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    • 16. 发明公开
    • 시편의 표면 계측 방법
    • 测量图案表面的方法
    • KR1020080067436A
    • 2008-07-21
    • KR1020070004712
    • 2007-01-16
    • 삼성전자주식회사
    • 신영곤강민섭김종덕안병설이병암정경호
    • G01B11/30G01B11/25
    • G01B11/30G01N21/8806G01N21/956
    • A method for measuring a specimen surface is provided to maximize production yield by reducing weight of distorted information corresponding to an upper surface of a pattern relative to information corresponding to both side walls of the pattern. A method for measuring a specimen surface(200) comprises the steps of: allowing first incident light(201) to be incident into the specimen formed with an arbitrary pattern in a first direction(S1); detecting first diffraction light(202) diffracted in the specimen to be incident by the first incident light(S2); allowing second incident light(203) in a second direction opposite to the first direction to be incident into the specimen; detecting second diffraction light(204) diffracted in the specimen(S3); and comparing information corresponding to the first diffraction light and the second diffraction light respectively with each other, and judging if both side walls of the pattern are parallel to each other in the first direction and the second direction when the information is the same or similar(S4).
    • 提供了一种用于测量样品表面的方法,以通过相对于对应于图案的两个侧壁的信息减小对应于图案的上表面的失真信息的重量来最大化生产产量。 一种测量样本表面(200)的方法包括以下步骤:使第一入射光(201)入射到沿第一方向(S1)以任意图形形成的样本中; 检测在所述样本中衍射的第一衍射光(202)以入射所述第一入射光(S2); 允许在与第一方向相反的第二方向上的第二入射光(203)入射到样品中; 检测在所述试样(S3)中衍射的第二衍射光(204); 以及将与第一衍射光和第二衍射光相对应的信息彼此分别进行比较,并且当信息相同或相似时,判断图案的两个侧壁是否在第一方向和第二方向上彼此平行( S4)。
    • 18. 发明公开
    • 실리콘웨이퍼의 결함 검출 방법 및 이를 수행하기 위한장치
    • 检测硅基板缺陷的方法及其设备
    • KR1020080000303A
    • 2008-01-02
    • KR1020060058003
    • 2006-06-27
    • 삼성전자주식회사
    • 사공정정경호이병암안병설김종덕김경범
    • H01L21/66
    • G01N21/9503G01N21/8422G01N2021/8433
    • A method of detecting defects in a silicon substrate and an apparatus for performing the same are provided to identify grating defects of a silicon wafer by using a light emitting image of fluorescent materials. A silicon wafer(W) is loaded on a chuck(110) within a process chamber(100). An edge part of the silicon wafer is coated by using fluorescent materials having different coating characteristics at a defective grating part and a normal grating part of the silicon wafer. A light emitting image of a silicon wafer edge part is obtained by irradiating light onto the silicon wafer edge part coated with the fluorescent materials. A grating defect of the silicon wafer edge part is detected by identifying a coating state of the fluorescent materials of the light emitting image.
    • 提供了一种检测硅衬底中的缺陷的方法及其执行装置,以通过使用荧光材料的发光图像来识别硅晶片的光栅缺陷。 硅晶片(W)装载在处理室(100)内的卡盘(110)上。 通过使用在硅晶片的缺陷光栅部分和普通光栅部分处具有不同涂层特性的荧光材料来涂覆硅晶片的边缘部分。 通过将光照射到涂覆有荧光材料的硅晶片边缘部分上来获得硅晶片边缘部分的发光图像。 通过识别发光图像的荧光材料的涂布状态来检测硅晶片边缘部分的光栅缺陷。
    • 19. 发明公开
    • 웨이퍼 수납용 캐리어.
    • 散热器
    • KR1020070076208A
    • 2007-07-24
    • KR1020060005303
    • 2006-01-18
    • 삼성전자주식회사
    • 이경순정경호이병암
    • B65D85/48B65D85/42B65D85/38H01L21/68
    • A wafer carrier is provided to reduce breakage, scratches, and particles of a wafer by easily loading the wafer of 12 inches to the normal position and to improve the yield rate of semiconductor devices. The wafer carrier(100) is composed of a container(102) having an opened front side and an inner space for containing wafers; a cover(104) installed on an inner wall of the container and equipped with plural slot members(106) provided with round end portions and arranged on both sides in a line so as to form a space to which the wafers are fitted; and a door(108) for covering the front side of the container. A gap between the slot members is wider than the thickness of the wafer.
    • 提供晶片载体以通过容易地将12英寸的晶片加载到正常位置并提高半导体器件的屈服率来减少晶片的断裂,划痕和颗粒。 晶片载体(100)由具有开口前侧的容器(102)和用于容纳晶片的内部空间构成; 安装在所述容器的内壁上并配备有多个槽构件(106)的盖(104),所述多个槽构件(106)设置有圆形端部并且布置在两侧的一条线上,以形成所述晶片安装的空间; 以及用于覆盖容器前侧的门(108)。 狭缝构件之间的间隙比晶片的厚度宽。