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1. 发明授权

US09426899B2 Electronic component assembly 有权
标题翻译：电子元器件组装
公开(公告)号：US09426899B2
公开(公告)日：2016-08-23
申请号：US12439602
申请日：2008-04-24
申请人： Takashi Kitae , Seiichi Nakatani , Seiji Karashima
发明人： Takashi Kitae , Seiichi Nakatani , Seiji Karashima
IPC分类号： B23P19/00 , H05K13/04 , H05K3/34 , H01L21/683 , H01L23/00 , H01L29/06 , H05K3/32
CPC分类号： H05K3/3436 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/83 , H01L29/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11524 , H01L2224/13099 , H01L2224/16 , H01L2224/293 , H01L2224/73204 , H01L2224/8101 , H01L2224/81201 , H01L2224/81801 , H01L2224/83888 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10157 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K3/323 , H05K3/3484 , H05K2201/09036 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , Y10T29/49137 , Y10T29/49144 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component assembly including a first electronic component including a plurality of first electrodes provided on a first major surface of the first electronic component; and a second electronic component including a plurality of second electrodes provided on a first major surface of the second electronic component. A resin including solder powder is provided between the first electronic component and the second electronic component. Also, solder connections are provided to electrically interconnect the first and second electrodes. Elongated grooves are provided in surfaces of the electronic components. The grooves are provided for generation of bubbles during the process for producing the electronic component assembly to promote movement of the solder powder.
摘要翻译：一种电子部件组件，包括：第一电子部件，包括设置在第一电子部件的第一主表面上的多个第一电极; 以及包括设置在所述第二电子部件的第一主表面上的多个第二电极的第二电子部件。包括焊料粉末的树脂设置在第一电子部件和第二电子部件之间。此外，提供焊接连接以电互连第一和第二电极。在电子部件的表面设有细长的槽。在制造电子部件组件的过程中提供凹槽以产生气泡，以促进焊料粉末的移动。

2. 发明授权

US09390989B2 Enhanced modularity in heterogeneous 3D stacks 有权
标题翻译：在异构3D堆栈中增强模块化
公开(公告)号：US09390989B2
公开(公告)日：2016-07-12
申请号：US13535694
申请日：2012-06-28
申请人： Philip G. Emma , Eren Kursun , Jude A. Rivers
发明人： Philip G. Emma , Eren Kursun , Jude A. Rivers
IPC分类号： G06F17/50 , H01L23/14 , H05K3/46 , H01L23/13 , H01L23/538 , H01L25/065 , H01L25/18 , H05K3/30 , H01L21/48
CPC分类号： H01L23/147 , H01L21/4803 , H01L23/13 , H01L23/5382 , H01L23/5389 , H01L25/0652 , H01L25/18 , H01L2225/06575 , H01L2225/06589 , H01L2924/0002 , H01L2924/15311 , H05K3/30 , H05K3/465 , Y10T29/49128 , Y10T29/4913 , Y10T29/49137 , Y10T29/49146 , H01L2924/00
摘要： A computer program product for generating and implementing a three-dimensional (3D) computer processing chip stack plan. The computer readable program code includes computer readable program code configured for receiving system requirements from a plurality of clients, identifying common processing structures and technologies from the system requirements, and assigning the common processing structures and technologies to at least one layer in the 3D computer processing chip stack plan. The computer readable program code is also configured for identifying uncommon processing structures and technologies from the system requirements and assigning the uncommon processing structures and technologies to a host layer in the 3D computer processing chip stack plan. The computer readable program code is further configured for determining placement and wiring of the uncommon structures on the host layer, storing placement information in the plan, and transmitting the plan to manufacturing equipment. The manufacturing equipment forms the 3D computer processing chip stack.
摘要翻译：一种用于生成和实现三维（3D）计算机处理芯片堆栈计划的计算机程序产品。计算机可读程序代码包括被配置为从多个客户端接收系统需求的计算机可读程序代码，从系统要求中识别公共处理结构和技术，以及将公共处理结构和技术分配给3D计算机处理中的至少一个层芯片堆栈计划。计算机可读程序代码还被配置用于根据系统要求识别不常见的处理结构和技术，并将不常见的处理结构和技术分配给3D计算机处理芯片堆栈计划中的主机层。计算机可读程序代码还被配置用于确定主机层上的不常见结构的布置和布线，将布置信息存储在计划中，并将该计划传送到制造设备。制造设备构成3D计算机处理芯片堆栈。

