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41. 发明申请

US20050125998A1 Electronic part mounting device and method 失效
标题翻译：电子零件安装装置及方法
公开(公告)号：US20050125998A1
公开(公告)日：2005-06-16
申请号：US10503497
申请日：2003-02-06
申请人： Naoto Mimura , Izumi Miura , Hirofumi Obara , Hiroshi Uchiyama , Kobuyuki Kakita , Kazunori Kanai , Osamu Okuda , Akira Kabeshita
发明人： Naoto Mimura , Izumi Miura , Hirofumi Obara , Hiroshi Uchiyama , Kobuyuki Kakita , Kazunori Kanai , Osamu Okuda , Akira Kabeshita
IPC分类号： H05K13/04 , H05K13/08 , H05K3/30
CPC分类号： H05K13/0413 , H05K13/0853 , Y10T29/4913 , Y10T29/49144 , Y10T29/5137 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178
摘要： An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.
摘要翻译：提供了一种用于安装电子部件的装置和方法，其缩短了安装所需的周期时间，并且使部件安装机器布置在小的区域中。提供了一种控制器，使得对第二部件馈送器执行用于第二电子部件的退避控制，以便如果第一电子部件或部件保持器干扰第二部件馈送器的第二电子部件，则避免干扰，因为的安装头的运动。可以减少上下移动部件保持器所需的时间，并且消除了在移动安装头时无法沿着绕行移动的需要。可以缩短周期时间，最终可以降低成本。

42. 发明授权

US06877220B1 Method for feeding a component 失效
标题翻译：喂食成分的方法
公开(公告)号：US06877220B1
公开(公告)日：2005-04-12
申请号：US09743349
申请日：1999-09-14
申请人： Takeshi Kuribayashi , Hiroshi Uchiyama , Akihiko Wachi
发明人： Takeshi Kuribayashi , Hiroshi Uchiyama , Akihiko Wachi
IPC分类号： H05K13/02 , H05K13/04 , H05K13/08 , H05K3/30
CPC分类号： H05K13/0452 , H05K13/041 , H05K13/0417 , H05K13/086 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/49764 , Y10T29/49826 , Y10T29/5303 , Y10T29/53035 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187
摘要： An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.
摘要翻译：确定在供给要安装的部件的部件供给部件的由安装程序指定的部件布置位置处缺少的发生部件。确定在部件供给部的备件供给区域中是否存在要安装的缺少部件的备件，并且将从部件供给部的指定部件配置位置供给的部件供给切换为供给部的备用部件供应区域。

43. 发明授权

US06862803B2 Method for mounting electronic component 失效
标题翻译：电子元件安装方法
公开(公告)号：US06862803B2
公开(公告)日：2005-03-08
申请号：US09940743
申请日：2001-08-28
申请人： Takeyuki Kawase , Junkei Shimizu , Hiroshi Uchiyama , Noriaki Yoshida
发明人： Takeyuki Kawase , Junkei Shimizu , Hiroshi Uchiyama , Noriaki Yoshida
IPC分类号： H05K13/04 , H05K13/08 , H05K3/30
CPC分类号： H05K13/08 , H05K13/04 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53091 , Y10T29/53178 , Y10T29/53191
摘要： A parts mounting method employing a suction section having a plurality of suction nozzles is provided. The suction section is moved to a parts supply section in which a plurality of parts are suctioned by the suction nozzles at the same time. The parts are then mounted onto a board. The suction nozzles are divided into groups: a first group having a shift amount within an allowable range in which simultaneous suction is possible; and a second group having a shift amount outside the allowable range in which simultaneous suction is possible. The parts are then sucked at the same time for each of the groups.
摘要翻译：提供了采用具有多个吸嘴的抽吸部分的部件安装方法。吸引部移动到同时由吸嘴吸引多个部位的部件供给部。然后将部件安装到板上。吸嘴分为：第一组，其移动量在可以同时吸入的允许范围内; 以及第二组，其移动量在可以同时吸入的允许范围之外。然后，对于每个组，同时吸入部件。

