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1. 发明授权

US06785008B2 Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus 失效
标题翻译：用于测量零件安装装置的偏移的板，以及用于测量零件安装装置的偏移的方法
公开(公告)号：US06785008B2
公开(公告)日：2004-08-31
申请号：US09931413
申请日：2001-08-17
申请人： Hiroshi Uchiyama , Tetsutarou Hachimura , Osamu Okuda , Noriaki Yoshida
发明人： Hiroshi Uchiyama , Tetsutarou Hachimura , Osamu Okuda , Noriaki Yoshida
IPC分类号： G01O2100
CPC分类号： H05K3/0008 , H05K1/0269 , H05K3/303 , H05K13/08 , H05K2201/09918 , H05K2201/10204
摘要： An offset measuring board is formed of a rectangular metal plate which can be positioned at a component mounting position by a positioning device and which has at least in proximity to one corner portion thereof a recognition through hole, serving as a recognition mark, having a black bottom face within a recessed portion.
摘要翻译：偏移测量板由矩形金属板形成，该矩形金属板可以通过定位装置定位在部件安装位置处，并且至少具有一个角部，其具有用作识别标记的识别通孔，具有黑色凹陷部分内的底面。

2. 发明申请

US20060053624A1 Method and equipment for mounting part 审中-公开
标题翻译：安装零件的方法和设备
公开(公告)号：US20060053624A1
公开(公告)日：2006-03-16
申请号：US10523262
申请日：2003-08-06
申请人： Takashi Maeda , Osamu Okuda , Hiroshi Uchiyama , Takashi Yazawa , Hiroaki Imagawa , Yosuke Nagasawa , Wataru Hirai , Makoto Nakashima , Naoto Kouketsu
发明人： Takashi Maeda , Osamu Okuda , Hiroshi Uchiyama , Takashi Yazawa , Hiroaki Imagawa , Yosuke Nagasawa , Wataru Hirai , Makoto Nakashima , Naoto Kouketsu
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0409 , H05K13/082 , Y10T29/49004 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53191
摘要： The present invention is to provide a method and an apparatus for mounting components having a feature of detecting with high accuracy component pick up failure by the nozzle at component pick up stage, and/or component carrying back by the nozzle at component mounting stage. Achieved vacuum pressure is initialized to zero after completion of component pick up by the nozzle 25, and vacuum pressure decrease of the nozzle 25 is detected from the initialized zero point. If the detected value is bigger than the predetermined threshold, it may be judged that at least one of the nozzles failed to pick up a component. The failed nozzle may be identified by using a component recognition device 37. Blowing air blow volume flowing through the nozzle 25 is measured upon completion of component mounting. If the blowing air flow is smaller that the predetermined threshold, it is judged that the nozzle 25 carries back a component 30. Two thresholds may be used, and it may be judged that the component has been properly mounted if the measurement value is bigger than both thresholds, filter 22 is clogged if the measurement value is in between the two thresholds, and the nozzle 25 carries back the component if the measurement value is smaller than both thresholds.
摘要翻译：本发明提供一种用于安装部件的方法和装置，其具有在部件拾取阶段由喷嘴以高精度的部件拾取故障检测的特征，和/或在部件安装阶段由喷嘴承载的部件。在由喷嘴25完成部件拾取之后，实现真空压力初始化为零，并且从初始化的零点检测喷嘴25的真空压力降低。如果检测值大于预定阈值，则可以判断出至少一个喷嘴未能拾取部件。可以通过使用部件识别装置37来识别故障喷嘴。在部件安装完成时测量流经喷嘴25的吹气量。如果吹送空气流量小于预定阈值，则判断喷嘴25承载组件30。如果测量值大于两个阈值，则可以使用两个阈值，并且如果测量值大于两个阈值，则可以判断该部件已正确安装，如果测量值在两个阈值之间，则过滤器22被堵塞，并且喷嘴25承载如果测量值小于两个阈值，则分量。

3. 发明授权

US06581282B2 Apparatus for mounting electronic components 有权
公开(公告)号：US06581282B2
公开(公告)日：2003-06-24
申请号：US10071104
申请日：2002-02-11
申请人： Kazuo Mori , Osamu Okuda , Hiroshi Uchiyama , Akira Kabeshita
发明人： Kazuo Mori , Osamu Okuda , Hiroshi Uchiyama , Akira Kabeshita
IPC分类号： H05K334
CPC分类号： B23K3/082 , B23K2101/40 , H05K3/3484 , H05K3/3489 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49197 , Y10T29/53178 , Y10T29/53183
摘要： A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, the time required for moving the nozzles up and down is shortened and a total cycle time is reduced, so that production efficiency is improved.

