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    • 17. 发明授权
    • 멀티비트 메모리 소자
    • 多位存储器件
    • KR101429160B1
    • 2014-09-23
    • KR1020130071575
    • 2013-06-21
    • 한국과학기술원
    • 이희철김우영
    • H01L27/115H01L21/8247
    • G11C11/5657G11C11/56G11C13/025H01L21/28273B82Y10/00G11C11/22H01L21/28291
    • An embodiment of the present invention relates to a multi-bit memory element. According to the embodiment of the present invention, the memory element includes: a substrate; a first electrode placed on the substrate; a first memory part placed on the substrate and the first electrode containing an electrically polarizing material indicating hysteresis; a semiconductor part placed on the first memory part; a source electrode placed on a side of the semiconductor part; a drain electrode placed on the other side of the semiconductor part; a second memory part placed on the semiconductor part, placed between the source electrode and the drain electrode containing the electrically polarizing material indicating hysteresis; and a second electrode placed on the second memory part. When a first operating voltage is applied to the first electrode and a second operating voltage is not applied to the second electrode, a current I_D1 flows in the semiconductor part. When the first operating voltage is not applied to the first electrode and the second operating voltage is applied to the second electrode, a current I_D2 flows in the semiconductor part. When the first operating voltage is applied to the first electrode and the second operating voltage is applied to the second electrode, a current I_D3 (I_D1+I_D2) flows in the semiconductor part and the current I_D1 is larger than the current I_D2.
    • 本发明的实施例涉及一种多位存储元件。 根据本发明的实施例,存储元件包括:基板; 放置在基板上的第一电极; 放置在基板上的第一存储器部分和包含表示磁滞的电极化材料的第一电极; 放置在第一存储器部分上的半导体部件; 位于所述半导体部件侧的源电极; 放置在所述半导体部件的另一侧的漏电极; 放置在半导体部分上的第二存储器部分,放置在包含指示滞后的电极化材料的源电极和漏电极之间; 以及放置在第二存储器部分上的第二电极。 当向第一电极施加第一工作电压并且第二工作电压不施加到第二电极时,电流I_D1在半导体部件中流动。 当第一工作电压不施加到第一电极并且第二工作电压施加到第二电极时,电流I_D2流入半导体部件。 当第一工作电压被施加到第一电极并且第二工作电压被施加到第二电极时,电流I_D3(I_D1 + I_D2)在半导体部分中流动,并且电流I_D1大于当前I_D2。
    • 20. 发明公开
    • 강유전체 소자를 적용한 반도체 메모리 장치 및 그리프레쉬 방법
    • 使用微波器件的半导体存储器件及其刷新方法
    • KR1020080061236A
    • 2008-07-02
    • KR1020070065034
    • 2007-06-29
    • 에스케이하이닉스 주식회사
    • 강희복홍석경
    • G11C11/22G11C11/401G11C11/406
    • G11C11/223G11C11/2273G11C11/2275G11C11/401G11C11/5657H01L27/11585
    • A semiconductor memory device using a ferroelectric device and a refresh method thereof are provided to improve data retention characteristics without losing refresh information when DRAM is turned off. A semiconductor memory device includes a channel region formed on a substrate(1), a drain region and a source region formed on both ends of the channel region, a ferroelectric layer(4) formed on the channel region and a word line formed on the ferroelectric layer. The semiconductor memory device includes a 1-T(One-Transistor) FET(Field Effect Transistor) type memory cell inducing different channel resistance in the channel region according to polarity state of the ferroelectric layer. A left-n bit storing part(10) stores left-n bit data applied through a first drain/source region. A right-n bit storing part(20) stores right-n bit data applied through a second drain/source region. Read operation of 2n-bit data is performed by sensing a cell sensing current value varying according to polarity state of the ferroelectric layer when a read voltage is applied to the word line and a sensing bias voltage is applied to one of the first and the second drain/source region. Write operation of 2n-bit data is performed by changing polarity of the ferroelectric layer according to the voltage applied to the word line and the first and the second drain/source region. A ground voltage is applied to the other region of the first drain/source region and the second drain/source region.
    • 提供一种使用铁电元件的半导体存储器件及其刷新方法,以在DRAM关闭时不会丢失刷新信息来提高数据保持特性。 半导体存储器件包括形成在沟道区两端的衬底(1),漏区和源极区上形成的沟道区,形成在沟道区上的铁电层(4)和形成在沟道区上的字线 铁电层。 半导体存储器件包括根据铁电层的极性状态在沟道区域中引起不同沟道电阻的1-T(单晶体管)FET(场效应晶体管)型存储单元。 左n位存储部分(10)存储通过第一漏极/源极区域施加的左n位数据。 右n位存储部(20)存储通过第二漏/源区施加的右n位数据。 当对字线施加读取电压时,通过感测根据强电介质层的极性状态变化的单元感应电流值来进行2n位数据的读取操作,并且感测偏置电压施加到第一和第二 排水/源区。 通过根据施加到字线和第一和第二漏极/源极区域的电压来改变铁电层的极性来执行2n位数据的写入操作。 接地电压施加到第一漏极/源极区域和第二漏极/源极区域的另一个区域。