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1. 发明专利

JP2001096457A POLISHING DEVICE AND ADJUSTING METHOD FOR POLISHING DEVICE 失效
公开(公告)号：JP2001096457A
公开(公告)日：2001-04-10
申请号：JP27526299
申请日：1999-09-28
申请人： TOSHIBA MICRO ELECTRONICS , TOSHIBA CORP
发明人： YAJIMA HIROMI , SHIGETA KENICHI , KOJIMA YASUHISA , IGUCHI KOJI
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and its adjusting method, capable of facilitating the replacement of a cushioning material layer when the polishing device is to be adjusted, and of being high in operating performance, and in yield in wafer manufacture without generating polishing scraps by boring holes in the cushioning material layer. SOLUTION: In this invention, the wafer supporting part of a polishing device is furnished with a flat plate part 5 having back pressure gas introducing holes 7 and 8 introducing back pressure gas into a wafer 4, and with a cushioning material layer 6, and it is characteristic that the back pressure gas introducing hole 8 provided for the cushioning material layer 6 is greater in cross sectional area than the back pressure gas introducing hole 7 provided for the flat plate part 5.

2. 发明专利

JP2006191030A Polishing machine 有权
标题翻译：抛光机
公开(公告)号：JP2006191030A
公开(公告)日：2006-07-20
申请号：JP2005363897
申请日：2005-12-16
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： H01L21/304 , B24B37/04 , B24B55/06 , B65G49/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing machine which can be installed in a clean room that can efficiently prevent contamination. SOLUTION: The polishing machine is provided with a loading/unloading block 7 for the delivery of a cassette 13 housing a wafer 16, a carrier block 8 for moving the wafer 16 from the cassette 13, a polishing block 6 for polishing the wafer 16, a cleaning block 9 for cleaning and drying the wafer 16 after polishing, and a control block 10 for controlling the operation of the machine by forming a ceiling and surrounding wall plates so as to surround the whole of the blocks to constitute a box. The wafer 16 is polished by the polishing block 6, and the polished wafer 16 is moved from the polishing block 6 to the cleaning block 9. Then the wafer 16 is cleaned and dried, and then taken out of the polishing machine. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以安装在可以有效防止污染的洁净室中的抛光机。解决方案：抛光机设置有用于传送容纳晶片16的盒13的装载/卸载块7，用于从盒13移动晶片16的载体块8，用于抛光晶片16的抛光块6 晶片16，用于在抛光之后清洁和干燥晶片16的清洁块9，以及用于通过形成天花板和围绕壁板来围绕整个块以构成盒子来控制机器的操作的控制块10 。抛光块6抛光晶片16，抛光晶片16从抛光块6移动到清洁块9.然后将晶片16清洗干燥，然后从抛光机中取出。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005101633A Polishing device 审中-公开
标题翻译：抛光装置
公开(公告)号：JP2005101633A
公开(公告)日：2005-04-14
申请号：JP2004319186
申请日：2004-11-02
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： OMICHI TAKASHI , TOGAWA TETSUJI , NISHI TOYOMI , YAJIMA HIROMI , IMOTO YUKIO , KODAMA SHOICHI , AOKI RIICHIRO
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device adapted for blocking, superior in productivity, expandability, maintainability and correspondency to users, and also efficient in cooperation with incidental devices. SOLUTION: The polishing device is adapted for polishing a wafer 1. The polishing device comprises a load/unload block 5 that delivers and receives a cassette 2 with the wafer 1 received in, a conveying block 6 that transports the wafer 1, a polishing block 7 adapted to polish the wafer 1, a cleaning block 8 adapted to clean the polished wafer 1, and a control block 9 that memorizes, through teaching, the relative position between the cassette 2 in the load/unload block 5 and a robot 15 in the conveying block 6. Control devices are arranged in respective blocks, and the polishing device is provided with any one of a grinding-liquid feeder 31, a waste-liquid treating device 32, a cooling-water feeder 33, and a warm-water feeder 34. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供适于阻挡，优异的生产率，可扩展性，可维护性和与用户对应的抛光装置，并且还能够与附带的装置配合使用。抛光装置适于抛光晶片1.抛光装置包括装载/卸载块5，其承载并接收晶片1所接收的盒2，输送块6的输送块6，适于抛光晶片1的抛光块7，适于清洁抛光晶片1的清洁块8，以及通过教导存储装载/卸载块5中的盒2之间的相对位置的控制块9和机器人15在输送块6中。控制装置布置在相应的块中，并且抛光装置设置有研磨液供给器31，废液处理装置32，冷却水供给器33和温水送料器34.版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2002141317A METHOD AND DEVICE FOR POLISHING 审中-公开
公开(公告)号：JP2002141317A
公开(公告)日：2002-05-17
申请号：JP2001287908
申请日：2001-09-20
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , AOKI RIICHIRO , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIRO , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device which can adopt a cluster structure and has a means for handling a polishing object such as a clean semiconductor wafer and a means for handling a dirty polishing object separately, and a polishing method. SOLUTION: In the polishing device, after a polishing object S is carried in and polished, it is washed and a clean polishing object S is carried out. It has a center robot 10 which carries the polishing object S, a load part 11 which is a load part for mounting the polishing object S to be polished and is disposed in an attainable range of the center robot 10, at least one polishing part 13 which polishes the polishing object S carried from the load part 11, at least one washing part 15 which washes the polished polishing object S, and an unload part 12 which is an unload part for mounting the washed clean polishing object S and is disposed in an attainable range of a holding arm of the center robot 10.