4. 发明授权

US06389683B1 Apparatus and method for mounting electronic component 有权
标题翻译：电子元件安装装置及方法
公开(公告)号：US06389683B1
公开(公告)日：2002-05-21
申请号：US09414960
申请日：1999-10-12
申请人： Kazuo Mori , Osamu Okuda , Hiroshi Uchiyama , Akira Kabeshita
发明人： Kazuo Mori , Osamu Okuda , Hiroshi Uchiyama , Akira Kabeshita
IPC分类号： B23P1900
CPC分类号： B23K3/082 , B23K2101/40 , H05K3/3484 , H05K3/3489 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49197 , Y10T29/53178 , Y10T29/53183
摘要： A solvent transfer unit is made a slide type and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer the flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, a time for moving the nozzles up, down is shortened and a total cycle time is reduced, so that production efficiency is improved.
摘要翻译：溶剂转印单元被制成滑动型，并且在头部具有多个喷嘴，吸附和保持部件同时向下移动以将焊剂转移到电子部件。与通过具有旋转式溶剂转移单元的传统电子部件安装装置一个接一个地降低喷嘴的转印操作的电子部件安装方法相比，缩短了向上，向下移动喷嘴的时间，并且总周期时间缩短，生产效率提高。

5. 发明授权

US06948232B1 Component recognizing method and apparatus, and component mounting method and apparatus 失效
标题翻译：元件识别方法和装置以及元件安装方法和装置
公开(公告)号：US06948232B1
公开(公告)日：2005-09-27
申请号：US10069988
申请日：2000-08-31
申请人： Takashi Yazawa , Hiroshi Uchiyama , Atsushi Tanabe , Yoichi Tanaka , Takahiro Kurokawa , Naoto Mimura , Nobuyuki Kakita , Osamu Okuda
发明人： Takashi Yazawa , Hiroshi Uchiyama , Atsushi Tanabe , Yoichi Tanaka , Takahiro Kurokawa , Naoto Mimura , Nobuyuki Kakita , Osamu Okuda
IPC分类号： H05K13/04 , H05K13/08 , B23P19/00
CPC分类号： H05K13/0452 , H05K13/041 , H05K13/0812 , Y10T29/49131 , Y10T29/53174 , Y10T29/53178
摘要： Disclosed are a component recognizing method and apparatus, and a component mounting method and apparatus, by which components with various heights held by a plurality of nozzles can be recognized continuously. The drive of a head is transmitted to nozzles, with surfaces to be recognized of components being controlled so as to be positioned in a recognizable range during respective recognizing operations of the components, and a continuous recognition is thereby made possible. The adjustment of heights of the surfaces to be recognized during the recognizing operations of the components is achieved by one drive unit and a plurality of drive transmitting units.
摘要翻译：公开了能够连续识别由多个喷嘴保持的各种高度的部件的部件识别方法和装置以及部件安装方法和装置。头部的驱动传递到喷嘴，其中被识别的部件的表面被控制以便在部件的相应识别操作期间被定位在可识别的范围内，从而使得可以进行连续的识别。通过一个驱动单元和多个驱动传递单元来实现在部件的识别操作期间要识别的表面的高度的调节。

6. 发明授权

US06681468B1 Device and method for mounting parts 失效
标题翻译：安装零件的装置和方法
公开(公告)号：US06681468B1
公开(公告)日：2004-01-27
申请号：US10129190
申请日：2002-05-02
申请人： Hiroshi Uchiyama , Hirofumi Obara , Naoto Mimura , Osamu Okuda , Akira Kabeshita
发明人： Hiroshi Uchiyama , Hirofumi Obara , Naoto Mimura , Osamu Okuda , Akira Kabeshita
IPC分类号： B23Q1700
CPC分类号： H05K13/0015 , H05K13/0478 , Y10T29/49764 , Y10T29/4978 , Y10T29/53178
摘要： A component mounting apparatus and method allows for components supplied from component supplying members to be simultaneously or continuously held by component holding members without being affected by positional displacements of the component holding members relative to a head, a positional displacement of the component supplying members or the like. With a positional displacement amount (&Dgr;y) along a Y direction relative to a reference position of a nozzle taken into account, at a component supply cassette, driving a motor for moving components one by one along the Y direction to a component supply position is controlled, thereby positionally adjusting a component at the component supply position and absorbing the positional displacement amount.
摘要翻译：部件安装装置和方法允许从部件供给部件供给的部件由部件保持部件同时或连续地保持，而不受部件保持部件相对于头部的位置偏移的影响，部件供给部件的位置偏移或喜欢。利用相对于考虑到的喷嘴的基准位置的Y方向的位置偏移量（Deltay），在部件供给盒处，控制将沿着Y方向逐个移动部件的电动机驱动到部件供给位置，从而位置地调整部件供给位置处的部件并吸收位置偏移量。

