computer control system activates more nozzles for flow, or it increases flow rate through already activated nozzles. Both the number of spraying heads and flow rates through each spray head are variable, so the cooling capabilities of the system are continuously variable over a wide range of total flow rates through the device.

5. 发明授权

US09969104B2 Automatic control of assemblies of a water supply system 有权
公开(公告)号：US09969104B2
公开(公告)日：2018-05-15
申请号：US15321955
申请日：2015-06-24
申请人： Hilti Aktiengesellschaft
发明人： Eduard Sever , Hans Rupprecht , Helmut Specht
IPC分类号： B28D7/02 , B28D1/04 , B28D7/00 , G05D7/06 , G05B19/406
CPC分类号： B28D7/02 , B28D1/041 , B28D7/005 , G05B19/406 , G05B2219/24015 , G05B2219/49043 , G05B2219/49052 , G05D7/0676
摘要： A method for controlling a water supply system for use with a machine tool is disclosed. The water supply system includes a housing with an interface for supplying electrical energy, a water tank, a line, a pump device, a current-measuring device, a water-pressure-measuring device, and a control device. The method includes activating the pump device if the machine tool is connected to the interface and the motor current of the machine tool exceeds a predetermined threshold value, and deactivating the pump device if the machine tool is connected and the motor current undershoots a predetermined threshold value; or activating the pump device if the machine tool is not connected and the water pressure in the line undershoots a predetermined threshold value and deactivating the pump device if the machine tool is not connected and the water pressure exceeds a predetermined threshold value.

6. 发明授权

US06488566B2 System for real-time control of semiconductor wafer polishing 有权
公开(公告)号：US06488566B2
公开(公告)日：2002-12-03
申请号：US09993010
申请日：2001-11-14
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B24B100
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

7. 发明授权

US06464561B2 System for real-time control of semiconductor wafer polishing 有权
标题翻译：半导体晶圆抛光实时控制系统
公开(公告)号：US06464561B2
公开(公告)日：2002-10-15
申请号：US09971723
申请日：2001-10-04
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B24B4900
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.
摘要翻译：一种用于抛光半导体晶片的系统，所述系统包括用于以抛光速率抛光半导体晶片的表面和抛光均匀性的晶片抛光组件，所述晶片抛光组件包括限定抛光区域的压板子组件和选择性地抛光支撑半导体晶片并且保持半导体晶片的与压板子组件接触的面以抛光晶片表面; 以及控制器，在晶片抛光期间选择性地调整多个可调抛光参数之一。

8. 发明授权

US5730642A System for real-time control of semiconductor wafer polishing including optical montoring 失效
标题翻译：用于半导体晶圆抛光的实时控制系统，包括光学蒙太奇
公开(公告)号：US5730642A
公开(公告)日：1998-03-24
申请号：US791312
申请日：1997-01-30
申请人： Gurtej S. Sandhu , Trung Tri Doan
发明人： Gurtej S. Sandhu , Trung Tri Doan
IPC分类号： B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/10 , B24B37/12 , B24B37/20 , B24B49/00 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B49/14 , B24B57/02 , G05B19/404
CPC分类号： B24B37/107 , B23Q15/013 , B23Q15/12 , B24B13/015 , B24B37/013 , B24B37/015 , B24B37/12 , B24B37/205 , B24B49/003 , B24B49/02 , B24B49/04 , B24B49/10 , B24B49/12 , B24B57/02 , G05B19/404 , G05B2219/34403 , G05B2219/37398 , G05B2219/37602 , G05B2219/45026 , G05B2219/45199 , G05B2219/45232 , G05B2219/49052 , G05B2219/49057
摘要： A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system delivering a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly; and an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, wherein drying of the wafer is avoided while the measurements are taken.
摘要翻译：一种用于抛光半导体晶片的系统，所述系统包括用于以抛光速率抛光半导体晶片的表面和抛光均匀性的晶片抛光组件，所述晶片抛光组件包括限定抛光区域的压板子组件，递送抛光区域的浆料，以及选择性地支撑半导体晶片并保持半导体晶片与压板组件接触的面的研磨头; 以及光学测量系统，当晶片在液体下方时，在晶片表面上的多个不同位置处测量膜厚度，其中在进行测量时避免了晶片的干燥。

