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1. 发明申请

US20180177088A1 CONTROL DEVICE AND CONTROL METHOD OF COMPONENT MOUNTING MACHINE 审中-公开
公开(公告)号：US20180177088A1
公开(公告)日：2018-06-21
申请号：US15580879
申请日：2015-06-10
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Hidenori GOTO , Yusuke YAMAKAGE , Masataka IWASAKI
IPC分类号： H05K13/04 , H05K13/08 , H05K13/00 , H05K13/02
CPC分类号： H05K13/0452 , H05K13/0853 , H05K13/089
摘要： To provide a control device and a control method of a component mounting machine which is capable of improving the accuracy of mounting control. In a case where the holding member is moved from a current position to a predetermined processing position within the component mounting machine, the control device of the component mounting machine moves a holding member to a preparation position which is set to a defined propelling direction and distance with respect to the processing position, and then moves the holding member from the preparation position to a mounting position.

2. 发明申请

US20180027708A1 MOUNTING PROCESSING UNIT, A MOUNTING DEVICE, AND A CONTROL METHOD OF A MOUNTING PROCESSING UNIT 审中-公开
公开(公告)号：US20180027708A1
公开(公告)日：2018-01-25
申请号：US15550646
申请日：2015-02-13
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Koji KAWAGUCHI , Junichi NARITA , Mitsuru SANJI , Kenzo ISHIKAWA
IPC分类号： H05K13/04 , H05K3/30 , H05K13/02
CPC分类号： H05K13/08 , B25J15/0616 , H05K3/301 , H05K13/0413 , H05K13/0469 , H05K13/0853
摘要： A mounting device is provided with a first raising and lowering drive section configured to raise and lower an entire syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section 34 that raises and lowers the suction nozzle only of the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component and information of the height of a board. With the mounting device, it is possible to move the entire syringe member to which the suction nozzle 28 is attached to a position closer to the board in accordance with the height of the board and the thickness of the component.

3. 发明申请

US20170325371A1 CONTROL DEVICE OF ELECTRONIC COMPONENT MOUNTING MACHINE AND DATA INPUT DEVICE FOR CONTROL DEVICE THEREOF 审中-公开
公开(公告)号：US20170325371A1
公开(公告)日：2017-11-09
申请号：US15525813
申请日：2014-11-11
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Shigeto OYAMA , Tomokatsu KUBOTA , Jun IISAKA
IPC分类号： H05K13/04
CPC分类号： H05K13/0882 , H05K13/0452 , H05K13/0853
摘要： The control device controls an operation of a mounting head of an electronic component mounting machine. The control device is used when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles. In the control device, some of the multiple divided boards within the printed circuit board are set as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board. In addition, in the control device, the multiple suction nozzles suck the electronic components to be mounted on the divided board within one group at the same time.

4. 发明授权

US09811078B2 Method for providing instruction on setup changeover work in component mounting system, and component mounting system 有权
公开(公告)号：US09811078B2
公开(公告)日：2017-11-07
申请号：US14295508
申请日：2014-06-04
申请人： PANASONIC CORPORATION
发明人： Hiroki Sagara , Takuya Yamazaki , Hirokazu Takehara
IPC分类号： G06F19/00 , G05B19/418
CPC分类号： G05B19/41865 , H05K13/0853 , Y02P90/04 , Y02P90/20
摘要： A component mounting system derives work instruction information defining setup changeover work necessary to change an arrangement state of parts feeders from a current arrangement state to a first arrangement state for producing a first substrate type based on current feeder arrangement information corresponding to the current arrangement state and first feeder arrangement information corresponding to the first arrangement state. The work instruction information includes a plurality of pieces of unit work information. Each of the pieces of the unit work information includes kind information indicating a kind of execution operation and feeder state information indicating states before and after execution of work on the parts feeder targeted in the setup changeover work. The pieces of unit work information are displayed on the display screen so as to be arranged in work sequence to be executed.

5. 发明授权

US08186047B2 Method of mounting electronic component 有权
标题翻译：安装电子元器件的方法
公开(公告)号：US08186047B2
公开(公告)日：2012-05-29
申请号：US12434500
申请日：2009-05-01
申请人： Akira Aoki , Makio Kameda , Yoshihara Fukushima , Katsuyuki Seto , Hideaki Fukushima
发明人： Akira Aoki , Makio Kameda , Yoshihara Fukushima , Katsuyuki Seto , Hideaki Fukushima
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/0853 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53178 , Y10T29/53191
摘要： The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
摘要翻译：本发明旨在防止在不降低印刷电路板制造速度的情况下安装适当的电子部件的操作和提高可用性的干扰。通过吸嘴吸附保持的电子部件的吸引状态由线传感器单元检测。当检测结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处置之后，部件识别照相机拍摄作为检测结果被判定为正确的电子部件的图像，并且识别处理装置执行识别处理。当识别结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处理之后，仅将作为识别的结果判定为合适的电子部件安装在印刷电路板上。