7. 发明授权

US06519838B1 Component mounting apparatus 失效
标题翻译：组件安装设备
公开(公告)号：US06519838B1
公开(公告)日：2003-02-18
申请号：US09515498
申请日：2000-02-29
申请人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
发明人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
IPC分类号： B23P1900
CPC分类号： H05K13/0409 , Y10T29/49131 , Y10T29/53087 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261
摘要： A component mounting apparatus includes a board transfer section for carrying in circuit boards to a component mounting position and carrying out the circuit board after component-mounting operation. A component feed section is provided for feeding, to a specified position, a component to be mounted onto the circuit board, and a component mounting section is provided for loading a suction nozzle matching the component to be mounted, sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. A controller is provided for controlling operations of the individual sections is order to execute a productional operation of component-mounting onto the circuit boards. Also, a remaining-component discarding device performs an operation of discarding a component which remains at the suction nozzle during a time period following the component-mounting operation while the component mounting section is kept halted.
摘要翻译：部件安装装置包括：板部件传送部，用于在部件安装位置上承载电路板，并在部件安装操作之后执行电路板。提供了一个部件供给部分，用于将一个要安装到电路板上的部件供给到一个特定的位置;一个部件安装部分，用于装载一个与待安装部件相匹配的吸嘴，从部件上吸取部件进给部分并将组件移动到安装位置，并将组件安装在电路板的指定位置。提供用于控制各个部分的操作的控制器是为了执行部件安装到电路板上的生产操作。此外，剩余部件丢弃装置在部件安装部分被停止的同时，在部件安装操作之后的时间段期间执行废弃在吸嘴处残留的部件的操作。

8. 发明申请

US20050125998A1 Electronic part mounting device and method 失效
标题翻译：电子零件安装装置及方法
公开(公告)号：US20050125998A1
公开(公告)日：2005-06-16
申请号：US10503497
申请日：2003-02-06
申请人： Naoto Mimura , Izumi Miura , Hirofumi Obara , Hiroshi Uchiyama , Kobuyuki Kakita , Kazunori Kanai , Osamu Okuda , Akira Kabeshita
发明人： Naoto Mimura , Izumi Miura , Hirofumi Obara , Hiroshi Uchiyama , Kobuyuki Kakita , Kazunori Kanai , Osamu Okuda , Akira Kabeshita
IPC分类号： H05K13/04 , H05K13/08 , H05K3/30
CPC分类号： H05K13/0413 , H05K13/0853 , Y10T29/4913 , Y10T29/49144 , Y10T29/5137 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178
摘要： An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.
摘要翻译：提供了一种用于安装电子部件的装置和方法，其缩短了安装所需的周期时间，并且使部件安装机器布置在小的区域中。提供了一种控制器，使得对第二部件馈送器执行用于第二电子部件的退避控制，以便如果第一电子部件或部件保持器干扰第二部件馈送器的第二电子部件，则避免干扰，因为的安装头的运动。可以减少上下移动部件保持器所需的时间，并且消除了在移动安装头时无法沿着绕行移动的需要。可以缩短周期时间，最终可以降低成本。

9. 发明授权

US07003872B2 Electronic component mounting apparatus and method 失效
标题翻译：电子元件安装装置及方法
公开(公告)号：US07003872B2
公开(公告)日：2006-02-28
申请号：US10503497
申请日：2003-02-06
申请人： Naoto Mimura , Izumi Miura , Hirofumi Obara , Hiroshi Uchiyama , Nobuyuki Kakita , Kazunori Kanai , Osamu Okuda , Akira Kabeshita
发明人： Naoto Mimura , Izumi Miura , Hirofumi Obara , Hiroshi Uchiyama , Nobuyuki Kakita , Kazunori Kanai , Osamu Okuda , Akira Kabeshita
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0413 , H05K13/0853 , Y10T29/4913 , Y10T29/49144 , Y10T29/5137 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178
摘要： An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.
摘要翻译：提供了一种用于安装电子部件的装置和方法，其缩短了安装所需的周期时间，并且使部件安装机器布置在小的区域中。提供了一种控制器，使得对第二部件馈送器执行用于第二电子部件的退避控制，以便如果第一电子部件或部件保持器干扰第二部件馈送器的第二电子部件，则避免干扰，因为的安装头的运动。可以减少上下移动部件保持器所需的时间，并且消除了在移动安装头时无法沿着绕行移动的需要。可以缩短周期时间，最终可以降低成本。

10. 发明授权

US06868603B2 Method of mounting component on circuit board 失效
标题翻译：组件安装在电路板上的方法
公开(公告)号：US06868603B2
公开(公告)日：2005-03-22
申请号：US10076300
申请日：2002-02-19
申请人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
发明人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0409 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191
摘要： A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting operation includes sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. Also, a remaining-component discarding operation is performed to discard a component which remains at the suction nozzle during a specified time period following the component-mounting operation while the component mounting operation is stopped.
摘要翻译：一种部件安装方法，其包括在部件安装位置上携带电路板并在部件安装操作之后执行电路板。部件安装操作包括从部件供给部分吸取部件并将部件移动到安装位置，并将部件安装在电路板的指定位置。此外，在部件安装操作停止的同时，在部件安装操作之后的指定时间段内执行剩余部件废弃操作以丢弃保留在吸嘴处的部件。

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