9. 发明授权

US4640057A Dressing-grinding process and electronically controlled grinding machine 失效
标题翻译：修磨研磨工艺和电子磨床
公开(公告)号：US4640057A
公开(公告)日：1987-02-03
申请号：US589096
申请日：1984-01-26
申请人： Ernst Salje
发明人： Ernst Salje
IPC分类号： B24B47/20 , B24B53/00 , B24B53/08 , G05B19/416
CPC分类号： B24B53/00 , B24B53/08 , G05B19/4166 , G05B2219/37251 , G05B2219/37345 , G05B2219/37357 , G05B2219/43141 , G05B2219/45159 , G05B2219/45161 , G05B2219/49052 , G05B2219/49062 , G05B2219/50315
摘要： A dressing-grinding process for electronically controlled grinding machines for plain or surface grinding of workpieces is described. In order to maintain the effective rough depth during the grinding process, while the roller RPM must be selective and the feed of the dressing roller against the grinding wheel must be continuous, the dressing roller carrier is continuously fed against the grinding wheel carrier in accordance with the functions ##EQU1## wherein is: v.sub.frd (t): feed speed of the dressing roller carrier slide (31) relative to the grinding wheel slidea.sub.ed (t): dressing feed per revolutionn.sub.s (t): grinding wheel revolutionsd.sub.s (t): grinding wheel diametert: current timev.sub.s : grinding wheel circumferential speed; for the described example of a straight grinding wheel it equals the grinding wheel speed v.sub.c. Thus v.sub.c =v.sub.s.y.sub.s (t): vertical coordinate of the wheel centery.sub.x (t): workpiece dimension in y direction.
摘要翻译： PCT No.PCT / EP83 / 00145 Sec。 371日期1984年1月26日 102（e）日期1984年1月26日PCT Filed June 6，1983 PCT Pub。出版物WO83 / 04322 日期为1983年12月8日。描述了用于工件的平面或平面磨削的电子控制研磨机的修整磨削工艺。为了在磨削过程中保持有效的粗糙深度，当辊子RPM必须是选择性的并且修整辊抵靠砂轮的进给必须是连续的时，修整辊托架依次按照功能其中：vfrd（t）：修整辊支架滑块（31）相对于砂轮滑动的进给速度（t）：每转换进给速度ns（t）：砂轮转速 ds（t）：砂轮直径t：当前时间vs：砂轮圆周速度; 对于所描述的直磨砂轮的示例，其等于砂轮速度vc。因此vc = vs。 ys（t）：车轮中心yx（t）的垂直坐标：y方向的工件尺寸。

10. 发明授权

US12030145B2 Machine tool and system 有权
公开(公告)号：US12030145B2
公开(公告)日：2024-07-09
申请号：US16883027
申请日：2020-05-26
申请人： FANUC CORPORATION
发明人： Yuu Akutsu
IPC分类号： B23Q11/12 , B23B25/00 , B23Q11/00 , B23Q11/10 , B23Q11/14
CPC分类号： B23Q11/127 , B23B25/00 , B23Q11/0007 , B23Q11/10 , B23Q11/14 , G05B2219/49052
摘要： A machine tool including a first cooling unit, such as a fan, that cools at least one of a drive part that drives a component of the machine tool and an amplifier of the drive part, a second cooling unit, such as a Peltier element, that cools the at least one of the drive part and the amplifier, and a cooling control unit that controls the first cooling unit and the second cooling unit, wherein vibration caused by the second cooling unit is less than vibration caused by the first cooling unit, and the cooling control unit switches cooling of the at least one of the drive part and the amplifier, from cooling by the first cooling unit to cooling by the second cooling unit.

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