3. 发明授权

US09075208B2 Method for assembling a photoelectric conversion module 有权
标题翻译：组装光电转换模块的方法
公开(公告)号：US09075208B2
公开(公告)日：2015-07-07
申请号：US11700792
申请日：2007-02-01
申请人： Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi
发明人： Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi
IPC分类号： H05K3/30 , G02B6/42
CPC分类号： G02B6/4227 , G02B6/421 , G02B6/4214 , G02B6/4224 , G02B6/4246 , Y10T29/49137 , Y10T29/5313
摘要： A method of assembling a photoelectric conversion module is disclosed. The photoelectric conversion module includes a circuit board on which are mounted a light emitting element, a light receiving element, and an optical element optically connected to the light emitting element and the light receiving element. The light emitting element is positioned on the circuit board based on a positioning mark formed on the circuit board beforehand. The light receiving element and the optical element are positioned based on a position of a light emission point of the light emitting element.
摘要翻译：公开了组装光电转换模块的方法。光电转换模块包括电路板，其上安装有发光元件，光接收元件和与发光元件和光接收元件光学连接的光学元件。发光元件预先基于形成在电路板上的定位标记而位于电路板上。光接收元件和光学元件基于发光元件的发光点的位置而定位。

4. 发明授权

US08935847B2 Modular reactive distillation emulation elements integrated with instrumentation, control, and simulation algorithms 有权
标题翻译：与仪表，控制和仿真算法集成的模块化反应蒸馏仿真元件
公开(公告)号：US08935847B2
公开(公告)日：2015-01-20
申请号：US12882918
申请日：2010-09-15
申请人： Lester F. Ludwig
发明人： Lester F. Ludwig
IPC分类号： H05K3/30 , B01D3/00 , B01D3/02 , B01D3/20 , B01D3/32
CPC分类号： B01D3/009 , B01D3/02 , B01D3/205 , B01D3/32 , Y10T29/49002 , Y10T29/4913 , Y10T29/49137 , Y10T29/49623
摘要： A method for creating laboratory-scale reactive distillation apparatus from provided modular components is described. At least two types of modular distillation column stages are provided. A first type of modular stage comprises two physical interfaces for connection with a respective physical interface of another modular stage. A second type modular stage comprises one such physical interface. At least one type of tray is provided for insertion into the first type of modular stage. A clamping arrangement is provided for joining together two modular stages at their respective physical interfaces for connection to form a joint. The invention provides for at least three modular stages can be joined. At least one sensor or sensor array can be inserted into each modular stage. At least one controllable element can be inserted into each modular stage. The invention provides for study of traditional, advanced, and photochemical types of reactive distillation.
摘要翻译：描述了从提供的模块化组件创建实验室规模的反应蒸馏装置的方法。提供至少两种类型的模块化蒸馏塔级。第一类模块级包括两个物理接口，用于与另一个模块级的相应物理接口连接。第二类模块级包括一个这样的物理接口。提供至少一种类型的托盘用于插入第一类型的模块化阶段。提供了一种夹紧装置，用于将两个模块级连接在其各自的物理接口处用于连接以形成接头。本发明提供至少可以连接三个模块化阶段。至少一个传感器或传感器阵列可以插入每个模块化阶段。至少一个可控元件可插入每个模块化阶段。本发明提供了反应蒸馏的传统，先进和光化学类型的研究。

