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    • 2. 发明申请
    • BOARD INSPECTION APPARATUS SYSTEM AND BOARD INSPECTION METHOD
    • 板检查装置系统和板检查方法
    • US20140125375A1
    • 2014-05-08
    • US14072178
    • 2013-11-05
    • KOH YOUNG TECHNOLOGY INC.
    • Seung-Jun LEEMoon-Young JEONNam Ho LEE
    • G01R31/28
    • G01R31/2805G05B19/41875G05B2219/37217G05B2219/45026H05K13/08H05K13/0817H05K13/083
    • A board inspection apparatus system includes a first apparatus, a second apparatus, a third apparatus and an information transfer section. The first apparatus acquires first three-dimensional information of a solder paste on a board, and inspects whether the solder paste is formed good by a first tolerance based on the first three-dimensional information. The second apparatus mounts an electronic component on the board to join the electronic component and the solder paste. The third apparatus acquires second three-dimensional information of a solder joint, and inspects whether the electronic component is mounted good by a second tolerance based on the second three-dimensional information. The information transfer section transfers the first three-dimensional information to the third apparatus, or transfers the second three-dimensional information to the first apparatus. Thus, a more effective inspection condition may be established, and a rate of defect for each apparatus may be greatly reduced.
    • 板检查装置系统包括第一装置,第二装置,第三装置和信息传送部。 第一装置获取板上的焊膏的第一三维信息,并且基于第一三维信息检查焊膏是否通过第一公差形成良好。 第二装置将电子部件安装在电路板上以连接电子部件和焊膏。 第三装置获取焊点的第二三维信息,并且基于第二三维信息检查电子部件是否良好地被安装好第二公差。 信息传送部将第一三维信息传送到第三装置,或将第二三维信息传送到第一装置。 因此,可以建立更有效的检查条件,并且可以大大降低每个装置的缺陷率。
    • 3. 发明授权
    • Component transferring apparatus and IC handler
    • 组件传送设备和IC处理程序
    • US08622198B2
    • 2014-01-07
    • US13275619
    • 2011-10-18
    • Takashi YamazakiHiroaki FujimoriNaohisa MaedaDaisuke KiriharaSatoshi NakamuraMasami Maeda
    • Takashi YamazakiHiroaki FujimoriNaohisa MaedaDaisuke KiriharaSatoshi NakamuraMasami Maeda
    • B65G47/34
    • G01R31/2893G05B2219/37216G05B2219/40564G05B2219/45026
    • An apparatus includes: a retainer moving between a shuttle and a socket; a presser holding a component; an adjuster moving the presser; a socket mark near the socket; a hand mark near the socket mark when the retainer is at a component mounting position; a first camera photographing a first image including the component and hand mark; a second camera photographing a second image including the socket mark and socket, and a third image including the socket mark and hand mark; a first calculator obtaining a first relative position between the socket mark and socket from the second image; a second calculator obtaining a second relative position between the socket mark and hand mark from the third image; and a third calculator obtaining a third relative position between the hand mark and component from the first image. The adjuster corrects the component's position based on the relative positions.
    • 一种装置包括:保持件在梭子和插座之间移动; 持有组件的压脚; 调节器移动压脚; 插座附近的插座标记; 当保持器处于部件安装位置时,在插座标记附近的手标记; 拍摄包括所述部件和手标记的第一图像的第一相机; 拍摄包括插座标记和插座的第二图像的第二相机以及包括插座标记和手标的第三图像; 第一计算器,从所述第二图像获得所述插座标记和所述插座之间的第一相对位置; 第二计算器,从所述第三图像获得所述插座标记与手标记之间的第二相对位置; 以及第三计算器,从所述第一图像获得所述手标和分量之间的第三相对位置。 调整器根据相对位置校正组件的位置。