6. 发明申请

US20080154392A1 Operating Time Reducing Method, Operating Time Reducing Apparatus, Program and Component Mounter 失效
标题翻译：运行时间减少方法，运行时间减少装置，程序和组件贴片机
公开(公告)号：US20080154392A1
公开(公告)日：2008-06-26
申请号：US11792833
申请日：2005-12-02
申请人： Yasuhiro Maenishi , Chikashi Konishi , Akihito Yamasaki , Takeshi Kuribayashi
发明人： Yasuhiro Maenishi , Chikashi Konishi , Akihito Yamasaki , Takeshi Kuribayashi
IPC分类号： G05B13/02
CPC分类号： H05K13/085 , H05K13/0853 , Y10T29/4913 , Y10T29/53174 , Y10T29/53191
摘要： An operating time reducing method in which a processing procedure of a component mounting order determination method can be changed depending on the type of an operation loss that affects a component mounting time for mounting components onto the board is an operating time reducing method for a component mounter, wherein the method includes: an operation loss identifying step (S22 to S26, S30, S34 to S38, S42 to S46) of identifying an operation loss to be resolved in the component mounter; a processing procedure selecting step (S28, S32, S40, S48, S50, S52) of selecting, based on the identified operation loss, a processing procedure for reducing an operating time of the component mounter; and a processing procedure executing step (S28, S32, S40, S48, S50, S52) of executing the selected processing procedure.
摘要翻译：可以根据影响用于将部件安装到板上的部件安装时间的操作损失的类型来改变部件安装顺序确定方法的处理过程的操作时间缩短方法是用于部件安装器的操作时间减少方法，其中所述方法包括：识别要在组件安装机中解决的操作损失的操作损失识别步骤（S22至S26，S30，S34至S38，S42至S46）; 基于所识别的操作损失，选择用于减少部件安装机的操作时间的处理过程的处理过程选择步骤（S28，S32，S40，S48，S50，S52）以及执行所选择的处理过程的处理过程执行步骤（S28，S32，S40，S48，S50，S52）。

7. 发明授权

US07331105B2 Method for placing components by means of at least one component placement unit 失效
标题翻译：通过至少一个部件放置单元放置部件的方法
公开(公告)号：US07331105B2
公开(公告)日：2008-02-19
申请号：US11080675
申请日：2005-03-16
申请人： Sebastiaan Edward van der Graaf
发明人： Sebastiaan Edward van der Graaf
IPC分类号： H05K3/30
CPC分类号： H05K13/0413 , H05K13/0853 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178
摘要： Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup position and a component placement position located on a substrate. In addition, a total distance to be covered by the component placement unit is calculated for the number of components to be placed, wherein the number of components to be placed is determined beforehand. This total distance value is subsequently compared with a reference value. If the total distance value is greater than the reference value, the substrate to be provided with the components is rotated with respect to the component pickup position about an axis that extends perpendicularly to the substrate.
摘要翻译：提供了一种用于通过至少一个组件放置单元放置组件的方法和系统，其中组件放置单元在组件拾取位置和位于衬底上的组件放置位置之间的距离上移动。此外，针对要放置的部件的数量计算要由部件放置单元覆盖的总距离，其中预先确定要放置的部件的数量。该总距离值随后与参考值进行比较。如果总距离值大于参考值，则要设置组件的衬底相对于构件拾取位置围绕垂直于衬底延伸的轴线旋转。

8. 发明申请

US20050259862A1 Device and method for recognizing recognition marks for component placement 审中-公开
标题翻译：用于识别组件放置的识别标记的装置和方法
公开(公告)号：US20050259862A1
公开(公告)日：2005-11-24
申请号：US10522742
申请日：2003-07-31
申请人： Akira Kabeshita , Eiichi Hachiya
发明人： Akira Kabeshita , Eiichi Hachiya
IPC分类号： H05K13/04 , H05K1/02 , H05K3/00 , H05K13/08 , G06K9/00
CPC分类号： H05K13/0812 , H05K1/0269 , H05K3/0008 , H05K13/0853
摘要： In a component placement recognition mark recognizing device for recognizing recognition marks for component placement that are provided corresponding to component placement positions where components are to be placed in a plurality of partition areas on a board. The device has a recognition camera for recognizing the recognition marks straightly disposed in the plurality of areas and a moving device for running the recognition camera at a generally uniform velocity in a deposition direction in which the recognition marks are straightly disposed. The recognition marks are recognized with use of the recognition camera while the recognition camera is run by the moving device.
摘要翻译：在组件放置识别标识识别装置中，用于识别与元件放置位置相对应的元件放置识别标记，其中元件放置位置将被放置在板上的多个分区中。该装置具有用于识别在多个区域中直线设置的识别标记的识别摄像机，以及用于在识别标记被直线设置的沉积方向上以大致均匀的速度运行识别照相机的移动装置。当识别照相机由移动装置运行时，使用识别照相机识别识别标记。