5. 发明专利

JPH09295262A POLISHING DEVICE 失效
公开(公告)号：JPH09295262A
公开(公告)日：1997-11-18
申请号：JP13098796
申请日：1996-04-26
申请人： EBARA CORP , TOSHIBA CORP
发明人： TOGAWA TETSUJI , YAMAGUCHI KUNIAKI , SAKURAI KUNIHIKO , YAJIMA HIROMI
IPC分类号： B24B53/017 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To install in a narrow space and make maintenance easy. SOLUTION: A polishing device is provided with a top ring 35 for holding a polishing subject to its lower surface, a turn table 33 having a polishing surface 34 for polishing the surface of the polishing subject held by the top ring 35 and a dressing tool 39 for regenerating the polish surface 34 by contacting with the polish surface 34 of the turn table 33. The polish surface 34 of the turn table 33, the maintenance position of the top ring 35 and the maintenance position of the dressing tool 39 are arranged so as to be approached to one side A of the room 45 for storing a polishing device 30. Thereby, the maintenance for the polish surface 34 of the turn table 33, the top ring 35 and the dressing tool 39 are carried out from one side A (maintenance face) in all cases.

6. 发明专利

JPH0970751A POLISHING DEVICE 失效
公开(公告)号：JPH0970751A
公开(公告)日：1997-03-18
申请号：JP25454995
申请日：1995-09-06
申请人： EBARA CORP , TOSHIBA CORP
发明人： SAKURAI KUNIHIKO , TOGAWA TETSUJI , NISHI TOYOMI , KATSUOKA SEIJI , YAJIMA HIROMI , KODERA MASAKO
IPC分类号： B24B37/013 , B24B37/04 , B24B49/04 , B24B49/16 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To detect accurate torque without causing a problem of the occurrence of dust by incorporating a turn table and/or a torque detector which detects output torque of a drive motor of a top ring in a timing pulley on a drive side. SOLUTION: When power is transmitted to a boss 9 due to the rotation of an output shaft of a motor for driving turn table, a distortion occurs in a detection section 11 between a section to be driven 10 which is connected with a timing pulley on which load is applied and it, and the measurement is done by using a strain gauge in which the detection section 11 is built to convert the measured distortion into an electrical signal. Moreover, the electrical signal which corresponds to the measured distortion is transmitted to an external signal processing device through a cable 12 by a contact method due to a slip ring, is converted into torque, and is displayed or recorded in a display gauge and a recorder.