5. 发明授权

US08531297B2 High-speed RFID circuit placement method and device 有权
公开(公告)号：US08531297B2
公开(公告)日：2013-09-10
申请号：US12607534
申请日：2009-10-28
申请人： Scott Wayne Ferguson , Ralf Linkmann , Werner Kiehne
发明人： Scott Wayne Ferguson , Ralf Linkmann , Werner Kiehne
IPC分类号： G08B13/14
CPC分类号： G06K19/07718 , G06K7/0095 , G06K19/07749 , G06K19/07752 , G06K19/07756 , H01L21/67144 , H01L21/67271 , H01L2224/75822 , Y10T29/49004 , Y10T29/49018 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137
摘要： A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

6. 再颁专利

USRE44384E1 Method and device for mounting electronic component 失效
公开(公告)号：USRE44384E1
公开(公告)日：2013-07-23
申请号：US11388168
申请日：2006-03-22
申请人： Masato Hirano , Yoshinori Sakai , Tateo Nakashima
发明人： Masato Hirano , Yoshinori Sakai , Tateo Nakashima
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/04 , H05K13/041 , H05K13/0413 , H05K13/0815 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49762 , Y10T29/49764 , Y10T29/53 , Y10T29/53039 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

7. 发明申请

US20120159781A1 ROTARY MOUNTING HEAD UNIT, AND METHOD AND APPARATUS FOR MOUNTING COMPONENT 有权
标题翻译：旋转安装头单元，以及安装组件的方法和装置
公开(公告)号：US20120159781A1
公开(公告)日：2012-06-28
申请号：US13334137
申请日：2011-12-22
申请人： Tanizaki Masahiro
发明人： Tanizaki Masahiro
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0452 , H05K13/041 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/53174
摘要： A component mounting apparatus including: plural spindles respectively including nozzles, each spindle rotating about a first pivot and each nozzle picking up a component; a head body rotating about a second pivot substantially parallel to a first pivot and rotatably supporting the spindles; and a controller controlling the spindles and the head body to perform: a pickup operation in which the spindle rotates about the first pivot from an initial orientation to a pickup orientation, the nozzle picks up the component, and the spindle rotates from the pickup orientation to the initial orientation so that the component is oriented to a mounting orientation at which the component is to be mounted on a substrate; and a mounting operation in which the picked-up component is transferred to a mounting position of the substrate during which each spindle is retained at the initial orientation.
摘要翻译：一种部件安装装置，包括：多个主轴，分别包括喷嘴，每个主轴围绕第一枢轴旋转，每个喷嘴拾取部件; 主体围绕基本上平行于第一枢轴并可旋转地支撑所述心轴的第二枢轴旋转; 以及控制器，其控制所述心轴和所述头体，以执行：所述主轴围绕所述第一枢轴从初始定向旋转到拾取方向的拾取操作，所述喷嘴拾取所述部件，并且所述主轴从所述拾取方向旋转到所述初始取向使得所述部件被定向成将所述部件安装在基板上的安装方向; 以及安装操作，其中拾取部件被转移到基板的安装位置，在该安装位置，每个主轴在初始定向处被保持。