44. 发明授权

US06785008B2 Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus 失效
标题翻译：用于测量零件安装装置的偏移的板，以及用于测量零件安装装置的偏移的方法
公开(公告)号：US06785008B2
公开(公告)日：2004-08-31
申请号：US09931413
申请日：2001-08-17
申请人： Hiroshi Uchiyama , Tetsutarou Hachimura , Osamu Okuda , Noriaki Yoshida
发明人： Hiroshi Uchiyama , Tetsutarou Hachimura , Osamu Okuda , Noriaki Yoshida
IPC分类号： G01O2100
CPC分类号： H05K3/0008 , H05K1/0269 , H05K3/303 , H05K13/08 , H05K2201/09918 , H05K2201/10204
摘要： An offset measuring board is formed of a rectangular metal plate which can be positioned at a component mounting position by a positioning device and which has at least in proximity to one corner portion thereof a recognition through hole, serving as a recognition mark, having a black bottom face within a recessed portion.
摘要翻译：偏移测量板由矩形金属板形成，该矩形金属板可以通过定位装置定位在部件安装位置处，并且至少具有一个角部，其具有用作识别标记的识别通孔，具有黑色凹陷部分内的底面。

45. 发明授权

US06754549B2 Parts mounting apparatus and parts checking method by the same 失效
标题翻译：零件安装装置和部件检查方法相同
公开(公告)号：US06754549B2
公开(公告)日：2004-06-22
申请号：US10053725
申请日：2002-01-24
申请人： Tetsuya Mori , Takaaki Yokoi , Hiroshi Uchiyama , Kenji Kamakura
发明人： Tetsuya Mori , Takaaki Yokoi , Hiroshi Uchiyama , Kenji Kamakura
IPC分类号： G06F1900
CPC分类号： H05K13/086 , Y10T29/53174
摘要： The present invention allows a parts remaining number to be efficiently controlled using adaptability check result of an electronic part added during operation, and allows the electronic part to be mounted without mistake. For this object, the present invention includes: parts remaining number controlling means for monitoring a parts remaining number decreasing with mounting and for issuing warning of running out of part when a predetermined remaining number is reached; parts checking means for checking and confirming whether or not an added part for the part to which the warning of running out of part is issued or an added part when a kind is changed is a correct kind of part and for outputting check result and a parts adding number; and check result determining means for monitoring whether or not the check of the part to be taken out is finished when the mounting unit takes out the part from the part feeding means, confirming the check result when it is determined as finished, and renewing the parts remaining number based on the parts adding number when the check result is correct.
摘要翻译：本发明允许使用在操作期间添加的电子部件的适应性检查结果来有效地控制部件剩余数量，并且允许电子部件被安装没有错误。为此目的，本发明包括：零件剩余数量控制装置，用于监视随着安装状态而减少的零件剩余数量，并且当达到预定的剩余数量时发出零件的超出警告; 零件检查装置，用于检查和确认是否发出用于发出部件的警告的部件的添加部件或者当种类改变时添加的部件是正确的一部分并且用于输出检查结果和部件加数以及检查结果确定装置，用于当安装单元从零件供给装置取出零件时确定是否完成要取出的零件的检查，确定确定结束时的检查结果，并更新零件当检查结果正确时，基于部件添加号码的剩余编号。

46. 发明授权

US06282779B1 Device and method for mounting electronic parts 有权
标题翻译：用于安装电子部件的装置和方法
公开(公告)号：US06282779B1
公开(公告)日：2001-09-04
申请号：US09308362
申请日：1999-05-18
申请人： Tomoyuki Nakano , Naoto Mimura , Hirofumi Obara , Hiroshi Uchiyama
发明人： Tomoyuki Nakano , Naoto Mimura , Hirofumi Obara , Hiroshi Uchiyama
IPC分类号： H05K330
CPC分类号： H05K13/0404 , H05K13/0409 , Y10S29/044 , Y10T29/4913 , Y10T29/5303 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In a component mounting apparatus, a component (8) is held, positioned and mounted at a predetermined position of a member (4) to be mounted. After the component (8) is mounted to the member (4), a component holding member (5) is raised by a distance corresponding approximately to a push-in amount by which the component holding member (5) has been moved down to mount the component, then stopped to retain the component (8), is kept in this state while retaining the component for a fixed time, and is raised again to a predetermined position.
摘要翻译：在部件安装装置中，部件（8）被保持定位并安装在待安装的部件（4）的预定位置。在部件（8）安装到部件（4）上之后，部件保持部件（5）被升高大约相当于推动部件保持部件（5）向下移动的推入量然后将组件（8）停止以保持组件（8），同时保持组件一段固定的时间，并且再次升高到预定位置。

