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    • 1. 发明专利
    • Cooling device for electronic component
    • 电子元件冷却装置
    • JP2005085998A
    • 2005-03-31
    • JP2003316868
    • 2003-09-09
    • Nippon Soken IncToyota Motor Corpトヨタ自動車株式会社株式会社日本自動車部品総合研究所
    • HIRASAWA NAOKIMATSUI HIROHITOARAI YOSHIHIDE
    • F25D9/00H01L23/473H05K7/20
    • H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/1301H01L2924/00014H01L2924/00
    • PROBLEM TO BE SOLVED: To provide the cooling device of electronic components which is superior in heat radiating efficiency in a simple device configuration. SOLUTION: This electronic component cooling system is provided with a distributing tube 100 for distributing cooling water to a flat fin tube 110, a plurality of flat fin tubes 110 arranged so as to be lined with preliminarily decided first intervals and second interval, a manifold 120 for collecting the cooling water from the flat fin tubes 110, a semiconductor module 200 for double-side cooling which are the objects to be cooled arranged in the first intervals and corrugate fins 400 arranged in the second intervals. The flat fin tubes 110 and the corrugate fins 400 are configured, to develop elastic forces to make the flat fin tubes 110 adhere to the semiconductor modules 200 for double-side cooling and elastic forces to adhere the flat fin tubes 110 to the corrugate fins 400. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供在简单的装置结构中散热效率优异的电子部件的冷却装置。 解决方案:该电子部件冷却系统设置有用于将冷却水分配到扁平翅片管110的分配管100,布置成预先确定的第一间隔和第二间隔的多个扁平翅片管110, 用于从扁平翅片管110收集冷却水的歧管120,用于双侧冷却的半导体模块200,其是以第一间隔布置的待冷却对象,并且以第二间隔布置的波纹翅片400。 扁平翅片管110和波纹翅片400被构造成产生弹性力以使扁平翅片管110粘附到用于双侧冷却的半导体模块200并且将扁平翅片管110粘附到波纹翅片400上的弹性力 (C)2005,JPO&NCIPI