8. 发明授权

US08136737B2 System comprised of a chip and a substrate and method of assembling such a system 有权
标题翻译：由芯片和基板组成的系统以及组装这种系统的方法
公开(公告)号：US08136737B2
公开(公告)日：2012-03-20
申请号：US12444652
申请日：2007-09-25
申请人： Anton Salfelner
发明人： Anton Salfelner
IPC分类号： G06K19/06
CPC分类号： H01L24/81 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L22/34 , H01L23/48 , H01L23/49838 , H01L2223/6677 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/81121 , H01L2224/81385 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , Y10T29/49137 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A system comprises a chip (71) and a substrate (78). The chip (71) comprises a circuitry and a mounting surface (83) with first and second contacts (73, 74, 75, 76). The substrate (78) comprises a surface (90) with first and second contact pads (79, 80) and an electrically conductive pad (91) connected to the first contact pad (79) by a low-resistive connection (93). The chip (71) is attached to the substrate (78) so that the mounting surface (83) is spaced apart from the first contact pad (75) and the electrically conductive pad (91). The mounting surface (83) overlaps partly the first contact pad (79) with a first overlapping area (B1) resulting in a first stray capacitor (C1) and the electrically conductive pad (91) with a second overlapping area (B3) resulting in a second stray capacitor (C3). The first contact pad (79) and the electrically conductive pad (91) are arranged on the surface (90) of the substrate (78) such that, if the chip (21) is misaligned laterally in respect to the surface (90), then the first overlapping area (B1) increases while the second overlapping area (B3) decreases, or the first overlapping area (B1) decreases while the second overlapping area (B3) increases.
摘要翻译：系统包括芯片（71）和基板（78）。芯片（71）包括具有第一和第二触点（73,74,75,76）的电路和安装表面（83）。衬底（78）包括具有第一和第二接触焊盘（79,80）的表面（90）和通过低电阻连接（93）连接到第一接触焊盘（79）的导电焊盘（91）。芯片（71）附接到基板（78），使得安装表面（83）与第一接触焊盘（75）和导电焊盘（91）间隔开。安装表面（83）部分地与第一重叠区域（B1）重叠第一接触焊盘（79），导致第一杂散电容器（C1）和导电焊盘（91）具有第二重叠区域（B3），导致第二杂散电容器（C3）。第一接触焊盘（79）和导电焊盘（91）布置在基板（78）的表面（90）上，使得如果芯片（21）相对于表面（90）横向错位，那么第一重叠区域（B1）增加，而第二重叠区域（B3）减小，或者第一重叠区域（B1）减小，而第二重叠区域（B3）增加。

9. 发明授权

US08087153B2 Manufacturing method of an electromechanical transducer 有权
标题翻译：机电换能器的制造方法
公开(公告)号：US08087153B2
公开(公告)日：2012-01-03
申请号：US12489315
申请日：2009-06-22
申请人： Ayako Kato , Chienliu Chang
发明人： Ayako Kato , Chienliu Chang
IPC分类号： G01R3/00
CPC分类号： H04R31/00 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T29/49137 , Y10T29/49155
摘要： A handling member is prepared that provides a channel that can withstand subsequent back face processing as to a substrate having elements made up of a substrate and a membrane, and the handling member is fixed to the substrate so that at least a portion within the elements are supported by the handling member. This provides a manufacturing method wherein the physical strength of an element at the time of manufacturing an electromechanical transducing apparatus is strengthened, and the handling member is easily detached in a short time after processing of the element.
摘要翻译：制备处理构件，其提供能够承受对由具有由基板和膜构成的元件的基板的后续后处理的通道，并且处理构件固定到基板，使得元件内的至少一部分为由处理构件支撑。这提供了一种制造方法，其中在制造机电换能装置时元件的物理强度得到加强，并且处理构件在元件处理后的短时间内容易地分离。

10. 发明授权

US08020283B2 High-speed RFID circuit placement device 有权
标题翻译：高速RFID电路放置装置
公开(公告)号：US08020283B2
公开(公告)日：2011-09-20
申请号：US12685191
申请日：2010-01-11
申请人： Jason D. Munn
发明人： Jason D. Munn
IPC分类号： B23P19/00
CPC分类号： G06K19/07718 , G06K19/07749 , G06K19/07752 , Y10T29/49002 , Y10T29/49018 , Y10T29/4902 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.
摘要翻译：高速处理包括从具有第一间距的载体网上移除芯片或插入件，并将芯片或插入件传送到诸如RFID天线结构之类的电气部件，在具有第二间距的移动的网上。根据一种方法，当转印鼓静止时，转印鼓通过拾取芯片将碎片或插入物转移到电动元件的移动幅材上，并且当转印鼓旋转时将转印鼓转移到移动幅材上，使得转印鼓的切向速度转印鼓基本上等于移动幅材的线速度。根据另一种方法，初级滚筒从具有第一间距的载体网移除芯片或插入物，并将芯片或插入件传送到可变转动的次级鼓，然后将芯片或插入件放置在具有第二音调

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