47. 发明授权

US5543017A Atmospheric pressure glow discharge plasma treatment method 失效
标题翻译：大气压辉光放电等离子体处理方法
公开(公告)号：US5543017A
公开(公告)日：1996-08-06
申请号：US427687
申请日：1995-04-24
申请人： Hiroshi Uchiyama , Masuhiro Kogoma , Satiko Okazaki
发明人： Hiroshi Uchiyama , Masuhiro Kogoma , Satiko Okazaki
IPC分类号： B01J15/00 , B01J19/08 , B29C59/12 , D06M10/00 , D06M10/02 , H01J37/32 , H05H1/46 , B05D3/06
CPC分类号： B29C59/12 , B01J15/00 , B01J19/088 , B01J2219/0894 , B29C2059/145
摘要： An atmospheric pressure glow discharge plasma treatment method, in which a gaseous mixture comprising argon, argon and helium, or argon and hydrogen, mixed with water vapor or water vapor and ketones at room temperature or a specified temperature, is introduced into a plasma reactor having a dielectric-coated electrode comprising a solid dielectric disposed on the surface of at least one of opposing electrodes, and a high-frequency voltage is applied under atmospheric pressure to generate atmospheric pressure glow discharge and excite a plasma, thereby making surface treatment of plastics or fibers disposed between the electrodes.
摘要翻译：大气压辉光放电等离子体处理方法，其中将包含氩，氩和氦，或氩和氢的气体混合物与水蒸气或水蒸汽和酮在室温或特定温度下混合，引入等离子体反应器，电介质涂覆的电极，其包括设置在至少一个相对电极的表面上的固体电介质，并且在大气压下施加高频电压以产生大气压辉光放电并激发等离子体，从而进行塑料的表面处理或布置在电极之间的光纤。

48. 发明授权

US5124173A Atmospheric pressure plasma surface treatment process 失效
标题翻译：大气压力等离子体表面处理工艺
公开(公告)号：US5124173A
公开(公告)日：1992-06-23
申请号：US731314
申请日：1991-07-17
申请人： Hiroshi Uchiyama , Satiko Okazaki , Masuhiro Kogoma
发明人： Hiroshi Uchiyama , Satiko Okazaki , Masuhiro Kogoma
IPC分类号： H05H1/26 , B01J19/08 , B29C59/12 , B29C59/14 , C08J7/00 , D06M10/00 , D06M10/02 , D06M101/00 , D06M101/16 , D06M101/18 , D06M101/20 , D06M101/22 , D06M101/32 , D06M101/34
CPC分类号： D06M10/025 , B29C59/12 , B29C59/14 , B29C2059/145 , D06M2101/18 , D06M2101/22 , D06M2101/26 , D06M2101/32 , D06M2101/34 , D06M2200/00
摘要： According to this invention, there is provided an atmospheric pressure plasma surface treatment process comprising the steps of introducing a gas in a plasma reaction apparatus having a pair of dielectric-covered electrodes having opposing surfaces on at least one of which is provided with a solid dielectric; performing plasma excitation under atmospheric pressure; and surface treating an object placed between the opposing electrodes, wherein the gas introduced is a gaseous composition consisting essentially of argon, helium and/or ketone. This process makes it possible to quickly imparting hydrophilic nature to surfaces of an object made of a plastic to be treated. The hydrophilic nature given lasts long.