7. 发明专利

JP2009272655A Polishing apparatus 有权
标题翻译：抛光装置
公开(公告)号：JP2009272655A
公开(公告)日：2009-11-19
申请号：JP2009190599
申请日：2009-08-20
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus which can be installed in a clean room capable of efficiently preventing contaminations. SOLUTION: The polishing apparatus is provided with a polishing block 6 for polishing a target to be polished, a cleaning block 9 for cleaning and drying the target after polishing, a transporter 8 for transporting the polished target from the polishing block 6 to the cleaning block 9, a first chamber 27 wherein the polishing block 6 is disposed, and a second chamber 26 wherein the transporter 8 and the cleaning block 9 are disposed. The polishing block 6 has a cleaner which includes a turnable 23 and a top ring 22 for supporting the target on the turnable 23 and roughly cleans the polished target on the top ring 22. After being roughly cleaned, the target is removed from the top ring 22 and then is transported to the cleaning block 9 by the transporter 8 and is cleaned and dried in the cleaning block 9. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以安装在能够有效防止污染的洁净室中的抛光装置。解决方案：抛光装置设置有用于抛光抛光对象物的抛光块6，抛光后清理和干燥靶材的清洁块9，用于将抛光对象从抛光块6传送到清洁块9，其中设置有抛光块6的第一室27和其中设置有运送器8和清洁块9的第二室26。抛光块6具有清洁器，其包括可转动23和用于将目标物支撑在可转动件23上的顶环22，并大致清洁顶环22上的抛光目标。在粗略清洁之后，将靶从顶环 22，然后通过运送器8运送到清洁块9，并在清洁块9中进行清洁和干燥。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2003220556A POLISHING APPARATUS AND METHOD 审中-公开
公开(公告)号：JP2003220556A
公开(公告)日：2003-08-05
申请号：JP2003016795
申请日：2003-01-24
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , AOKI RIICHIRO , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIRO , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC分类号： B24B37/04 , B65G49/07 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus, which polishes an object to be polished, and cleans and drys it, then transfers out the object that is clean and dry. SOLUTION: The polishing apparatus comprises a robot 10 for transferring the object S in the apparatus; a loading section 11, in which the object S to be polished is placed and which is arranged within reach of the gripping arm of the robot 10; a polishing section 13 in which the object S transferred thereto from the load section 11 is polished; a cleaning section 15 in which the polished object S is cleaned and dried; and an unloading section 12 in which the object S, clean and dry after having been polished, is placed and which is arranged within reach of the gripping arm of the robot 10. The robot 10 can pick the object S to be polished out of the loading section 11 and transfer the object S, which is polished, cleaned, and dried, to the unloading section 12. COPYRIGHT: (C)2003,JPO

9. 发明专利

JP2002184735A SEMICONDUCTOR WAFER-POLISHING DEVICE AND METHOD THEREFOR 审中-公开
公开(公告)号：JP2002184735A
公开(公告)日：2002-06-28
申请号：JP2001363793
申请日：2001-11-29
申请人： EBARA CORP , TOSHIBA CORP
发明人： SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , KODERA MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer-polishing device that can be installed in a clean room, and can be unloaded to a next process by a wafer carrier that is used in a normal clean room after cleaning and drying the semiconductor wafer after polishing without causing the clean room to be contaminated, and to provide a method for polishing the semiconductor wafer. SOLUTION: A polishing section 2 for polishing the semiconductor wafer 4 by retaining the semiconductor wafer in an enclosure 1 having a sidewall by top ring 5 and at the same time pressing the semiconductor wafer to a turntable 3, and a washing section 30 for washing the semiconductor wafer 4 are housed. A partition wall 22 for separating the polishing section 2 from the cleaning section 30 is provided, and at the same time a transport mechanism 24 is provided to carry the semiconductor wafer 4 after polishing from the polishing section 2 to the cleaning section 30 via an opening 22a of the partition wall 22, and exhaust systems 46 and 47 are provided to evacuate air independently from the polishing section 2 and the cleaning section 30.

10. 发明专利

JPH10340870A POLISHING APPARATUS 失效
公开(公告)号：JPH10340870A
公开(公告)日：1998-12-22
申请号：JP16515297
申请日：1997-06-06
申请人： EBARA CORP , TOSHIBA CORP
发明人： AIZAWA HIDEO , ITO KENYA , YAJIMA HIROMI , SHIGETA KENICHI , TATEYAMA YOSHIKUNI
IPC分类号： H01L21/677 , H01L21/304 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide highly clean products by suppressing the increase of facilities and running costs, and preventing mutual pollution at each step. SOLUTION: In a polishing equipment providing polishing units 10a and 10b. For chemically and mechanically polishing the surface of materials to be polished, cleaning units 26a, 26b and 26c for cleaning the polished materials, and transfer units 20a and 20b for transferring the materials to be polished between the units 26a, 26b and 26c, a space housing each unit are partitioned according to the degree of cleanliness for constructing a plurality of chambers R1 to R4 , and a transfer gate 18, having temporary chambers 18a and 18b for temporarily storing the materials to be polished are provided between the chambers.

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