9. 发明授权

US06658313B1 Apparatus for adjusting the origins of module heads of a surface mounting apparatus and method therefor 失效
标题翻译：用于调整表面安装装置的模块头的起点的装置及其方法
公开(公告)号：US06658313B1
公开(公告)日：2003-12-02
申请号：US09576863
申请日：2000-05-22
申请人： Chang Hyun Lee
发明人： Chang Hyun Lee
IPC分类号： G06F1900
CPC分类号： H05K13/0413 , B25J9/1692 , H05K13/0818 , H05K13/0853 , Y10T29/4913 , Y10T29/53187
摘要： There is disclosed an apparatus for adjusting the origins of module heads of a surface mounting apparatus for a dual gantry, the adjusting apparatus, and method therefor. The invention includes the X-Y gantry consisting of first and second X-axis linear motors and first and second Y-axis linear motors, and having X-Y plane on which first and second reference points and a mark indicating the origin (MIO) are set, first and second module heads installed at the first a nd second X-axis linear motors, first and second vision units installed in vicinity of the first and second module heads, respectively, and for sensing the first and second reference points and the MIO and generating and outputting coordinates of the sensed first and second reference points and the MIO, and a controller for driving the first and second X-axis linear motors and the first and second Y-axis linear motors to move the first and second vision units to the first and second reference points and the MIO, receiving the coordinates output from the first and second vision units to compute offset values relating to the first and second module heads, and, if there are the offset values, setting the origins of the first and second module heads by correcting the offset values. Thus, the repeated precision of the adjustment of the origins can be improved, also, the apparatus for adjusting the origins of the first and second module heads are easily incorporated into the surface mounting apparatus for the dual gantry.
摘要翻译：公开了一种用于调整双台架的表面安装装置的模块头的起点的装置，调节装置及其方法。本发明包括由第一和第二X轴线性电动机和第一和第二Y轴线性电动机组成的XY台架，并且具有第一和第二参考点和指示原点（MIO）的标记的XY平面，第一以及安装在第一和第二X轴线性电动机上的第二模块头，分别安装在第一和第二模块头附近的第一和第二视觉单元，并且用于感测第一和第二参考点和MIO，输出感测到的第一和第二参考点和MIO的坐标，以及用于驱动第一和第二X轴线性电动机以及第一和第二Y轴线性电动机的控制器，以将第一和第二视觉单元移动到第一和第二第二参考点和MIO，接收从第一和第二视觉单元输出的坐标以计算与第一和第二模块头相关的偏移值，并且如果存在偏移值，则s 通过校正偏移值来修改第一和第二模块头的起点。因此，可以提高原点调整的重复精度，而且用于调节第一和第二模块头的来源的装置也容易地并入用于双机架的表面安装装置中。

10. 发明申请

US20170359901A1 METHODS FOR DISPENSING A LIQUID OR VISCOUS MATERIAL ONTO A SUBSTRATE 审中-公开
公开(公告)号：US20170359901A1
公开(公告)日：2017-12-14
申请号：US15176570
申请日：2016-06-08
申请人： NORDSON CORPORATION
发明人： Per Orla-Jensen , Kenneth S. Espenschied , Patrick T. Hogan
IPC分类号： H05K3/00
CPC分类号： H05K3/0008 , B25J9/1697 , G05B2219/40425 , G05B2219/40476 , G05B2219/45235 , G05B2219/49154 , H05K3/0005 , H05K13/0469 , H05K13/0853 , H05K2203/0736 , H05K2203/163 , Y10S901/43
摘要： Systems and methods for dispensing a liquid or viscous material onto a substrate are disclosed herein. One exemplary method of positioning an applicator of a dispensing system to apply a liquid or viscous material to an electronic substrate includes generating a two-dimensional image of the electronic substrate using a camera communicatively connected to the dispensing system. Based on the two-dimensional image of the electronic substrate, a first set of one or more sub-regions of the electronic substrate having one or more components that protrude above the surface of the electronic substrate is identified. The method further includes using height information relating to the one or more sub-regions having the one or more components to determine a control program for the dispensing system to position the applicator relative to the electronic substrate and dispense the liquid or viscous material onto the electronic substrate.

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