49. 发明授权

US4131612A Process for purifying crude dibenzylidene sorbitol 失效
标题翻译：纯化二亚苄基山梨糖醇的方法
公开(公告)号：US4131612A
公开(公告)日：1978-12-26
申请号：US795185
申请日：1977-05-09
申请人： Hiroshi Uchiyama
发明人： Hiroshi Uchiyama
IPC分类号： C07D317/18 , C07D493/04 , C07D319/04 , C07D317/10
CPC分类号： C07D493/04
摘要： Purified dibenzylidene sorbitol is prepared by mixing crude dibenzylidene sorbitol containing monobenzylidene sorbitol and tribenzylidene sorbitol as by-product impurities with a lower aliphatic alcohol to dissolve the impurities, and separating and recovering the undissolved dibenzylidene sorbitol. This process affords dibenzylidene sorbitol having a purity of at least 98% from crude dibenzylidene sorbitol with a purity of about 95%.
摘要翻译：通过将含有单亚苄基山梨糖醇的粗二亚苄基山梨醇和作为副产物杂质的三亚苄基山梨醇与低级脂族醇混合以溶解杂质，分离和回收未溶解的二亚苄基山梨糖醇来制备纯化的二亚苄基山梨糖醇。该方法得到纯度为约95％的来自粗二亚苄基山梨糖醇的纯度至少为98％的二亚苄基山梨糖醇。

50. 发明授权

US4008345A Process for fire-proofing treatment of shaped articles of aromatic polyamides 失效
标题翻译：芳香族聚酰胺成型制品的防火处理工艺
公开(公告)号：US4008345A
公开(公告)日：1977-02-15
申请号：US508907
申请日：1974-09-24
申请人： Yoshihiko Imanaka , Hiroshi Uchiyama
发明人： Yoshihiko Imanaka , Hiroshi Uchiyama
IPC分类号： D06M11/00 , C08J7/06 , C08J7/12 , C08J7/14 , D06M11/13 , D06M11/155 , D06M11/17 , D06M11/26 , D06M11/28 , D06M11/55 , D06M11/68 , D06M11/70 , D06M11/71 , D06M11/72 , D06M13/02 , D06M13/244 , D06M13/248 , D06M13/256 , D06M13/262 , D06M13/282 , D06M13/285 , D06M13/288 , D06M13/292 , D06M13/298 , D06M13/322 , D06M13/325 , D06M13/335 , D06M13/338 , D06M13/392 , D06M13/402 , D06M13/422 , D06M13/432 , D06M13/438 , D06M13/44 , D06M13/447 , D06M13/453 , D06M101/00 , D06M101/16 , D06M101/30 , D06M101/34 , D06M101/36 , B05D3/02
CPC分类号： C08J7/06 , D06M11/68 , D06M11/70 , D06M11/71 , D06M11/72 , D06M13/325 , D06M13/335 , D06M13/432 , C08J2377/00 , D06M2101/36 , Y10S428/921 , Y10T428/31765 , Y10T442/2672 , Y10T442/268
摘要： A process for fire-proofing treatment of shaped articles of aromatic polyamides which comprises contacting a shaped article of an aromatic polyamide with an aqueous solution of a phosphorus-containing inorganic compound free from halogen and sulfur, drying it and then post heat-treating it; characterized in that said shaped article is contacted with an aqueous solution of a treating compound selected from the group consisting of halogen- and sulfur-free, phosphorus-containing inorganic acids and their ammonium, amine and urea salts in a concentration of about 2 to about 30% by weight, dried at a temperature of not more than about 150.degree. C., and then post heat-treated at a temperature of about 300.degree. C. to about 450.degree. C.
摘要翻译：一种芳香族聚酰胺成型体的防火处理方法，其特征在于，将芳香族聚酰胺的成形体与不含卤素和硫的含磷无机化合物的水溶液接触，进行干燥后进行后处理。其特征在于，所述成型制品与选自无卤素和无硫的含磷无机酸及其铵，胺和脲盐的处理化合物的水溶液接触，浓度为约2至约 30重量％，在不超过约150℃的温度下干燥，然后在约300℃至约450℃的温度下进行热处理。

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